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C1410NCOA713中文资料

C1410NCOA713中文资料
C1410NCOA713中文资料

M TC1410/TC1410N

Features

?Latch-Up Protected: Will Withstand 500mA Reverse Current

?Input Will Withstand Negative Inputs Up to 5V ?ESD Protected: 4kV

?High Peak Output Current: 0.5A

?Wide Input Supply Voltage Operating Range:

- 4.5V to 16V

?High Capacitive Load Drive Capability:

-500pF in 25nsec

?Short Delay Time: 30nsec Typ.

?Consistent Delay Times With Changes in Supply Voltage

?Matched Delay Times

?Low Supply Current

- With Logic ‘1’ Input: 500μA

- With Logic ‘0’ Input: 100μA

?Low Output Impedance: 16?

?Available in Space-Saving 8-pin MSOP Package ?Pinout Same as TC1411/TC1412/TC1413

Applications

?Switch Mode Power Supplies

?Line Drivers

?Pulse Transformer Drive

?Relay Driver General Description

The TC1410/TC1410N are 0.5A CMOS buffers/drivers. They will not latch-up under any conditions within their power and voltage ratings. They are not subject to damage when up to 5V of noise spiking of either polarity occurs on the ground pin. They can accept, without damage or logic upset, up to 500mA of current of either polarity being forced back into their output. All terminals are fully protected against up to 4kV of electrostatic discharge.

As MOSFET drivers, the TC1410/TC1410N can easily charge a 500pF gate capacitance in 25nsec with matched rise and fall times, and provide low enough impedance in both the ‘ON’ and ‘OFF’ states to ensure the MOSFET’s intended state will not be affected, even by large transients. The leading and trailing edge propagation delay times are also matched to allow driving short-duration inputs with greater accuracy. Package Type

8-Pin MSOP/PDIP/SOIC

1

2

3

4

V DD

5

6

7

8

OUT

GND

V DD

IN

NC

GND

OUT

T

C

1

4

1

NC = No Connection

26,7

Inverting

26,7

Non-Inverting

1

2

3

45

6

7

8

T

C

1

4

1

N

V DD

IN

NC

GND

V DD

OUT

GND

OUT

NOTE: Duplicate pins must be connected together for proper operation.

0.5A High-Speed MOSFET Drivers

2003 Microchip Technology Inc.DS21389C-page 1

TC1410/TC1410N

DS21389C-page 2 2003 Microchip Technology Inc.

Functional Block Diagram

Effective Input C = 10pF

TC1410N

Output

Input

GND

V DD

300mV

4.7V

Inverting Non-Inverting

Output

Output

TC1410

TC1410/TC1410N

1.0ELECTRICAL

CHARACTERISTICS

Absolute Maximum Ratings ?

Supply Voltage (20)

Input Voltage......................V DD + 0.3V to GND – 5.0V Power Dissipation (T A≤ 70°C) MSOP..........................................................340mW PDIP............................................................730mW SOIC............................................................470mW

Storage Temperature Range..............-65°C to +150°C

Maximum Junction Temperature......................+150°C

? Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.PIN FUNCTION TABLE

Symbol Description

V DD Supply input, 4.5V to 16V INPUT Control input

NC No connection

GND Ground

GND Ground

OUTPUT CMOS push-pull output,

common to pin 7 OUTPUT CMOS push-pull output,

common to pin 6

V DD Supply input, 4.5V to 16V

DC ELECTRICAL CHARACTERISTICS

Electrical Specifications: Unless otherwise noted, over operating temperature range with 4.5V ≤ V DD ≤ 16V. Typical values are measured at T A = +25°C, V DD= 16V.

Parameters Sym Min Typ Max Units Conditions

Input

Logic ‘1’, High Input Voltage V IH 2.0——V

Logic ‘0’, Low Input Voltage V IL——0.8V

Input Current I IN-1—1μA0V ≤ V IN ≤ V DD, T A = +25°C

-10—10-40°C ≤ T A ≤ +85°C

Output

High Output Voltage V OH V DD – 0.025——V DC Test

Low Output Voltage V OL——0.025V DC Test

Output Resistance R O—1622?V DD = 16V, I O = 10mA, T A = +25°C

—20280°C ≤ T A ≤ +70°C

—2028-40°C ≤ T A ≤ +85°C

Peak Output Current I PK—0.5—A V DD = 16V

Latch-Up Protection Withstand Reverse Current I REV—0.5—A Duty cycle ≤ 2%, t ≤ 300μsec,

