CERAMIC CHIP CAPACITORS
C 0805C 103K 5R A C*
CERAMIC SIZE CODE
SPECIFICATION C - Standard
CAPACITANCE CODE
Expressed in Picofarads (pF)
First two digits represent significant figures.Third digit specifies number of zeros. (Use 9
for 1.0 through 9.9pF. Use 8 for 0.5 through 0.99pF)(Example: 2.2pF = 229 or 0.50 pF = 508)CAPACITANCE TOLERANCE B –±0.10pF J –±5%C –±0.25pF K –±10%D –±0.5pF M –±20%F –±1%P – (GMV) – special order only G –±2%Z – +80%, -20%
DIMENSIONS—MILLIMETERS AND (INCHES)
CAPACITOR ORDERING INFORMATION ?C0G (NP0), X7R, X5R, Z5U and Y5V Dielectrics ?10, 16, 25, 50, 100 and 200 Volts
?Standard End Metalization: Tin-plate over nickel barrier
?Available Capacitance Tolerances: ±0.10 pF; ±0.25pF; ±0.5 pF; ±1%; ±2%; ±5%; ±10%; ±20%; and +80%-20%
?Tape and reel packaging per EIA481-1. (See page 92 for specific tape and reel information.) Bulk Cassette packaging (0402, 0603, 0805 only) per IEC60286-6 and EIAJ 7201.?RoHS Compliant
FEATURES
END METALLIZATION
C-Standard (Tin-plated nickel barrier)
FAILURE RATE LEVEL
A- Not Applicable
TEMPERATURE CHARACTERISTIC
Designated by Capacitance Change Over Temperature Range G – C0G (NP0) (±30 PPM/°C)R – X7R (±15%) (-55°C + 125°C)P– X5R (±15%) (-55°C + 85°C)
U – Z5U (+22%, -56%) (+10°C + 85°C)V – Y5V (+22%, -82%)(-30°C + 85°C)
VOLTAGE 1 - 100V 3 - 25V 2 - 200V 4 - 16V 5 - 50V 8 - 10V
* Part Number Example: C0805C103K5RAC (14 digits - no spaces)or
Solder Reflow
METRIC SIZE CODE (Ref only)
1005
16082012321632254532456456505664
EIA SIZE CODE
0402*
0603*0805*1206*1210*18121825*22202225
(Standard Chips - For
Military see page 87)
9 - 6.3V
7 - 4V EIA SIZE CODE
METRIC SIZE CODE
L - LENGTH W - WIDTH T
THICKNESS
B - BANDWIDTH S
SEPARATION minimum
MOUNTING TECHNIQUE 0201*06030.6 (.024) ± .03 (.001) 0.3 ± (.012) ± .03 (.001) 0.15 (.006) ± .05 (.002)N/A 0402*1005 1.0 (.04) ± .05 (.002)0.5 (.02) ± .05 (.002)0.20 (.008) -.40 (.016)0.3 (.012)06031608 1.6 (.063) ± .15 (.006)0.8 (.032) ± .15 (.006)0.35 (.014) ± .15 (.006)0.7 (.028)0805*2012 2.0 (.079) ± .20 (.008) 1.25 (.049) ± .20 (.008)0.50 (.02) ± .25 (.010)0.75 (.030)
1206*3216 3.2 (.126) ± .20 (.008) 1.6 (.063) ± .20 (.008)0.50 (.02) ± .25 (.010)N/A 1210*3225
3.2 (.126) ± .20 (.008) 2.5 (.098) ± .20 (.008)0.50 (.02) ± .25 (.010)N/A 18124532
4.5 (.177) ± .30 (.012) 3.2 (.126) ± .30 (.012)0.60 (.024) ± .35 (.014)N/A 1825*
4564 4.5 (.177) ± .30 (.012) 6.4 (.252) ± .40 (.016)0.60 (.024) ± .35 (.014)N/A 22205650 5.6 (.220) ± .40 (.016) 5.0 (.197) ± .40 (.016)0.60 (.024) ± .35 (.014)N/A 22255664 5.6 (.220) ± .40 (.016)
6.3 (.248) ± .40 (.016)
0.60 (.024) ± .35 (.014)
N/A
* Note: Indicates EIA Preferred Case Sizes (Tightened tolerances apply for 0402, 0603, and 0805 packaged in bulk bassette, see page 96.)+ For extended value 1210 case size - solder reflow only.
