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通用型贴片电容规格书(选型手册)

通用型贴片电容规格书(选型手册)
通用型贴片电容规格书(选型手册)

【 南京南山半导体有限公司 — 贴片电容选型资料】
https://www.wendangku.net/doc/1610928343.html,
MULTILAYER CHIP CERAMIC CAPACITOR
COG/COH
COG
, ,
-55
125
,
0
30ppm/
0
60ppm/
0805
CG
101
J
500
N
T
(PF) ( 0402 0.04 0603 0.06 0805 0.08 1206 0.12 ) 0.02 0.03 0.05 0.06 1.00 1.60 2.00 3.20 ( ) 0.50 0.80 1.25 1.60 CG CH COG NPO COH 100 101 102 10 10
0 1
J G C B D
5.00% 2.00% 0.25PF 0.10PF 0.50PF
10 10 10 10
2
6R3 100 250 500
6.3V 10V 25V 50V
S C N / / T B
WB
W
T
L mm L 0402 0603 0805 1206 1005 1608 2012 3216 1.00 1.60 2.00 3.20 0.05 0.10 0.20 0.30 W 0.50 0.80 1.25 1.60 0.05 0.50 0.10 0.80 0.20 0.80 1.00 1.25 0.20 0.80 1.00 1.25 T WB 0.05 0.25 0.10 0.30 0.20 0.50 0.20 0.20 0.20 0.60 0.20 0.20 0.10 0.10 0.20 0.30
15

【 南京南山半导体有限公司 — 贴片电容选型资料】
https://www.wendangku.net/doc/1610928343.html,
0.80 0.20 1.00 0.20 0.50 0.80 0.20 1.00 0.20 0.60
0.20 0.30

【 南京南山半导体有限公司 — 贴片电容选型资料】
https://www.wendangku.net/doc/1610928343.html,
MULTILAYER CHIP CERAMIC CAPACITOR
COG/COH 0402 0603 0805 1206
6.3V 10V 16V 25V 50V 6.3V 10V 16V 25V 50V 6.3V 10V 16V 25V 50V 6.3V 10V 16V 25V 50V
0.5PF 1PF 2PF 3PF 4PF 5PF 6PF 7PF 10PF 22PF 33PF 47PF 68PF 100PF 120PF 150PF 180PF 220PF 330PF 470PF 560PF 680PF 1000PF 2200PF 2700PF 3300PF 4700PF 5600PF 6800PF 10nF 12nF 15nF 22nF 47nF 68nF 100nF
17

【 南京南山半导体有限公司 — 贴片电容选型资料】
https://www.wendangku.net/doc/1610928343.html,
0402
0603
0805
1206
6.3V 10V 16V 25V 50V 6.3V 10V 16V 25V 50V 6.3V 10V 16V 25V 50V 6.3V 10V 16V 25V 50V
Capacitance
0.5PF 1PF 2PF 3PF 4PF 5PF 6PF 7PF 10PF 22PF 33PF 47PF 68PF 100PF 120PF 150PF 180PF 220PF 330PF 470PF 560PF 680PF 1000PF 2200PF 2700PF 3300PF 4700PF 5600PF 6800PF 10nF 12nF 15nF 22nF 47nF 68nF 100nF

【 南京南山半导体有限公司 — 贴片电容选型资料】
https://www.wendangku.net/doc/1610928343.html,
MULTILAYER CHIP CERAMIC CAPACITOR
COG COH
PH~SL
COG PH SH SL TH RH UJ
COH
1
-55
125
-55
85
1. 2. 3. 2 4. 5. , , , , , 10
3 4 Cr 5PF 0.56% -4 5PF Cr 50PF 1.5 [(150/Cr)+7] 10 Cr 50PF 0.15% C C 10nF Ri 10nF Ri 5 10 Cr 500s 3 50mA 150+0/-10 8 25 9 75 235 5 2 0.5 25 60 265 10 1 25 : 1 2 100 170 120 200 1 1 2.5mm/ 24 2 5 5 5 2.5mm/ 245 24 -55 125 2 -55 85 60 5
10
:HP4278A 1. 2. 3. (D.F.) :1.0 C : : (
HP4284 25 5 0.2V 0.1MHz; 0.1KHZ ) 1000PF,1.0 :SF2511 , 60 60 1 5 :30% 75%
5
:C<1000PF,1.0
6
I.R.
7
>3x
150+0/-10 5% 0.5PF D.F. 10 I.R. 24 2
45

