MAX3243ECDWR中文资料
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FEATURES
DB, DW, OR PW PACKAGE
(TOP VIEW)
QFN PACKAGE
(TOP VIEW)
C
–
2–
2+
1+
+
C C
C
N D I N D I N D I N R O U T R O U T R O U T N DESCRIPTION
MAX3243E
3-V TO 5.5-V MULTICHANNEL RS-232LINE DRIVER/RECEIVER
WITH ±15-kV IEC ESD PROTECTION
SLLS657A–APRIL 2005–REVISED JUNE 2005
?Single-Chip and Single-Supply Interface for IBM?PC/AT?Serial Port
?
ESD Protection for RS-232Bus Pins –±15-kV Human-Body Model (HBM)
–±8-kV IEC61000-4-2,Contact Discharge –±15-kV IEC61000-4-2,Air-Gap Discharge ?Meets or Exceeds Requirements of TIA/EIA-232-F and ITU v.28Standards ?Operates With 3-V to 5.5-V V CC Supply
?Always-Active Noninverting Receiver Output (ROUT2B)
?Designed to Transmit at a Data Rate up to 500kbit/s
?Low Standby Current ...1μA Typ ?External Capacitors ...4×0.1μF
?Accepts 5-V Logic Input With 3.3-V Supply ?Designed to Be Interchangeable With Maxim MAX3243E
?Serial-Mouse Driveability
?
Auto-Powerdown Feature to Disable Driver Outputs When No Valid RS-232Signal Is Sensed
?
Applications
–Battery-Powered Systems,PDAs,
Notebooks,Laptops,Palmtop PCs,and Hand-Held Equipment
?
Package Options Include Plastic
Small-Outline (DW),Shrink Small-Outline (DB),and Thin Shrink Small-Outline (PW)Packages
The MAX3243E device consists of three line drivers,five line receivers,and a dual charge-pump circuit with ±15-kV ESD (HBM and IEC61000-4-2,Air-Gap Discharge)and ±8-kV ESD (IEC61000-4-2,Contact Discharge)protection on serial-port connection pins.The device meets the requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the serial-port connector.This combination of drivers and receivers matches that needed for the typical serial port used in an IBM PC/AT,or compatible.The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V supply.In addition,the device includes an always-active noninverting output (ROUT2B),which allows applications using the ring indicator to transmit data while the device is powered down.The device operates at data signaling rates up to 250kbit/s and a maximum of 30-V/μs driver output slew rate.
Please be aware that an important notice concerning availability,standard warranty,and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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DESCRIPTION (CONTINUED)
MAX3243E
3-V TO 5.5-V MULTICHANNEL RS-232LINE DRIVER/RECEIVER WITH ±15-kV IEC ESD PROTECTION
SLLS657A–APRIL 2005–REVISED JUNE 2005
Flexible control options for power management are available when the serial port is inactive.The auto-powerdown feature functions when FORCEON is low and FORCEOFF is high.During this mode of operation,if the device does not sense a valid RS-232signal,the driver outputs are disabled.If FORCEOFF is set low,both drivers and receivers (except ROUT2B)are shut off,and the supply current is reduced to 1μA.Disconnecting the serial port or turning off the peripheral drivers causes the auto-powerdown condition to occur.Auto-powerdown can be disabled when FORCEON and FORCEOFF are high,and should be done when driving a serial mouse.With auto-powerdown enabled,the device is activated automatically when a valid signal is applied to any receiver input.The INVALID output is used to notify the user if an RS-232signal is present at any receiver input.INVALID is high (valid data)if any receiver input voltage is greater than 2.7V or less than –2.7V or has been between –0.3V and 0.3V for less than 30μs.INVALID is low (invalid data)if all receiver input voltages are between –0.3V and 0.3V for more than 30μs.Refer to Figure 5for receiver input levels.
The MAX3243EC is characterized for operation from 0°C to 70°C.The MAX3243EI is characterized for operation from –40°C to 85°C.
