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HLMP-P505-G0000中文资料

HLMP-P505-G0000中文资料
HLMP-P505-G0000中文资料

HLMP-Pxxx Series, HLMP-Qxxx Series HLMP-6xxx Series, HLMP-70xx Series

Agilent HLMP-Pxxx

Subminiature LED Lamps

Data Sheet

Features

?Subminiature flat top package –ideal for backlighting and light piping applications

?Subminiature dome package –diffused dome for wide viewing angle

–nondiffused dome for high brightness

?TTL and LSTTL compatible 5 volt resistor lamps

?Available in six colors ?Ideal for space limited applications ?Axial leads

?Available with lead configurations for surface mount and through hole PC board mounting

Description

Flat Top Package

The HLMP-Pxxx Series flat top lamps use an untinted, non-diffused, truncated lens to

provide a wide radiation pattern that is necessary for use in backlighting applications. The flat top lamps are also ideal for use as emitters in light pipe applications.

Dome Packages

The HLMP-6xxx Series dome lamps for use as indicators use a tinted, diffused lens to provide a wide viewing angle with a high on-off contrast ratio. High brightness lamps use an

untinted, nondiffused lens to provide a high luminous intensity within a narrow radiation pattern.

Resistor Lamps

The HLMP-6xxx Series 5 volt subminiature lamps with built in current limiting resistors are for use in applications where space is at a premium.

Lead Configurations

All of these devices are made by encapsulating LED chips on

axial lead frames to form molded epoxy subminiature lamp

packages. A variety of package configuration options is avail-able. These include special surface mount lead configura-tions, gull wing, yoke lead or Z-bend. Right angle lead bends at 2.54 mm (0.100 inch) and 5.08mm (0.200 inch) center

spacing are available for through hole mounting. For more

information refer to Standard SMT and Through Hole Lead Bend Options for Subminiature LED Lamps data sheet.

Device Selection Guide

Part Number: HLMP-xxxx

DH AS High High Device Standard AlGaAs Efficiency Perf.Emerald Outline Red Red Red Orange Yellow Green Green Device Description[1]Drawing P005P105P205P405P305P505P605Untinted, Nondiffused,A

Flat Top

P102P202P402P302P502Untinted, Diffused, Flat Top A

6000Q1006300Q40064006500Q600Tinted, Diffused B Q1056305Q40564056505Q605Untinted, Nondiffused,B

High Brightness

Q150700070197040Tinted, Diffused, Low Current B

Q155Nondiffused, Low Current B

660067006800Tinted, Diffused, Resistor,B

5 V, 10 mA

662067206820Diffused, Resistor, 5 V, 4 mA B

Ordering Information

HLMX-XXXX-X X X X X

Packaging

Option

Color Bin

Selection

Max. Iv Bin

Min. Iv Bin

4 x 4 Prod.

Part

Number

2.082.34(0.082)(0.092)

STRIPE

(B) Diffused and Nondiffused

Figure 1. Proper right angle mounting to a PC board to prevent protruding cathode tab from shorting to anode connection.

Package Dimensions (A) Flat Top Lamps

NO. ANODE DOWN.YES. CATHODE DOWN.

NOTES:

1. ALL DIMENSIONS ARE IN MILLIMETRES (INCHES).

2. PROTRUDING SUPPORT TAB IS CONNECTED TO CATHODE LEAD.

3. LEAD POLARITY FOR AlGaAs LAMPS IS OPPOSITE TO THE LEAD

POLARITY OF SUBMINIATURE LAMPS USING OTHER TECHNOLOGIES.

2.082.34(0.082)(0.092)

STRIPE

Absolute Maximum Ratings at T A = 25°C

DH AS High

Standard AlGaAs Eff.High Perf.Emerald Parameter Red Red Red Orange Yellow Green Green Units DC Forward Current[1]50303030203030mA Peak Forward Current[2]10003009090609090mA DC Forward Voltage6666V (Resistor Lamps Only)

Reverse Voltage (I R = 100 μA)5555555V Transient Forward Current[3]2000500500500500500500mA (10 μs Pulse)

Operating Temperature Range:

Non-Resistor Lamps-55 to +100-40 to +100 55 to +100-40 to +100-20 to +100

°C Resistor Lamps -40 to +85 -20 to +85

Storage Temperature Range -55 to +100°C For Thru Hole Devices 260°C for 5 seconds

Wave Soldering Temperature

[1.6 mm (0.063 in.) from body]

For Surface Mount Devices: 260°C for 20 seconds

Reflow Soldering Temperature

Notes:

1.See Figure 5 for current derating vs. ambient temperature. Derating is not applicable to resistor lamps.