Solder Wave +
or
Solder Reflow
Solder Reflow
See page 78
for thickness dimensions.
Solder Reflow
CERAMIC CHIP/STANDARD
X5R CAPACITANCE RANGE
50 Volt Ceramic Chips can be used for 63 volt applications.* EIA preferred chip sizes
C0805*C1206*C1210*C1812*C1825*C2225
100V 50V 100V 50V 100V 50V KC
KC KC
100V 50V 100V 50V 100V DC DC DC DC DC DC DC DC DC DD DD DD DD DD DD 50V M,Z M,Z M,Z M,Z M,Z M,Z M,Z M,Z M,Z M,Z M,Z M,Z M,Z M,Z M,Z M,Z M,Z M,Z M,Z M,Z M,Z M,Z M,Z M,Z M,Z M,Z M,Z M,Z M,Z M,Z M,Z CAP TOL 682822103123153183223273333393473563683823104124154184224274334394474564684824105125155185225CAP CODE 6800820010,00012,00015,00018,00022,00027,00033,00039,00047,00056,00068,00082,000100,000120,000150,000180,000220,000270,000330,000390,000470,000560,000680,000820,0001,000,0001,200,0001,500,0001,800,0002,200,000CAP .PF DC DC DC EB EB EB EB EB EB EB EB EB EB EB EB EB EC
EC
EC
EC EB EB EB EB EB EB EB EC EC EB EB EB EB FB FB FB FB FB FB FC FC FC FC FD FD FD FD FD FF FH FB FB FB FC FD FD FD GB GB GB GB GB GB GB GB GB GB GC GC GE GE GB GB GB GB HB HB HB HB HB HB HB HB HB HB HB HB HB HB HB HB HB HB HD KB
KB KB KB KB KB KB KB KC KD KD M,Z
2752,700,000
KD
Z5U CAPACITANCE RANGE
(KEMET's Z5U also meets Y5V Characteristics)
50V 100V 50V 100V 50V 100V 50V 100V 50V 100V 50V
100V 6,800
682
M,Z DC DC 8,200822
M,Z DC DC 10,000103
M,Z DC DC EB EB 12,000123M,Z DC EB
EB 15,000153M,Z DC EB
EB 18,000183M,Z DC EB
EB 22,000223M,Z DC EB
EB 27,000273M,Z DC EB
EB 33,000333M,Z DC EB
EB 39,000393M,Z DD EB
EC 47,000473M,Z DD EB
EC FB FB 56,000563M,Z DD EB
EB FB FB 68,000683M,Z DD EB
EB FB FB 82,000823M,Z DD EB
EB FB FC GB GB 100,000104M,Z DD EB EB
FB FD GB GB 120,000124M,Z EC FB FD GB GB 150,000154M,Z EC FC FD GB GB 180,000184M,Z EC FC GB HB HB 220,000224M,Z EC FC GB HB HB 270,000274M,Z FC GB HB HB 330,000334M,Z FD GB HB HB KB KC 390,000394M,Z FD GB HB HD KB KC 470,000474M,Z FD GB HB KB KC 560,000564M,Z FD GC HB KB 680,000684M,Z FD GC HB KB 820,000824M,Z FF GE HB KB 1,000,000105M,Z FH GE HB KB 1,200,000125M,Z HB KB 1,500,000155M,Z HB KC 1,800,000185M,Z HB KD 2,200,000225M,Z HB KD 2,700,000275M,Z KD C1825*C2225Cap pF
Cap Code
Cap Tol.C0805*
C1206*C1210*C1812*See page 78 for Thickness Code Reference Chart.
NOTE: For non-standard capacitance values or voltages, contact your local KEMET sales representative.+Reflow only
° Available M ±20% tolerance only
Improved product with higher ratings and tighter capacitance tolerance product may be substituted within the same size (length, width, and thickness) at KEMET's option.Reels with such substitutions will be marked with the improved KEMET part numbers.