AVAILABLE OPTIONS
PACKAGED DEVICES (1)
SHRINK
THIN SHRINK QUAD FLAT T A
SMALL OUTLINE
SMALL OUTLINE
SMALL OUTLINE
NO-LEAD (DB)(DB)(PW)(RHB)
MAX3243ECRHBR 0°C to 70°C MAX3243ECDB MAX3243ECDW MAX3243ECPW (Preview)MAX3243EIDB
MAX3243EIRHBR –40°C to 85°C
MAX3243EIDW
MAX3243EIPW
(Preview)
(1)
The DB,DW,and PW packages are available in both tube and taped &reeled.Add the suffix R to orderable (e.g.MAX3243ECDBR for taped &reeled version).
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MAX3243E
3-V TO5.5-V MULTICHANNEL RS-232LINE DRIVER/RECEIVER
WITH±15-kV IEC ESD PROTECTION
SLLS657A–APRIL2005–REVISED JUNE2005
FUNCTION TABLES
EACH DRIVER(1)
INPUTS
OUTPUT
DRIVER STATUS
VALID RIN DOUT
DIN FORCEON FORCEOFF
RS-232LEVEL
X X L X Z Powered off
L H H X H Normal operation with
auto-powerdown disabled
H H H X L
L L H Yes H Normal operation with
auto-powerdown enabled
H L H Yes L
L L H No Z Powered off by
auto-powerdown feature
H L H No Z
(1)H=high level,L=low level,X=irrelevant,Z=high impedance
EACH RECEIVER(1)
INPUTS OUTPUTS
RECEIVER
RIN1,VALID RIN STATUS
RIN2FORCEOFF ROUT2B ROUT
RIN3-RIN5RS-232LEVEL
L X L X L Z Powered off while
ROUT2B is active
H X L X H Z
L L H Yes L H
Normal operation L H H Yes L L
with
H L H Yes H H
auto-powerdown
H H H Yes H L disabled/enabled
Open Open H Yes L H
(1)H=high level,L=low level,X=irrelevant,Z=high impedance(off),Open=input disconnected or
connected driver off
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DIN3
DIN2
DIN1
DOUT3
DOUT2
DOUT1
INVALID
RIN1
RIN2
RIN3
RIN4
RIN5
FORCEOFF FORCEON
ROUT1ROUT2B
ROUT2
ROUT3
ROUT4
ROUT5
MAX3243E
3-V TO 5.5-V MULTICHANNEL RS-232LINE DRIVER/RECEIVER WITH ±15-kV IEC ESD PROTECTION
SLLS657A–APRIL 2005–REVISED JUNE 2005
LOGIC DIAGRAM (POSITIVE LOGIC)
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Absolute Maximum Ratings(1) Recommended Operating Conditions(1) Electrical Characteristics(1)MAX3243E
3-V TO5.5-V MULTICHANNEL RS-232LINE DRIVER/RECEIVER
WITH±15-kV IEC ESD PROTECTION
SLLS657A–APRIL2005–REVISED JUNE2005 over operating free-air temperature range(unless otherwise noted)
MIN MAX UNIT V CC Supply voltage range(2)–0.36V
V+Positive output supply voltage range(2)–0.37V
V–Negative output supply voltage range(2)0.3–7V
V+–V–Output supply voltage difference(2)13V
Driver(FORCEOFF,FORCEON)–0.36
V I Input voltage range V
Receiver–2525
Driver–13.213.2
V O Output voltage range V
Receiver(INVALID)–0.3V CC+0.3
DB package62
θJA Package thermal impedance(3)(4)DW package46°C/W
PW package62 Lead temperature1,6mm(1/16in)from case for10s260°C
T stg Storage temperature range–65150°C (1)Stresses beyond those listed under"absolute maximum ratings"may cause permanent damage to the device.These are stress ratings
only,and functional operation of the device at these or any other conditions beyond those indicated under"recommended operating conditions"is not implied.Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)All voltages are with respect to network GND.