2.Refer to Figure 6 showing Max. Tolerable Peak Current vs. Pulse Duration to establish pulsed operating conditions.

3.The transient peak current is the maximum non-recurring peak current the device can withstand without failure. Do not operate these lamps at this

high current.

Electrical/Optical Characteristics, T A = 25°C

Standard Red

Device

HLMP-Parameter Symbol Min.Typ.Max.Units Test Conditions 6000-E00xx0.63 1.2

6000-G00xx Luminous Intensity[1]I V 1.60 3.2mcd I F = 10 mA

P005-F00xx 1.0 2.5

Forward Voltage V F 1.4 1.6 2.0V I F = 10 mA

All Reverse Breakdown V

R 5.012.0V I R = 100 μA Voltage

6000Included Angle Between

2q1/290

Deg.

P005Half Intensity Points[2]125

Peak Wavelength l PEAK655nm

Dominant Wavelength[3]l d640nm

Spectral Line Half Width Dl1/224nm

All Speed of Response t s15ns

Capacitance C100pF V F = 0; f = 1 MHz

Thermal Resistance R q J-PIN170°C/W Junction-to-Cathode Lead

Luminous Efficacy[4]h v65lm/W

DH AS AlGaAs Red

Device

HLMP-Parameter Symbol Min.Typ.Max.Units Test Conditions P102-F00xx 1.020.0

P105-L00xx10.030.0

P105-NP0002580

Q100-M00xx1645

Q100-N00xx

Luminous Intensity I V 25.045.0

mcd

I F = 20 mA

Q100-PQ00040125

Q105-P00xx40200

Q105-ST000160500

Q150-F00xx 1.0 1.8

I F = 1 mA Q155-F00xx 1.0 4.0

Q100

Forward Voltage V F 1.8 2.2

V

I F = 20 mA

Q150/Q155 1.6 1.8I F = 1 mA All Reverse Breakdown Voltage V R 5.015.0V I R = 100 μA P105125

Q100/Q150Included Angle Between

2q1/290Deg.

Q105/Q155Half Intensity Points[2]

28

Peak Wavelength l PEAK645nm Measured at Peak Dominant Wavelength[3]l d637nm

Spectral Line Half Width Dl1/220nm

All Speed of Response t s30ns Exponential Time

Constant; e-t/t s Capacitance C30pF V F = 0; f = 1 MHz

Thermal Resistance R q J-PIN170°C/W Junction-to Cathode Lead

Luminous Efficacy[4]h v80lm/W

High Efficiency Red

Device

HLMP-Parameter Symbol Min.Typ.Max.Units Test Conditions

P202-F00xx 1.0 5.0

P205-F00xx 1.08.0

P205-JK000 4.012.5I

F = 10 mA 6300-F00xx 1.010.0

6300-KL000Luminous Intensity[1]I V 6.320.0mcd

6305-L00xx10.040.0

7000-D00xx0.4 1.0I F = 2 mA

6600-G00xx 1.6 5.0

V F = 5.0 Volts 6620-F00xx 1.0 2.0

All Forward Voltage V F 1.5 1.8 3.0V I F = 10 mA (Nonresistor Lamps)

6600Forward Current

I F 9.613.0

mA V F = 5.0 V

6620(Resistor Lamps) 3.5 5.0

All Reverse Breakdown Voltage V R 5.030.0V I R = 100 μA P205125

6305Included Angle Between

2q1/228Deg.

All Diffused Half Intensity Points[2]

90

Peak Wavelength l PEAK635nm Measured at Peak Dominant Wavelength[3]l d626nm

Spectral Line Half Width Dl1/240nm

All Speed of Response t s90ns

Capacitance C11pF V F = 0; f = 1 MHz

Thermal Resistance R q J-PIN170°C/W Junction-to-Cathode Lead

Luminous Efficacy[4]h v145lm/W

Device

HLMP-Parameter Symbol Min.Typ.Max.Units Test Conditions P402-F00xx 1.0 4.0

P405-F00xx 1.06

P405-JK000Luminous Intensity I V 4.012.5mcd I F = 10 mA

Q400-F00xx 1.08

Q405-H00xx 2.514

All Forward Voltage V F 1.5 1.9 3.0V I F = 10 mA Reverse Breakdown Voltage V R 5.030.0V I R = 100 μA

P40x Included Angle Between

2q1/2125

Deg.