【 南京南山半导体有限公司 — 贴片电容选型资料】
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General COG
COH
PH
SL MLCC reliability test method
Standard Number Item COG COH MLCC for General-use -55 125 PH, RH, SH, TH, UJ, SL MLCC for General-use -55 85 Check by using microscope 10 . Test Method
1
Operating Temperature Range
Appearance
2
1.Good ceramic body color continuity. 2.The chips have no visual damages and must be very smooth. 3.No exposed inner- electrode, no cracks or holes. 4.The outer electrode should have no cracks, holes, damages or surface oxidation. 5.Outer electrode no prolongation or the prolongation is less than half of that of the termination width.
3 4 5
Dimensions Capacitance Dissipation Factor (DF)
Within the specified dimensions Within the specified tolerance Cr 5PF 0.56% 5PF Cr 50PF 1.5 [(150/Cr)+7] 10-4 Cr 50PF 0.15% C C 10nF Ri 10nF Ri 5 1010 Cr 500s
Using micrometer or vernier calipers Measuring Equipments:HP4278 capacitance meter,HP4284 capacitance, Measuring Conditions: 1.Measuring Temperature:25 5 .Humidity: 30% 75%. 2.Measuring Voltage:1.0 0.2V. 3.Measuring Frequency:C<1000PF 1.0 0.1MHz C 1000PF 1.0 0.1KHz Measuring Equipment:Insulation resistance meter (such as Sf2511 insulation resistance). Measuring Method:Must measure at rated voltage, and measure the IR within 60 5 seconds. Must measure at 3 times rated voltage, dwell time: 60 1 seconds, no short and the changing/discharging current less than 50mA. First, pre-heat: heat treat 60 5 minutes at 150+0/-10 , then set it for 24 2 hours at room temperature. Measure the capacitance at -55 125 or -55 85 , the capacitance change ratio comparing to that of 25 must be within the specified range. Dip the capacitor into ethanol or colophony solution, and then dip it into 235 5 ( or 245 5 leadless eutedtic solder solution ) eutectic solder solution hanving lead for 2 0.5 seconds. Dipping speed: 25 2.5mm/second. First pre-heat: heat treat for 60 5 minutes at 150+0/-10 , then set it for 24 2 hours at room temperature. Then pre-heat the capacitance according to the following chart. Dip the capacitor into 265 5 eutectic solder solution for 10 1 seconds. Then set it for 24 2 hours at room temperature, then measure. Dipping speed: 25 2.5mm/second. Preheat conditions: Stage 1 2 Temperature 100 170 120 200 Time 1minute 1minute
6
Insulation Resistance
7
Withstanding Voltage Capacitance Temperature Characteristic
>3x rated continuous working voltage Must meet the capacitor character temperature coefficient requirements within the operating temperature range. Tin coverage should be 75% of the outer electrode Appearance Cap. Change ratio DF No defects visible 5%or 0.5PF (whichever is larger)
8
9
Solderability
Resistance to Soldering
10
Same as original spec Same as original spec
IR
46

【 南京南山半导体有限公司 — 贴片电容选型资料】
https://www.wendangku.net/doc/1610928343.html,
MULTILAYER CHIP CERAMIC CAPACITOR
1 10N
11 10N,10 1 :1.0mm/ 1
1.5mm 10 D.F. 12 55Hz 2
10 55Hz 10Hz 6 1
2
3 4
20 mm mm
mm
13
mm
mm
mm
mm
150+0/-10 14 24 2 24 2
60 5
47

【 南京南山半导体有限公司 — 贴片电容选型资料】
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Number
Items Adhesive Strength of Termination
Standard No removal of the terminations or other defect shall occur
Test Method Solder the capacitor to the test jig (glass epoxy resin board) shown in Fig.1 using a eutectic solder.Then apply a 10N force inthe direction shown as the arrowhead.The aoldering shall be done either with an iron or using the reflow method and shall be conducted with care so that an iron or using the refow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock,etc. 10N,10 1s Speed:1.0mm/s Glss epoxy resinboard
11
Fig.1 Vibration Resistance Appearance Capacitance No defects or abnormities Within the specified tolerance range Same as original spec
12
DF
Solder the capacitor to the test jig (glass epoxy resin board). The capacitor should be subjected to a simple harmonic motion having a total amplitude of 1.5mm, the frequency being varied uniformly between the approximate limits of 10 and 55Hz, shall be traversed (from 10 Hz to 55 Hz then 10 Hz again) in approximately 1 minute.This motion shall be applied for a period of 2 hours in each 3 mutually perpendicular directions (total is 6 hours).
Same i standar
Fif.2 Bending Resistance No cracks or other defects shall occur Solder the capacitor to the test jig (glass epoxy resin board) shown in Fig.3 using a eutectic solder. Then apply a 10N force in the direction shown as Fig.4. The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as mm heat shock, etc.
mm
13
mm mm mm
14
Temperature Cycle
Appearance No defects or abnormities
Pre-treatment: Heat-treat the capacitor for 60 5minutes at 150+0/-10 , then set it for 24 2 hours at room temperature. Perform five cycles according to the four heat treatments listed in the following table. Set it for 24 2 hours at room temperature, then measure.
48
mm