(3)Maximum power dissipation is a function of T J(max),θJA,and T A.The maximum allowable power dissipation at any allowable ambient
temperature is P D=(T J(max)-T A)/θJA.Operating at the absolute maximum T J of150°C can affect reliability.
(4)The package thermal impedance is calculated in accordance with JESD51-7.
See Figure6
MIN NOM MAX UNIT
V CC=3.3V3 3.3 3.6 Supply voltage V
V CC=5V 4.55 5.5
V CC=3.3V2
V IH Driver and control high-level input voltage DIN,FORCEOFF,FORCEON V
V CC=5V 2.4
V IL Driver and control low-level input voltage DIN,FORCEOFF,FORCEON0.8V
V I Driver and control input voltage DIN,FORCEOFF,FORCEON0 5.5V
V I Receiver input voltage–2525V
MAX3243EC070
T A Operating free-air temperature°C
MAX3243EI–4085
(1)Test conditions are C1–C4=0.1μF at V CC=3.3V±0.3V;C1=0.047μF,C2–C4=0.33μF at V CC=5V±0.5V.
over recommended ranges of supply voltage and operating free-air temperature(unless otherwise noted)(see Figure6) PARAMETER TEST CONDITIONS MIN TYP(2)MAX UNIT
I I Input leakage current FORCEOFF,FORCEON±0.01±1μA
No load,
Auto-powerdown disabled0.31mA
FORCEOFF and FORCEON at V CC
Powered off No load,FORCEOFF at GND110 Supply current
I CC No load,FORCEOFF at V
CC ,
(T A=25°C)
μA
FORCEON at GND,
Auto-powerdown enabled110
All RIN are open or grounded,
All DIN are grounded
(1)Test conditions are C1–C4=0.1μF at V CC=3.3V±0.3V;C1=0.047μF,C2–C4=0.33μF at V CC=5V±0.5V.
(2)All typical values are at V CC=3.3V or V CC=5V,and T A=25°C.
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DRIVER SECTION
Electrical Characteristics (1)
Switching Characteristics (1)
ESD Protection
MAX3243E
3-V TO 5.5-V MULTICHANNEL RS-232LINE DRIVER/RECEIVER WITH ±15-kV IEC ESD PROTECTION
SLLS657A–APRIL 2005–REVISED JUNE 2005
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(see Figure 6)
PARAMETER
TEST CONDITIONS
MIN TYP (2)MAX UNIT V OH High-level output voltage All DOUT at R L =3k ?to GND 5 5.4V V OL Low-level output voltage All DOUT at R L =3k ?to GND
–5–5.4
V Output voltage
DIN1=DIN2=GND,DIN3=V CC ,3-k ?to GND at DOUT3,V O ±5
V (mouse driveability)DOUT1=DOUT2=2.5mA I IH High-level input current V I =V CC ±0.01±1μA I IL Low-level input current V I at GND
±0.01
±1μA V hys Input hysteresis
±1V V CC =3.6V,V O =0V I OS Short-circuit output current (3)±60mA V CC =5.5V,
V O =0V r o Output resistance V CC ,V+,and V–=0V,V O =±2V 300
10M
?I off Output leakage current
FORCEOFF =GND,
V O =±12V,
V CC =0to 5.5V
±25
μA
(1)Test conditions are C1–C4=0.1μF at V CC =3.3V ±0.3V;C1=0.047μF,C2–C4=0.33μF at V CC =5V ±0.5V.(2)All typical values are at V CC =3.3V or V CC =5V,and T A =25°C.
(3)
Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings,and not more than one output should be shorted at a time.
switching characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(see Figure 6)
PARAMETER TEST CONDITIONS
MIN TYP (2)MAX
UNIT C L =1000pF,
R L =3k ?Maximum data rate
250
500kbit/s One DOUT switching,See Figure 1
t sk(p)Pulse skew (3)
C L =150pF to 2500pF,R L =3k ?to 7k ?,See Figure 2100
ns
V CC =3.3V,
C L =150pF to 1000pF 630Slew rate,transition region SR(tr)R L =3k ?to 7k ?,V/μs
(see Figure 1)
C L =150pF to 2500pF
430
PRR =250kbit/s
(1)Test conditions are C1–C4=0.1μF at V CC =3.3V +0.3V;C1=0.047μF,C2–C4=0.33μF at V CC =5V ±0.5V.(2)All typical values are at V CC =3.3V or V CC =5V,and T A =25°C.
