PC13770FC中文资料

Freescale Semiconductor Technical Data

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MC13770/D Rev. 2, 11/2003

MC13770

Ordering Information

Device

Device Marking

Package

MC13770FC

770

QFN-12

1Introduction

The MC13770 is a single band front-end IC designed for wireless receiver applications. It contains a low noise LNA and a high linearity mixer. The LNA is integrated with a bypass switch to preserve input intercept

performance. The device is fabricated using Freescale's Advanced RF BiCMOS process using the SiGe:C option and is packaged in a 12 pin Quad Flat Non-leaded package.

1.1

Features

?RF Input Frequency: 2100 to 2400 MHz ?LNA Gain = 15 dB (Typ)

?LNA Input 3rd Order Intercept Point (IIP3) = 0 dBm (Typ)

?LNA Noise Figure (NF) = 1.5 dB (Typ)

?Bypass Mode Included for Improved Intercept Point Performance

?Double Balanced Mixer

?Mixer Conversion Gain = 10 dB (Typ)?

Mixer Noise Figure (NF) = 8.0 dB (Typ)

MC13770

Single Band LNA and Mixer FEIC

Contents

1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . 1

2 Electrical Specifications . . . . . . . . . . . . . . . . 2

3 Contact Description. . . . . . . . . . . . . . . . . . . . 4

4 Applications Information. . . . . . . . . . . . . . . . 45

Packaging Information. . . . . . . . . . . . . . . . . . 7

Electrical Specifications

?Mixer Input 3rd Order Intercept Point (IIP3) = -3.0 dBm (Typ)?

Total Supply Current = 8.0 mA LNA = 3.0 mA Mixer = 5.0 mA

Figure 1. Simplified Block Diagram

2Electrical Specifications

Table 1. Maximum Ratings

Rating

Symbol Value Unit Supply Voltage

V CC 3.6V Storage T emperature Range T stg -65 to 150°C Operating T emperature Range

T A

-40 to 85

°C

Note: Maximum Ratings and ESD

1.Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the limits in the Electrical Characteristics tables or Pin Descriptions section.

2.ESD (electrostatic discharge) immunity meets Human Body Model (HBM) ≤100 V and Machine Model (MM) ≤30 V . Additional ESD data available upon request.

Table 2. Recommended Operating Conditions

Characteristic

Symbol

Min Typ

Max Unit Supply Voltage

2.7

2.75

3.0

Vdc Logic Voltage (Enable and Bypass Pins)V

Input High Voltage 0.85 V CC

-V CC Input Low Voltage

-0.15 V CC

Electrical Specifications

Table 3. Electrical Characteristics

Characteristic Symbol Min Typ Max Unit

T urn-on Time-100-ns

LNA High Gain Mode (Frequency = 2140 MHz, V CC = 2.75 V, Bypass = 2.75 V, Enable = 2.75 V)

LNA Gain-15-dB

LNA Noise Figure- 1.5-dB

LNA Input IP3-0-dBm

LNA Supply Current I DD- 3.0-mA

LNA Low Gain Mode (RF = 2140 MHz, V CC = 2.75 V, Bypass = 0 V, Enable = 2.75 V)

LNA Gain--5.0-dB

LNA Noise Figure- 5.0-dB

LNA Input IP3-20-dBm

LNA Supply Current I DD-10-μA

Mixer Mode (RF = 2140 MHz, LO = 2520 MHz, V CC = 2.75 Vdc, Enable = 2.75 V)

Conversion Gain-10-dB

SSB Noise Figure-8.0-dB

Input IP3--3.0-dBm Supply Current- 5.0-mA

LO Drive Level--10-dBm Note: T one spacing for IIP3 measurement is 5.0 MHz.

Table 4. Truth Table

(1 = 2.75 V, 0 = 0 V)

Enable Bypass Mode

00Sleep

01Undefined - do not use

10Low Gain

11High Gain

Contact Description

3Contact Description

Table 5. Contact Function Description

Pin Symbol Description

1LNA Out LNA Output

2Bypass LNA Bypass Control

3Mix In Mixer Input

4Enable Chip Enable

5LO+Local Oscillator Input +

6LO-Local Oscillator Input -

7IF+Differential IF Output +

8IF-Differential IF Output -

9V CC Supply

10LNA In LNA Input

11Gnd Ground

12Mix Bias Mixer Bias Adjustment

4Applications Information

Figure 2 shows the typical application circuit for 2110 to 2140 MHz band. The Mixer input is internally broadband matched. Two typical IF output match circuits are provided in Table 6on page 5.

Applications Information

Figure 2. Application Schematic

Table 6. Bill of Material for Application Schematic

Component190 MHz IF380 MHz IF

C3 1.2 pF 2.2 pF

C4 1.2 pF 2.2 pF

C10 1.2 pF 1.2 pF

L3150 nH39 nH

L4150 nH39 nH

R3 5.0 k?20 k?

Note: All other components are the same for both configurations.

Applications Information

Figure 3. Application PCB (Not to Scale)

Packaging Information 5Packaging Information

Figure 4. Outline Dimensions for QFN-12

(Case 1345-01, Issue A)

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