Q40x Half Intensity Points[2]90

Peak Wavelength l PEAK600nm

Dominant Wavelength[3]l d602nm Measured at Peak

Spectral Line Half Width Dl1/240nm

All Speed of Response t s260ns

Capacitance C4pF V F = 0; f = 1 MHz

Thermal Resistance R q J-PIN170°C/W Junction-to-Cathode Lead

Luminous Efficacy[4]h v380lm/W

Device

HLMP-Parameter Symbol Min.Typ.Max.Units Test Conditions

P302-F00xx 1.0 3.0

P305-F00xx 1.0 4.0

6400-F00xx 1.09.0

6400-JK000 4.012.5

I F = 10 mA 6405-J00xx Luminous Intensity[1]I V 3.620mcd

6405-MN0xx1650

7019-D00xx0.40.6I F = 2 mA

6700-G00xx 1.4 5.0

V F = 5.0 Volts 6720-F00xx0.9 2.0

All Forward Voltage V F 2.0 2.4V I F = 10 mA (Nonresistor Lamps)

6700Forward Current

I F 9.613.0

mA V F = 5.0 V

6720(Resistor Lamps) 3.5 5.0

All Reverse Breakdown V R 5.050.0V Voltage

P305

Included Angle Between 125

6405

Half Intensity Points[2]

2q1/228Deg.

All Diffused90

Peak Wavelength l PEAK583nm Measured at Peak

Dominant Wavelength[3]l d585nm

Spectral Line Half Width Dl1/236nm

All Speed of Response t s90ns

Capacitance C15pF V F = 0; f = 1 MHz

Thermal Resistance R q J-PIN170°C/W Junction-to-Cathode Lead

Luminous Efficacy[4]h v500lm/W

High Performance Green

Device

HLMP-Parameter Symbol Min.Typ.Max.Units Test Conditions P502-F00xx 1.0 3.0

P505-G00xx 1.6 6.3

I F = 10 mA 6500-F00xx 1.07.0

6505-L00xx Luminous Intensity[1]I v10.040.0mcd

7040-D00xx0.40.6I F = 2 mA

6800-G00xx 1.6 5.0

V F = 5.0 Volts 6820-F00xx 1.0 2.0

All Forward Voltage V F 2.1 2.7V I F = 10 mA (Nonresistor Lamps)

6800Forward Current

I F 9.613.0

mA V F = 5.0 V

6820(Resistor Lamps) 3.5 5.0

All Reverse Breakdown Voltage V R 5.050.0V I R = 100 μA

P505

Included Angle Between 125

6505

Half Intensity Points[2]2q1/228Deg.

All Diffused90

Peak Wavelength l PEAK565nm

Dominant Wavelength[3]l d569nm

Spectral Line Half Width Dl1/228nm

All Speed of Response t s500ns

Capacitance C18pF V F = 0; f = 1 MHz

Thermal Resistance R q J-PIN170°C/W Junction-to-Cathode Lead

Luminous Efficacy[4]h v595lm/W

Notes:

1.The luminous intensity for arrays is tested to assure a

2.1 to 1.0 matching between elements. The average luminous intensity for an array

determines its light output category bin. Arrays are binned for luminous intensity to allow I v matching between arrays.

2.q1/2 is the off-axis angle where the luminous intensity is half the on-axis value.

3.Dominant wavelength, l d, is derived from the CIE Chromaticity Diagram and represents the single wavelength that defines the color of the device.

4.Radiant intensity, I e, in watts/steradian, may be calculated from the equation I e = I v/h v, where I v is the luminous intensity in

candelas and h v is the luminous efficacy in lumens/watt.

Emerald Green[1]

Device

HLMP-Parameter Symbol Min.Typ.Max.Units Test Conditions P605-F00xx 1.0 1.5

Q600-F00xx Luminous Intensity I V 1.0 1.5mcd I F = 10 mA

Q605-F00xx 1.07.5

All Forward Voltage V F 2.2 3.0V I F = 10 mA Reverse Breakdown Voltage V R 5.0V I R = 100 μA

P605Included Angle Between

2q1/2125

Deg.

Q60x Half Intensity Points[2]90

Peak Wavelength l PEAK558nm

Dominant Wavelength[3]l d560nm Measured at Peak

Spectral Line Half Width Dl1/224nm

P605/Q600Speed of Response t s3100ns

Capacitance C35pF V F = 0; f = 1 MHz

Thermal Resistance R q J-PIN170°C/W Junction-to-Cathode Lead

Luminous Efficacy[4]h V656lm/W

Note:

1. Please refer to Application Note 1061 for information comparing standard green and emerald green light output degradation.