(3)
Pulse skew is defined as |t PLH –t PHL |of each channel of the same device.
PARAMETER
TEST CONDITIONS
TYP UNIT HBM
±15kV Driver outputs (pins 9–11)
IEC61000-4-2,Air-Gap Discharge ±15kV IEC61000-4-2,Contact Discharge
±8
kV
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RECEIVER SECTION Electrical Characteristics(1)
Switching Characteristics(1) ESD Protection
MAX3243E 3-V TO5.5-V MULTICHANNEL RS-232LINE DRIVER/RECEIVER
WITH±15-kV IEC ESD PROTECTION
SLLS657A–APRIL2005–REVISED JUNE2005
over recommended ranges of supply voltage and operating free-air temperature(unless otherwise noted)(see Figure6) PARAMETER TEST CONDITIONS MIN TYP(2)MAX UNIT V OH High-level output voltage I OH=–1mA V CC–0.6V CC–0.1V V OL Low-level output voltage I OH=1.6mA0.4V
V CC=3.3V 1.6 2.4
V IT+Positive-going input threshold voltage V
V CC=5V 1.9 2.4
V CC=3.3V0.6 1.1
V IT–Negative-going input threshold voltage V
V CC=5V0.8 1.4
V hys Input hysteresis(V IT+–V IT–)0.5V I off Output leakage current(except ROUT2B)FORCEOFF=0V±0.05±10μA r i Input resistance V I=±3V or±25V357k?
(1)Test conditions are C1–C4=0.1μF at V CC=3.3V±0.3V;C1=0.047μF,C2–C4=0.33μF at V CC=5V±0.5V.
(2)All typical values are at V CC=3.3V or V CC=5V,and T A=25°C.
over recommended ranges of supply voltage and operating free-air temperature(unless otherwise noted)
PARAMETER TEST CONDITIONS TYP(2)UNIT t PLH Propagation delay time,low-to high-level output C L=150pF,See Figure3150ns t PHL Propagation delay time,high-to low-level output150ns t en Output enable time C L=150pF,R L=3k?,See Figure4200ns t dis Output disable time200ns t sk(p)Puse skew(3)See Figure350ns
(1)Test conditions are C1–C4=0.1μF at V CC=3.3V±0.3V;C1=0.047μF,C2–C4=0.33μF at V CC=5V±0.5V.
(2)All typical values are at V CC=3.3V or V CC=5V,and T A=25°C.
(3)Pulse skew is defined as|t PLH-t PHL|of each channel of the same device.
PARAMETER TEST CONDITIONS TYP UNIT
HBM±15kV Driver outputs(pins4–8)IEC61000-4-2,Air-Gap discharge±15kV
IEC61000-4-2,Contact Discharge±8kV
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AUTO-POWERDOWN SECTION Electrical Characteristics
Switching Characteristics
MAX3243E
3-V TO 5.5-V MULTICHANNEL RS-232LINE DRIVER/RECEIVER WITH ±15-kV IEC ESD PROTECTION
SLLS657A–APRIL 2005–REVISED JUNE 2005
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(see Figure 5)
PARAMETER
TEST CONDITIONS
MIN
MAX UNIT Receiver input threshold
FORCEON =GND,V IT+(valid) 2.7
V for INVALID high-level output voltage FORCEOFF =V CC Receiver input threshold
FORCEON =GND,V IT–(valid)–2.7V for INVALID high-level output voltage FORCEOFF =V CC Receiver input threshold
FORCEON =GND,V T(invalid)–0.30.3
V for INVALID low-level output voltage FORCEOFF =V CC
I OH =-1mA,FORCEON =GND,V OH INVALID high-level output voltage V CC –0.6
V FORCEOFF =V CC
I OL =1.6mA,FORCEON =GND,V OL
INVALID low-level output voltage
0.4V
FORCEOFF =V CC
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(see Figure 5)
PARAMETER
TEST CONDITIONS
TYP (1)
UNIT t valid Propagation delay time,low-to high-level output V CC =5V 1μs t invalid Propagation delay time,high-to low-level output V CC =5V 30μs t en Supply enable time
V CC =5V
100
μs
(1)
All typical values are at V CC =3.3V or V CC =5V,and T A =25°C.