V DD = 16V

Switching Time (Note1)

Rise Time t R—2535nsec T A = +25°C

—27400°C ≤ T A ≤ +70°C

—2940-40°C ≤ T A ≤ +85°C, Figure4-1 Fall Time t F—2535nsec T A = +25°C

—27400°C ≤ T A ≤ +70°C

—2940-40°C ≤ T A ≤ +85°C, Figure4-1 Delay Time t D1—3040nsec T A = +25°C

—33450°C ≤ T A ≤ +70°C

—3545-40°C ≤ T A ≤ +85°C, Figure4-1 Note1:Switching times ensured by design.

2003 Microchip Technology Inc.DS21389C-page 3

TC1410/TC1410N

DC ELECTRICAL CHARACTERISTICS (CONTINUED)

Electrical Specifications: Unless otherwise noted, over operating temperature range with 4.5V ≤ V DD ≤ 16V. Typical values are measured at T A = +25°C, V DD= 16V.

Parameters Sym Min Typ Max Units Conditions

Delay Time t D2—3040nsec T A = +25°C

—33450°C ≤ T A ≤ +70°C

—3545-40°C ≤ T A ≤ +85°C, Figure4-1 Power Supply

Power Supply Current I S—0.5 1.0mA V IN = 3V, V DD = 16V

—0.10.15V IN = 0V

Note1:Switching times ensured by design.

TEMPERATURE CHARACTERISTICS

Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V ≤ V DD≤ 16V.

Parameters Sym Min Typ Max Units Conditions Temperature Ranges

Specified Temperature Range (C)T A0—+70oC

Specified Temperature Range (E)T A-40—+85oC

Maximum Junction Temperature T J——+150oC

Storage Temperature Range T A-65—+150oC

Package Thermal Resistances

Thermal Resistance, 8L-MSOPθJA—206—oC/W

Thermal Resistance, 8L-PDIPθJA—125—oC/W

Thermal Resistance, 8L-SOICθJA—155—oC/W

DS21389C-page 4 2003 Microchip Technology Inc.

TC1410/TC1410N 2.0TYPICAL PERFORMANCE CURVES

Note: Unless otherwise indicated, over operating temperature range with 4.5V ≤ V DD ≤ 16V.

FIGURE 2-1:Quiescent Supply Current vs. Supply Voltage.

FIGURE 2-2:Input Threshold vs. Supply Voltage.

FIGURE 2-3:High-State Output Resistance vs. Supply Voltage.FIGURE 2-4:Quiescent Supply Current vs. Temperature.

FIGURE 2-5:Input Threshold vs. Temperature.

FIGURE 2-6:Low-State Output Resistance vs. Supply Voltage.

Note:The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

2003 Microchip Technology Inc.DS21389C-page 5

TC1410/TC1410N

DS21389C-page 6 2003 Microchip Technology Inc.

Note: Unless otherwise indicated, over operating temperature range with 4.5V ≤ V DD ≤ 16V.

FIGURE 2-7:Rise Time vs. Supply

Voltage.

FIGURE 2-8:Propagation Delay vs.

Supply Voltage.

FIGURE 2-9:Rise and Fall Times vs.

Capacitive Load.

FIGURE 2-10:Fall Time vs. Supply

Voltage.

FIGURE 2-11:Propagation Delay vs.

Supply Voltage.

FIGURE 2-12:Propagation Delays vs.

Capacitive Load.

TC1410/TC1410N

3.0PIN DESCRIPTIONS

The descriptions of the pins are listed in Table3-1. TABLE 3-1:PIN FUNCTION TABLE

3.1Supply Input (V DD)

The V DD input is the bias supply for the MOSFET driver and is rated for 4.5V to 16V with respect to the ground pin. The V DD input should be bypassed to ground with a local ceramic capacitor. The value of the capacitor should be chosen based on the capacitive load that is being driven. A value of 1.0μF is suggested.

3.2Control Input (INPUT)

The MOSFET driver input is a high-impedance, TTL/CMOS-compatible input. The input also has 300mV of hysteresis between the high and low thresholds that prevents output glitching even when the rise and fall time of the input signal is very slow.3.3CMOS Push-Pull Output

(OUTPUT)

The MOSFET driver output is a low-impedance, CMOS, push-pull style output, capable of driving a capacitive load with 0.5A peak currents.