6.3V 16V 6.3V
10V 16V 6.3V
10V
16V
25V
4V
6.3V 10V 16V 25V 6.3V
10V 16V 25V
6.3V 10V 16V 25V
50V
10,000103K,M AA~
12,000123K,M BB BB
BB 15,000153K,M BB BB BB 18,000183K,M BB BB BB 22,000223K,M BB BB BB 27,000273K,M BB BB BB 33,000333K,M BB BB BB 39,000393K,M BB BB BB 47,000473K,M BB BB BB 56,000563K,M BB BB BB 68,000683K,M BB BB BB 82,000823K,M BB
BB BB 100,000104K,M AA~BB
BB
BB
120,000124K,M 150,000154K,M 180,000184K,M 220,000224K,M BB
270,000274K,M CC CC CC EB 330,000334K,M CC CC CC EB 390,000394K,M CC CC CC EB 470,000474K,M CC CC CC DC EC 560,000564K,M CC CC CC DD ED 680,000684K,M CC CC CC DE EE 820,000824K,M CC CC CC DF EF 1,000,000105K,M BB BB CC
CC
CC
CD
DG DG DG DG
EH FH+FH+FH+1,200,000125K,M DD DD DD EC FD+FD+1,500,000155K,M DE DE DE EC EC EC EC FD+FD+1,800,000185K,M DH DH DH EC EC EC EC FD+FD+2,200,000225K,M BB°CC+CC+CC+DD DG DD EE EE EE EE FG+FG+2,700,000275K,M EF EF EF EF FG+FG+3,300,000335K,M DE DE DH EH EH EH EH FH+FH+4,700,000475K,M CD+
DH
DH
DH
EH EH EH EH
FK+
FK+FK+FK+
5,600,000565K,M 6,800,000685K,M ED ED EH FJ+FJ+FJ+FF+8,200,000825K,M ED ED EH FK+FK+FK+FG+10,000,000106K,M CD°+DJ+DJ+DK+
EH
EH
EH
EH+FK+FK+FK+FH+
12,000,000126K,M FD+FD+FG+15,000,000156K,M FD+FD+FL+18,000,000186K,M FL+FL+FH+22,000,000226K,M DH°+EH+
FH+FH+FJ+
27,000,000276K,M 33,000,000336K,M 39,000,000396K,M 47,000,000476K,M DJ°+
EH°+FQ°+100,000,000
107
K,M
EH°+FQ°+
C1206*C1210*
C0402*C0805*
Cap pF Cap Code Cap Tolerance
C0603*0201
CERAMIC CHIP CAPACITORS
This chart refers to ceramic chip thickness codes on pages 73-76.
Thickness Code Reference Chart
Packaging Quantity Based on Finished Chip Thickness Specifications
Thickness Code
Chip Size
Chip Thickness Range (mm)
Qty per Reel 7" Plastic
Qty per Reel 13" Plastic
Qty per Reel 7" Paper
Qty per Reel 13" Paper
Qty per Bulk Cassette
AA 0201.30 ± .03N/A N/A 15,000N/A N/A BB 0402 .50 ± .05N/A N/A 10,00050,00050,000CB 0603 .80 ± .07N/A N/A 4,00010,00015,000CC 0603 .80 ± .10N/A N/A 4,00010,000N/A CD 0603.80 ± .15N/A N/A 4,00010,000N/A DB 0805 .60 ± .10N/A N/A N/A N/A 10,000DC 0805 .78 ± .104,00010,0004,00010,000N/A DD 0805 .90 ± .104,00010,000N/A N/A N/A DE 0805 1.00 ± .102,50010,000N/A N/A N/A DF 0805 1.10 ± .102,50010,000N/A N/A N/A DG 0805 1.25 ± .152,50010,000N/A N/A N/A DH 0805 1.25 ± .202,50010,000N/A N/A N/A DJ 0805 1.25 ± .203,00010,000N/A N/A N/A DK 0805 1.25 ± .153,00010,000N/A N/A N/A EB 1206 .78 ± .104,00010,0004,00010,000N/A EC 1206 .90 ± .104,00010,000N/A N/A N/A ED 1206 1.00 ± .102,50010,000N/A N/A N/A EE 1206 1.10 ± .102,50010,000N/A N/A N/A EF 1206 1.20 ± .152,50010,000N/A N/A N/A EG 1206 1.60 ± .152,0008,000N/A N/A N/A EH 1206 1.60 ± .202,0008,000N/A N/A N/A EJ 1206 1.70 ± .202,0008,000N/A N/A N/A EK 1206.80 ± .102,0008,000N/A N/A N/A EL 1206 1.15 ± .152,0008,000N/A N/A N/A EM 1206 1.25 ± .152,50010,000N/A N/A N/A EN 12060.95 ± .104,00010,000N/A N/A N/A FB 1210 .78 ± .104,00010,000N/A N/A N/A FC 1210 .90 ± .104,00010,000N/A N/A N/A FD 1210 .95 ± .104,00010,000N/A N/A N/A FE 1210 1.00 ± .102,50010,000N/A N/A N/A FF 1210 1.10 ± .102,50010,000N/A N/A N/A FG 1210 1.25 ± .152,50010,000N/A N/A N/A FH 1210 1.55 ± .152,0008,000N/A N/A N/A FJ 1210 1.85 ± .202,0008,000N/A N/A N/A FK 1210 2.10 ± .202,0008,000N/A N/A N/A FL 1210 1.40 ± .152,0008,000N/A N/A N/A FM 1210 1.70 ± .202,0008,000N/A N/A N/A FN 1210 1.85 ± .202,0008,000N/A N/A N/A FO 1210 1.50 ± .202,0008,000N/A N/A N/A FP 1210 1.60 ± .202,0008,000N/A N/A N/A FQ 1210 2.5 ± .201,5008,000N/A N/A N/A FR 1210 2.25 ± .202,0008,000N/A N/A N/A FS 1210 2.50 ± .201,0004,000N/A N/A N/A GB 1812 1.00 ± .101,0004,000N/A N/A N/A GC 1812 1.10 ± .101,0004,000N/A N/A N/A GD 1812 1.25 ± .151,0004,000N/A N/A N/A GE 1812 1.30 ± .101,0004,000N/A N/A N/A GF 1812 1.50 ± .101,0004,000N/A N/A N/A GG 1812 1.55 ± .101,0004,000N/A N/A N/A GH 1812 1.40 ± .151,0004,000N/A N/A N/A GJ 1812 1.70 ± .151,0004,000N/A N/A N/A GK 1812 1.60 ± .201,0004,000N/A N/A N/A GL 1812 1.90 ± .201,0004,000N/A N/A N/A GM 1812 2.00 ± .201,0004,000N/A N/A N/A GN 1812 1.70 ± .201,0004,000N/A N/A N/A HB 1825 1.10 ± .151,0004,000N/A N/A N/A HC 1825 1.15 ± .151,0004,000N/A N/A N/A HD 1825 1.30 ± .151,0004,000N/A N/A N/A HE 1825 1.40 ± .151,0004,000N/A N/A N/A HF 1825 1.50 ± .151,0004,000N/A N/A N/A JB 2220 1.00 ± .151,0004,000N/A N/A N/A JC 2220 1.10 ± .151,0004,000N/A N/A N/A JD 2220 1.30 ± .151,0004,000N/A N/A N/A JE 2220 1.40 ± .151,0004,000N/A N/A N/A JF 2220 1.50 ± .151,0004,000N/A N/A N/A KB 2225 1.00 ± .151,0004,000N/A N/A N/A KC 2225 1.10 ± .151,0004,000N/A N/A N/A KD 2225 1.30 ± .151,0004,000N/A N/A N/A KE 2225 1.40 ± .151,0004,000N/A N/A N/A
KEMET offers Multilayer Ceramic Chip Capacitors packaged in 8mm and 12mm plastic tape on 7" and 13" reels in accordance with EIA standard 481-1:Taping of surface mount components for automatic handling. This packaging system is compatible with all fed automatic pick and place systems. See page 78for details on reeling quantities for commercial chips and page 87 for MIL-PRF-55681 chips.
CERAMIC CHIP CAPACITORS
Packaging Information
Embossed Carrier*0402 and 0603 case sizes available on punched paper only.
Embossment
Anti-Static Cover Tape
(.10mm (.004") Max Thickness)
Chip Orientation in Pocket
(except 1825 Commercial, and 1825 & 2225 Military)
* Punched paper carrier used for 0402 and 0603 case size.
g
handling. This packaging system is compatible with all tape fed automatic pick and place systems. See page 81for details on reeling quantities for commercial chips and page 90 for MIL-PRF-55681 chips.