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PARAMETER MEASUREMENT INFORMATION
TEST CIRCUIT
VOLTAGE WAVEFORMS
?3 V
?3 V
3 V 3 V 0 V
3 V
Output
Input
V OL
V OH t TLH RS-232Output
t THL
SR(tr)+
6V t THL or t TLH
NOTES: A.C L includes probe and jig capacitance.
B.The pulse generator has the following characteristics: Z O
= 50 ?, 50% duty cycle, t r ≤ 10 ns, t f ≤ 10 ns.
TEST CIRCUIT
VOLTAGE WAVEFORMS
0 V
3 V
Output Input
V OL
V OH
t PLH
RS-232Output
t PHL
NOTES:
A.C L includes probe and jig capacitance.
B.The pulse generator has the following characteristics: PRR = 250 kbit/s, Z O = 50 ?, 50% duty cycle, t r ≤ 10 ns, t f ≤ 10 ns.
50%
50%
1.5 V
1.5 V
TEST CIRCUIT
VOLTAGE WAVEFORMS
?3 V
3 V
Output
Input
V OL
V OH
t PHL
t PLH
Output
3 V or 0 V NOTES: A.C L includes probe and jig capacitance.
B.The pulse generator has the following characteristics: Z O = 50 ?, 50% duty cycle, t r ≤ 10 ns, t f ≤ 10 ns.
1.5 V
1.5 V
50%
50%
MAX3243E
3-V TO 5.5-V MULTICHANNEL RS-232LINE DRIVER/RECEIVER
WITH ±15-kV IEC ESD PROTECTION
SLLS657A–APRIL 2005–REVISED JUNE 2005
Figure 1.Driver Slew Rate
Figure 2.Driver Pulse Skew
Figure 3.Receiver Propagation Delay Times
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PARAMETER MEASUREMENT INFORMATION
TEST CIRCUIT
VOLTAGE WAVEFORMS
V OL
V OH
3 V
?3 V
NOTES: A.
C L includes probe and jig capacitance.
B.The pulse generator has the following characteristics: Z O = 50 ?, 50% duty cycle, t r ≤ 10 ns, t f ≤ 10 ns.
C.t PLZ and t PHZ are the same as t dis .
D.
t PZL and t PZH are the same as t en .
)Output
MAX3243E
3-V TO 5.5-V MULTICHANNEL RS-232LINE DRIVER/RECEIVER WITH ±15-kV IEC ESD PROTECTION
SLLS657A–APRIL 2005–REVISED JUNE 2005
Figure 4.Receiver Enable and Disable Times
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PARAMETER MEASUREMENT INFORMATION
TEST CIRCUIT
VOLTAGE WAVEFORMS
INVALID Output
Receiver
Input
INVALID CC
0 V
?
Auto-powerdown disables drivers and reduces supply current to 1 μA.
V+0 V V?V+V CC V?
NOTES: A.C L includes probe and jig capacitance.
B.The pulse generator has the following characteristics: PRR = 5 kbit/s, Z O = 50 ?, 50% duty cycle, t r ≤ 10 ns, t f ≤ 10 ns.