Standard Red, DH As AlGaAs Red Standard Red and DH AS

AlGaAs Red

High Efficiency Red, Orange,Yellow, High Performance Green, and Emerald Green

HER, Orange, Yellow, and High Performance Green,and Emerald Green

Low Current

Figure 1. Relative intensity vs. wavelength.

Figure 2. Forward current vs. forward voltage (non-resistor lamp).

and Emerald Green

Figure 9. Relative intensity vs. angular displacement.

Figure 7. Resistor lamp forward current vs. forward voltage.

Figure 8. Resistor lamp luminous intensity vs. forward voltage.

Intensity Bin Limits Bin Min.Max. A 0.100.20 B 0.160.32 C 0.250.50 D 0.400.80 E 0.63 1.25 F 1.00 2.00 G 1.60 3.20 H 2.50 5.00 J 4.008.00 K 6.3012.50 L 10.0020.00 M 16.0032.00 N 25.0050.00 P 40.0080.00 Q 63.00125.00 R 100.00200.00 S 160.00320.00 T 250.00500.00 U 400.00800.00 V 630.001250.00 W 1000.002000.00 X 1600.003200.00 Y

2500.00

5000.00

Color Bin Limits Package

Bin Min.Max.Emerald Green

0Full Distribution 9552556855555975585626561565Green

0Full Distribution 65615655564568456757135705742573577Yellow

0Full Distribution 1581.5585.03584.0587.52586.5590.04589.0592.55591.5593.56591.5595.07594.0597.5Orange

0Full Distribution 1596.5600.02599.0602.53601.5604.04603.8608.25606.8611.26609.8614.27612.8617.28

615.8620.2

Ordering Information HLMx-XXXX-X X X X X

4 x 4 Prod.Part Number

Min. Iv Bin Max. Iv Bin Color Bin Selection Packaging Option

Mechanical Option

00Straight Leads, Bulk Packaging, Quantity of 500 Parts

10Right Angle Housing, Bulk Packaging, Quantity of 500 Parts

11Gull Wing Leads, 12 mm Tape on 7 in. Dia. Reel, 1500 Parts per Reel

12Gull Wing Lead, Bulk Packaging, Quantity of 500 Parts

14Gull Wing Leads, 12 mm Tape on 13 in. Dia. Reel, 6000 Parts per Reel

21Yoke Leads, 12 mm Tape on 7 in. Dia. Reel, 1500 Parts per Reel

22Yoke Leads, Bulk Packaging, Quantity of 500 Parts

24Yoke Leads, 12 mm Tape on 13 in. Dia. Reel, 6000 Parts per Reel

31Z-Bend Leads, 12 mm Tape on 7 in. Dia. Reel, 1500 Parts per Reel

32Z-Bend Leads, Bulk Packaging, Quantity of 500 Parts

34Z-Bend Leads, 12 mm Tape on 13 in. Dia. Reel, 6000 Parts per Reel

1L 2.54 mm (0.100 inch) Center Lead Spacing, Long Leads; 10.4 mm (0.410 in.)

1S 2.54 mm (0.100 inch) Center Lead Spacing, Short Leads; 3.7 mm (0.145 in.)

2L 5.08 mm (0.200 inch) Center Lead Spacing, Long Leads; 10.4 mm (0.410 in.)

2S 5.08 mm (0.200 inch) Center Lead Spacing, Short Leads; 3.7 mm (0.145 in.) Note:

All Categories are established for classification of products. Products may not be available in all categories. Please contact your local Agilent representative for further clarification/information.

https://www.wendangku.net/doc/0b4375900.html,/semiconductors

For product information and a complete list of

distributors, please go to our web site.

For technical assistance call:

Americas/Canada: +1 (800) 235-0312 or

(916) 788-6763

Europe: +49 (0) 6441 92460

China: 10800 650 0017

Hong Kong: (+65) 6756 2394

India, Australia, New Zealand: (+65) 6755 1939

Japan: (+81 3) 3335-8152(Domestic/Interna-

tional), or 0120-61-1280(Domestic Only)

Korea: (+65) 6755 1989

Singapore, Malaysia, Vietnam, Thailand,

Philippines, Indonesia: (+65) 6755 2044

Taiwan: (+65) 6755 1843

Data subject to change.

Copyright ? 2004 Agilent Technologies, Inc.

Obsoletes 5988-6260EN

October 19, 2004

5989-1708EN

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