K E
M E
T ?
0.741.081.602.002.903.706.905.506.80Y(ref)0.931.051.301.501.501.801.801.851.85C(ref)1.211.732.003.003.004.104.105.155.15
Z 3.183.704.904.90
G
0.68
0.701.501.50
X 0.801.101.402.00
Y(ref)1.251.501.701.70
Smin 1.932.203.203.20
Wave Solder
Reflow Solder
Not Recommended
Not Recommended
SURFACE MOUNT LAND DIMENSIONS - CERAMIC CHIP CAPACITORS - MM
P a c k a g i n g
Performance Notes
1.Cover Tape Break Force: 1.0 Kg Minimum.
2.Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width Peel Strength
8 mm 0.1 Newton to 1.0 Newton (10g to 100g)12 mm 0.1 Newton to 1.3 Newton (10g to 130g)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165?to 180?from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute.
3.Reel Sizes:Molded tantalum capacitors are available on either 180 mm (7") reels (standard) or 330 mm (13")reels (with C-7280). Note that 13” reels are preferred.
https://www.wendangku.net/doc/1a5732802.html,beling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes.Refer to EIA-556.
Embossed Carrier Tape Configuration: Figure 1
NOTES
1.B1 dimension is a reference dimension for tape feeder clearance only.
2.The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and hole location shall be applied independent of each other.
3.Tape with components shall pass around radius “R ” without damage (see sketch A). The minimum trailer length (Fig. 2) may require additional length to provide R min. for 12 mm embossed tape for reels with hub diameters approaching N min. (Table 2)
4.The cavity defined by A ,B ,and K shall be configured to surround the part with sufficient clearance such that the chip does not pro-Table 1 — EMBOSSED TAPE DIMENSIONS (Metric will govern)
Constant Dimensions — Millimeters (Inches)
Tape Size D 0
E
P 0
P 2
T Max T 1Max 8 mm 1.5 1.75 ±0.10 4.0 ±0.10 2.0 ±0.050.6000.100and +0.10 -0.012 mm
(0.059(0.069 ±0.004)(0.157 ±0.004)
(0.079 ±0.002)
(0.024)
(0.004)
+0.004, -0.0)Variable Dimensions — Millimeters (Inches)
Tape Size Pitch B 1Max.D 1Min.F P 1
R Min.T 2Max W A 0B Note 1Note 2Note 3Note 4
8 mm
Single 4.4 1.0
3.5 ±0.05
4.0 ±0.10
25.0
2.58.0 ±0.30(4 mm)
(0.173)
(0.039)(0.138 ±0.002)(0.157 ±0.004)(0.984)(0.098)
(.315 ±0.012)
12 mm
Double 8.2 1.5 5.5 ±0.058.0 ±0.1030.0 4.612.0 ±0.30(8 mm)
(0.323)
(0.059)(0.217 ±0.002)
(0.315 ±0.004)(1.181)
(0.181)(0.472 ±0.012)
Packaging Information
Embossed Carrier Tape Configuration (cont.)
Sketch D: Tape Camber (Top View)
Allowable camber to be 1 mm/250 mm.
250mm (9.843)
1mm (0.039) Max.
(Metric will govern)
Reel Dimensions (Metric Dimensions will govern)
N Min W 1W 2Max W 3
50.08.414.47.9 Min (1.969)+1.5, -0.0(0.567)(0.311)See (0.33110.9 Max Note 3+0.059, -0.0)
(0.429)Table 1
12.418.411.9 Min Packaging Information
400mm (15.75) Min.
20°
20°Maximum
component rotation.
Typical
Punched Carrier (Paper T ape) Configuration (Ceramic Chips Only):
T able 1: 8 & 12mm Punched T ape (Metric Dimensions Will Govern)
V ariable Dimensions - Millimeters (Inches)
Note:
1. A 0, B 0 and T determined by the maximum dimensions to the ends of the terminals extending from the body and/or the body dimensions of the component. The clearance between the ends of the terminals or body of the component to the sides and depth of the cavity (A 0, B 0 and T) must be within 0.05mm (.002)minimum and 0.50mm (.020) maximum. The clearance allowed must also prevent rotation of the component within the cavity of not more than 20 degrees (see sketches A and B).