3.4Ground

The ground pins are the return path for the bias current and for the high peak currents that discharge the load capacitor. The ground pins should be tied into a ground plane or have very short traces to the bias supply source return.

Pin No.Symbol Description

1V DD Supply input, 4.5V to 16V

2INPUT Control input

3NC No connection

4GND Ground

5GND Ground

6OUTPUT CMOS push-pull output, common

to pin 7

7OUTPUT CMOS push-pull output, common

to pin 6

8V DD Supply input, 4.5V to 16V

2003 Microchip Technology Inc.DS21389C-page 7

TC1410/TC1410N

DS21389C-page 8 2003 Microchip Technology Inc.

4.0

APPLICATIONS INFORMATION

FIGURE 4-1:

Switching Time Test Circuit.

C L = 500pF 0.1μF

1.0μF

Inverting Driver

Non-Inverting Driver

Input

V DD = 16V

Input

Output t D1t F

t R

t D2

Input: 100kHz,square wave,

t RISE = t FALL ≤ 10nsec

Output

Input

Output

t D1t F

t R

t D2

+5V 10%

90%

10%

90%

10%

90%V DD 0V

90%

10%

10%

10%

90%

+5V V DD 0V

0V

0V 90%

4, 5

2

6, 7

1, 8

TC1410TC1410N

TC1410N

TC1410

2003 Microchip Technology Inc.DS21389C-page 9

TC1410/TC1410N

5.0

PACKAGING INFORMATION

5.1

Package Marking Information

8-Lead PDIP (300 mil)Example:

Legend: XX...X

Customer specific information*

YY Year code (last 2 digits of calendar year)WW Week code (week of January 1 is week ‘01’)NNN Alphanumeric traceability code

Note :

In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information.

*

Standard marking consists of Microchip part number, year code, week code, traceability code (facility code, mask rev#, and assembly code). For marking beyond this, certain price adders apply. Please

check with your Microchip Sales Office.

8-Lead SOIC (150 mil)

8-Lead MSOP Example:

XXXXXXX YWWNNN 1410NE 346057

TC1410/TC1410N

DS21389C-page 10 2003 Microchip Technology Inc.

8-Lead Plastic Dual In-line (PA) – 300 mil (PDIP)

B1

B

A1

A

L

A2

p

α

E

eB

β

c

E1

n

D

1

2

Units

INCHES *MILLIMETERS

Dimension Limits

MIN

NOM

MAX

MIN NOM

MAX

Number of Pins n 88Pitch

p

.100 2.54

Top to Seating Plane

A .140.155.170 3.56 3.94 4.32

Molded Package Thickness A2.115.130.145 2.92 3.30 3.68Base to Seating Plane

A1.0150.38Shoulder to Shoulder Width E .300.313.3257.627.948.26Molded Package Width E1.240.250.260 6.10 6.35 6.60Overall Length

D .360.373.3859.149.469.78Tip to Seating Plane L .125.130.135 3.18 3.30 3.43Lead Thickness c .008.012.0150.200.290.38Upper Lead Width B1.045.058.070 1.14 1.46 1.78Lower Lead Width B .014.018.0220.360.460.56Overall Row Spacing §

eB .310.370.4307.879.4010.92Mold Draft Angle Top α5101551015Mold Draft Angle Bottom β

5

10

15

510

15

* Controlling Parameter Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed JEDEC Equivalent: MS-001Drawing No. C04-018

.010” (0.254mm) per side.§ Significant Characteristic

2003 Microchip Technology Inc.DS21389C-page 11

TC1410/TC1410N

8-Lead Plastic Small Outline (OA) –Narrow, 150 mil (SOIC)

Foot Angle

φ04804815

12

015

12

β

Mold Draft Angle Bottom 1512015120αMold Draft Angle Top 0.510.420.33.020.017.013B Lead Width

0.250.230.20.010.009.008c Lead Thickness 0.760.620.48.030.025.019L Foot Length 0.510.380.25.020.015.010h Chamfer Distance 5.004.904.80.197.193.189D Overall Length 3.993.913.71.157.154.146E1Molded Package Width 6.206.025.79.244.237.228E Overall Width

