PACKAGING INFORMATION
Orderable Device Status(1)Package
Type Package
Drawing
Pins Package
Qty
Eco Plan(2)Lead/Ball Finish MSL Peak Temp(3)
SN74LV4052AD ACTIVE SOIC D1640Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LV4052ADBR ACTIVE SSOP DB162000Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LV4052ADBRE4ACTIVE SSOP DB162000Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LV4052ADE4ACTIVE SOIC D1640Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LV4052ADGVR ACTIVE TVSOP DGV162000Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LV4052ADGVRE4ACTIVE TVSOP DGV162000Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LV4052ADR ACTIVE SOIC D162500Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LV4052ADRE4ACTIVE SOIC D162500Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LV4052AN ACTIVE PDIP N1625Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
SN74LV4052ANSR ACTIVE SO NS162000Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LV4052ANSRE4ACTIVE SO NS162000Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LV4052APW ACTIVE TSSOP PW1690Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LV4052APWE4ACTIVE TSSOP PW1690Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LV4052APWG4ACTIVE TSSOP PW1690Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LV4052APWR ACTIVE TSSOP PW162000Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LV4052APWRE4ACTIVE TSSOP PW162000Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LV4052APWRG4ACTIVE TSSOP PW162000Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LV4052APWT ACTIVE TSSOP PW16250Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LV4052APWTE4ACTIVE TSSOP PW16250Green(RoHS&
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LV4052ARGYR ACTIVE QFN RGY161000Green(RoHS&
no Sb/Br)
CU NIPDAU Level-2-260C-1YEAR
(1)The marketing status values are defined as follows:
ACTIVE:Product device recommended for new designs.
LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.
NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.
PREVIEW:Device has been announced but is not in production.Samples may or may not be available.
OBSOLETE:TI has discontinued the production of the device.
(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS)or Green(RoHS&no Sb/Br)-please check https://www.wendangku.net/doc/193228372.html,/productcontent for the latest availability information and additional product content details.
TBD:The Pb-Free/Green conversion plan has not been defined.
Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.
Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)
(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.
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