Supply Voltages
MAX3243E
3-V TO 5.5-V MULTICHANNEL RS-232LINE DRIVER/RECEIVER
WITH ±15-kV IEC ESD PROTECTION
SLLS657A–APRIL 2005–REVISED JUNE 2005
Figure 5.INVALID Propagation Delay Timnes and Supply Enabling Time
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C4
C1
V CC C1C2, C3, and C4
3.3 V ± 0.3 V 5 V ± 0.5 V 3 V to 5.5 V
0.1 μF
0.047 μF
0.1 μF
0.1 μF
0.33 μF
0.47 μF
?C3 can be connected to V CC
NOTES: A.Resistor values shown are nominal.
B.Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or
electrolytic capacitors are used, they should be connected as shown.V CC vs CAPACITOR VALUES
MAX3243E
3-V TO5.5-V MULTICHANNEL RS-232LINE DRIVER/RECEIVER
WITH±15-kV IEC ESD PROTECTION
SLLS657A–APRIL2005–REVISED JUNE2005
Figure6.Typical Operating Circuit and Capacitor Values
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APPLICATION INFORMATION
ESD Protection
ESD Test Conditions
Human Body Model (HBM)
R V HBM
MAX3243E
3-V TO 5.5-V MULTICHANNEL RS-232LINE DRIVER/RECEIVER
WITH ±15-kV IEC ESD PROTECTION
SLLS657A–APRIL 2005–REVISED JUNE 2005
TI MAX3243E devices have standard ESD protection structures incorporated on the pins to protect against electrostatic discharges encountered during assembly and handling.In addition,the RS232bus pins (driver outputs and receiver inputs)of these devices have an extra level of ESD protection.Advanced ESD structures were designed to successfully protect these bus pins against ESD discharge of ±15-kV in all states:normal operation,shutdown,and powered down.The MAX3243E devices are designed to continue functioning properly after an ESD occurrence without any latchup.
The MAX3243E devices have three specified ESD limits on the driver outputs and receiver inputs,with respect to GND:
?±15-kV Human Body Model (HBM)
?±15-kV IEC61000-4-2,Air-Gap Discharge (formerly IEC1000-4-2)?±8-kV IEC61000-4-2,Contact Discharge
ESD testing is stringently performed by TI,based on various conditions and procedures.Please contact TI for a reliability report that documents test setup,methodology,and results.
The Human Body Model of ESD testing is shown in Figure 7,while Figure 8shows the current waveform that is generated during a discharge into a low impedance.The model consists of a 100-pF capacitor,charged to the ESD voltage of concern,and subsequently discharged into the DUT through a 1.5k-?resistor.
Figure 7.HBM ESD Test Circuit
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APPLICATION INFORMATION
100150
200
50
1.5
1.00.5
0.0
Time (ns)
I D U T (A )
IEC61000-4-2(Formerly Known as IEC1000-4-2)
High-Voltage DC Source MAX3243E
3-V TO 5.5-V MULTICHANNEL RS-232LINE DRIVER/RECEIVER WITH ±15-kV IEC ESD PROTECTION
SLLS657A–APRIL 2005–REVISED JUNE 2005
Figure 8.Typical HBM Current Waveform
Unlike the HBM,MM,and CDM ESD tests that apply to component level integrated circuits,the IEC61000-4-2is a system-level ESD testing and performance standard that pertains to the end equipment.The MAX3243E is designed to enable the manufacturer in meeting the highest level (Level 4)of IEC61000-4-2ESD protection with no further need of external ESD protection circuitry.The more stringent IEC test standard has a higher peak current than the HBM,due to the lower series resistance in the IEC model.
Figure 9shows the IEC61000-4-2model,and Figure 10shows the current waveform for the corresponding ±8-kV Contact-Discharge (Level 4)test.This waveform is applied to a probe that has been connected to the DUT.On the other hand,the corresponding ±15-kV (Level 4)Air-Gap Discharge test involves approaching the DUT with an already energized probe.