0.250.180.10.010.007.004A1Standoff § 1.551.421.32.061.056.052A2Molded Package Thickness 1.75

1.551.35.069.061.053A Overall Height

1.27

.050p

Pitch

88n Number of Pins MAX

NOM

MIN

MAX NOM

MIN

Dimension Limits

MILLIMETERS

INCHES*Units

2

1

D n

p

B

E E1

h

L

β

c

45°

φ

A2

α

A

A1

* Controlling Parameter Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.JEDEC Equivalent: MS-012Drawing No. C04-057

§ Significant Characteristic

TC1410/TC1410N

8-Lead Plastic Micro Small Outline Package (UA) (MSOP)

DS21389C-page 12 2003 Microchip Technology Inc.

2003 Microchip Technology Inc.DS21389C-page 13

TC1410/TC1410N

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office .

Sales and Support

Device:

TC1410: 0.5A Single MOSFET Driver, Inverting

TC1410N: 0.5A Single MOSFET Driver, Non-Inverting

T emperature Range:

C = 0°C to +70°C E

=

-40°C to +85°C

Package:

OA =Plastic SOIC, (150 mil Body), 8-lead OA713=Plastic SOIC, (150 mil Body), 8-lead

(Tape and Reel)

UA =Plastic Micro Small Outline (MSOP), 8-lead *UA713=Plastic Micro Small Outline (MSOP), 8-lead *

(Tape and Reel)

PA =Plastic DIP (300 mil Body), 8-lead * MSOP package is only available in E-T emp.

PART NO.X /XX Package

Temperature Range

Device

Examples:a)

TC1410COA:

0.5A Single MOSFET driver, SOIC package, 0°C to +70°C.

b)

TC1410CPA:0.5A Single MOSFET

driver, PDIP package,0°C to +70°C.

c)

TC1410EUA713:Tape and Reel,

0.5A Single MOSFET driver, MSOP package, -40°C to +85°C.

a)TC1410NCPA:

0.5A Single MOSFET

driver, PDIP package, 0°C to +70°C.

b)TC1410NEPA:

0.5A Single MOSFET driver, PDIP package, -40°C to +85°C.

c)TC1410NEUA:

0.5A Single MOSFET driver, MSOP package,-40°C to +85°C.

Data Sheets

Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and

recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:1.Your local Microchip sales office

2.The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277

3.

The Microchip Worldwide Site (https://www.wendangku.net/doc/0f878781.html,)

Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.New Customer Notification System

Register on our web site (https://www.wendangku.net/doc/0f878781.html,/cn) to receive the most current information on our products.

TC1410/TC1410N

NOTES:

DS21389C-page 14 2003 Microchip Technology Inc.

2003 Microchip Technology Inc.

DS21389C-page 15

Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications.No representation or warranty is given and no liability is assumed by Microchip T echnology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical com-ponents in life support systems is not authorized except with express written approval by Microchip. No licenses are con-veyed, implicitly or otherwise, under any intellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, Accuron,dsPIC, K EE L OQ , MPLAB, PIC, PICmicro, PICSTART,

PRO MATE and PowerSmart are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

AmpLab, FilterLab, micro ID , MXDEV , MXLAB, PICMASTER,SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A.

Application Maestro, dsPICDEM, https://www.wendangku.net/doc/0f878781.html,, ECAN,ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,

In-Circuit Serial Programming, ICSP , ICEPIC, microPort,Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM,PICkit, PICDEM, https://www.wendangku.net/doc/0f878781.html,, PowerCal, PowerInfo,PowerMate, PowerTool, rfLAB, rfPIC, Select Mode,SmartSensor, SmartShunt, SmartT el and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A.

All other trademarks mentioned herein are property of their respective companies.

? 2003, Microchip T echnology Incorporated, Printed in the U.S.A., All Rights Reserved.

Printed on recycled paper.

Note the following details of the code protection feature on Microchip devices:?Microchip products meet the specification contained in their particular Microchip Data Sheet.

?Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions.

?

There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

?Microchip is willing to work with the customer who is concerned about the integrity of their code.

?

Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company’s quality system processes and procedures are QS-9000 compliant for its

PICmicro ? 8-bit MCUs, K EE L OQ ? code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001 certified.

M

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07/28/03

W ORLDWIDE S ALES AND S ERVICE

DS21389C-page 16 2003 Microchip Technology Inc.

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