2. Tape with components shall pass around radius "R" without damage.
3. KEMET nominal thicknesses are: 0402 = 0.6mm and all others 0.95mm minimum.
8mm and 12mm 1.5+0.10, -0.0(.059+0.004, -0.0)
1.75 ±0.10(.069 ±0.004) 4.0 ± 0.10(.157 ± 0.004)
2.0 ± 0.05(.079 ± 0.002)0.10(.004)Max.0.75(.030)Min.0.75(.030)Min.25 (.984)See Note 2Table 1
T ape Size
D 0
P 0
E
P 2
T 1
G 1
G 2
R Min.
8mm 1/2Pitch 2.0 ± 0.10(.079 ±.004)
See Require-ments
Section 3.3 (d) 3.5 ± 0.05(.138 ± .002)8.0 ± 0.3(.315 ± 0.012)
See Note 1Table 1
1.1mm (.043)Max. for Paper Base Tape and 1.6mm (.063)Max. for Non-Paper Base Compositions.See Note 3.
T ape Size
P 1
W
F
A 0B 0
T
8mm 4.0 ± 0.10(0.157 ± .004)12mm
4.0 ± 0.10(0.157 ± .004)
12mm Double Pitch
8.0 ± 0.10(0.315 ± .004)12.0 ± 0.3(.472 ± .012)
5.5 ± 0.05
(.217 ± .002)T able 1: 8 & 12mm Punched T ape (Metric Dimensions Will Govern)
Constant Dimensions - Millimeters (Inches)
Sketch B:Max. Component Rotation - Front Cross Sectional View
Sketch C:
Component Rotation - Top View
A 0
B 0
P 1
P 0
P 2
D 0
F
E
W
Center lines of cavity
10 pitches cumulative tolerance on tape ±0.2 (±0.008)
Top Tape Cover
T
User Direction of Feed
T 1
Max. Cavity Size See Note 1Table 1
Bottom Tape Cover
G 2
R
(Min.)
Sketch A:
Bending Radius See Note 2Table 1
CERAMIC CHIP CAPACITORS
Packaging Information
CERAMIC CHIP CAPACITORS
Packaging Information
CAPACITOR MARKING TABLE (Marking Optional - Not Available for 0402 Size or Y5V Dielectric)
A B C D E F G H J K L M N P Q R 0.100.110.120.130.150.160.180.200.220.240.270.300.330.360.390.43 1.01.11.21.31.51.61.82.02.22.42.73.03.33.63.94.310111213151618202224273033363943100110120130150160180200220240270300330360390430100011001200130015001600180020002200240027003000330036003900430010,00011,00012,00013,00015,00016,00018,00020,00022,00024,00027,00030,00033,00036,00039,00043,000100,000110,000120,000130,000150,000160,000180,000200,000220,000240,000270,000300,000330,000360,000390,000430,000Alpha Character
Numeral
9
1
2
3
4
Capacitance (pF) For Various Numeral Identifiers
Laser marking is available as an extra-cost option for most KEMET ceramic chips. Such marking is two sided, and includes a K to identify KEMET, followed by two characters (per EIA-198 - see table below) to identify the capacitance value. Note that marking is not available for size 0402 nor for any Y5V chip. In addition, the 0603 marking option is limited to the K Example shown is 1,000 pF capacitor.
KA3
Table 2 – Capacitance Values Available
In Bulk Cassette Packaging
040206030805
All All C0G
X7R
Y5V
All All 109109109221221221221221104104
All All 181331102392103273104104224224
Case Size Dielectric Voltage Min.Cap Value Max.
Cap Value All All 200100502001005025162516
Terminations: KEMET nickel barrier layer with a tin overplate.
0.30.70.75
EIA Size Code Length L
Bandwidth
B Minimum Separation
S
Metric Size Code Number of Pcs/Cassette
50,00015,00010,000
040206030805
1.0 ± 0.051.6 ± 0.07
2.0 ± 0.100.2 to 0.40.2 to 0.50.5 to 0.75
100516082012
Table 1 – Capacitor Dimensions for Bulk
Cassette Packaging – Millimeters
110 ± 0.7
19.0*
5.0*
P a c k a g i n g