Figure 9.Simplified IEC61000-4-2ESD Test Circuit
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APPLICATION INFORMATION
I P e a k
Machine Model
MAX3243E
3-V TO 5.5-V MULTICHANNEL RS-232LINE DRIVER/RECEIVER
WITH ±15-kV IEC ESD PROTECTION
SLLS657A–APRIL 2005–REVISED JUNE 2005
Figure 10.Typical Current Waveform of IEC61000-4-2ESD Generator
The Machine Model (MM)ESD test applies to all pins using a 200-pF capacitor with no discharge resistance.The purpose of the MM test is to simulate possible ESD conditions that can occur during the handling and assembly processes of manufacturing.In this case,ESD protection is required for all pins,not just RS-232pins.However,after PC board assembly,the MM test is no longer as pertinent to the RS-232pins.
PACKAGING INFORMATION
Orderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)
Lead/Ball Finish MSL Peak Temp (3)MAX3243ECDB ACTIVE SSOP DB 2850Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM MAX3243ECDBE4ACTIVE SSOP DB 2850
Green (RoHS &no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM MAX3243ECDBR
ACTIVE SSOP DB 282000Green (RoHS &
no Sb/Br)CU NIPDAU Level-1-260C-UNLIM MAX3243ECDBRE4ACTIVE SSOP DB 282000Green (RoHS &
no Sb/Br)CU NIPDAU Level-1-260C-UNLIM MAX3243ECDW ACTIVE SOIC DW 2820
Green (RoHS &no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM MAX3243ECDWR ACTIVE SOIC DW 281000Green (RoHS &
no Sb/Br)CU NIPDAU Level-1-260C-UNLIM MAX3243ECPW ACTIVE TSSOP PW 2850Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM MAX3243ECPWE4ACTIVE TSSOP PW 2850
Green (RoHS &no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM MAX3243ECPWR ACTIVE TSSOP PW 282000Green (RoHS &
no Sb/Br)CU NIPDAU Level-1-260C-UNLIM MAX3243ECPWRE4ACTIVE TSSOP PW 282000Green (RoHS &
no Sb/Br)CU NIPDAU Level-1-260C-UNLIM MAX3243ECRHBR ACTIVE QFN RHB 323000Green (RoHS &
no Sb/Br)CU NIPDAU Level-2-260C-1YEAR MAX3243ECRHBRG4
ACTIVE QFN RHB 323000Green (RoHS &
no Sb/Br)CU NIPDAU Level-2-260C-1YEAR MAX3243EIDB ACTIVE SSOP DB 2850
Green (RoHS &no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM MAX3243EIDBR ACTIVE SSOP DB 282000Green (RoHS &
no Sb/Br)CU NIPDAU Level-1-260C-UNLIM MAX3243EIDW ACTIVE SOIC DW 2820
Green (RoHS &no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM MAX3243EIDWR ACTIVE SOIC DW 281000Green (RoHS &
no Sb/Br)CU NIPDAU Level-1-260C-UNLIM MAX3243EIPW ACTIVE TSSOP PW 2850Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM MAX3243EIPWE4ACTIVE TSSOP PW 2850
Green (RoHS &no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM MAX3243EIPWR ACTIVE TSSOP PW 282000Green (RoHS &
no Sb/Br)CU NIPDAU Level-1-260C-UNLIM MAX3243EIPWRE4ACTIVE TSSOP PW 282000Green (RoHS &
no Sb/Br)CU NIPDAU Level-1-260C-UNLIM MAX3243EIRHBR ACTIVE QFN RHB 323000Green (RoHS &
no Sb/Br)CU NIPDAU Level-2-260C-1YEAR MAX3243EIRHBRG4
ACTIVE
QFN
RHB
32
3000Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1YEAR
(1)
The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.
LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.
NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.
PREVIEW:Device has been announced but is not in production.Samples may or may not be available.
https://www.wendangku.net/doc/0a13451338.html,
12-Sep-2006
OBSOLETE:TI has discontinued the production of the device.
(2)
Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check https://www.wendangku.net/doc/0a13451338.html,/productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.
Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)
(3)
MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual
basis.
https://www.wendangku.net/doc/0a13451338.html,
12-Sep-2006