【 南京南山半导体有限公司 — 贴片电容选型资料】
https://www.wendangku.net/doc/1610928343.html,
MULTILAYER CHIP CERAMIC CAPACITOR
2.5% 0.25PF, 1 10000M 2 3 4 2 3 30 3 2 3 30 3 2 3
14
D.F. I.R.
40 2
90 95 24 2
500+24/-0
5% 0.5PF, 15 ( ) D.F. I.R. 10000M
40 2 500+24/-0 5% 0.5PF, 16 D.F. I.R. 10000M
90 95 24 2
2 50mA 5% 0.5PF, 17 D.F. I.R. 10000M
1000 12 24 2
49

【 南京南山半导体有限公司 — 贴片电容选型资料】
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Number
Item Temperature Cycle
Standard Cap. Change ratio D.F. I.R. 2.5% or 0.25 PF (whichever is larger) Same as original spec More than 10000M Heat-treatment:
Test Method
14
stage temperature 1 lowest opeating temperature 3 2 normal temperature 3 high operating temperature 2 4 normal temperature
time min. 30 3 2 3 30 3 2 3
Humidity Steady State
Appearance Cap. Change ratio D.F. I.R.
No defects or abnormities 5% or 0.5 PF (whichever is larger) Same as original spec More than 10000M
Set the capacitor for 500+24/-0 hours at the condition of 40 2 and 90-95% humidity. Then remove and set it for 24 2 hours at room temperature, then measure.
15
Humidity Load
Appearance Cap. Change ratio
No defects or abnormities 5% or 0.5 PF (whichever is larger) Same as original spec More than 10000M
Apply rated voltage to the capacitor for 500+24/-0 hours at the condition of 40 2 and 90-95% humidity. Remove and set it for 24 2 hours at room temperature, then measure.
16
D.F. I.R.
Life Test
Appearance Cap. Change ratio
No defects or abnormities 5% or 0.5 PF (whichever is larger) Same as original spec More than 10000M
Apply two times rated voltage to the capacitor for 1000 12 hours at the upper temperature limits, the charging current should be less than 50mA. Remove and set it for 24 2 hours at room temperature, then measure.
17
D.F. I.R.
50

【 南京南山半导体有限公司 — 贴片电容选型资料】
https://www.wendangku.net/doc/1610928343.html,
MULTILAYER CHIP CERAMIC CAPACITOR
COG
PH
RH
SH
TH
UH
X7R
15%
10% 5% 0%
10% 5% 0%
P2H R2H S2H T2H U2J
-5% -10% -15%
-5% -10%
-60
-40
-20
0
20
40
60
80
100
120
-55
-25
0
25
50
75
100
125
Z5U
20% 0% -20% -40% -60% -80%
Y5V
40% 20% 0% -20% -40% -60% -80% -100%
-55
-25
0
25
50
75
100
125
-55
-25
0
25
50
75
100
125
40% 20% 0% -20% -40% -60% -80% -100%
COG :1MHZ X7R,Z5U,Y5V:1KHZ
COG 50V
X7R 50V Z5U 50V Y5V 50V
0
10
20
30
40
50
[Vdc]
COG :1MHZ X7R,Z5U,Y5V:1KHZ
10%
+80% +60%^ +40% +20% 0% -20% Z5U 50V Y5V 50V X7R 50V C0G 50V
0% -10% -20% -30% -40%
COG X7R Y5V,Z5U
0
1
2
3
0
50 100
1000
10000
[Vrms ]
57
[Hr]

【 南京南山半导体有限公司 — 贴片电容选型资料】
https://www.wendangku.net/doc/1610928343.html,
GENEREL-USE MLCC CHARCCTER PROFILES
temperature coefficent
COG and PH
10% 5% 0%
RH
SH
TH
UH siries
Capacitance change ratio
X7R tempreture characteristics
15% 10% 5% 0% -5% -10% -15%
Capacitance change ratio Capacitance change ratio Capacitance change ratio Capacitance change ratio
-5%
P2H R2H S2H T2H U2J
-10%
-60
-40
-20
0
20
40
60
80
100
120
-55
-25
0
25
50
75
100
125
Temperature
20% 0% -20% -40% -60% -80%
Temperature
Y5V temperature characteristics
Z5U temperature character
Capacitance change ratio
40% 20% 0% -20% -40% -60% -80% -100%
-55
-25
0
25
50
75
100
125
-55
-25
0
25
50
75
100
125
Temperature
Temperature
DC Voltage Characteristics
40% 20% 0%
Measuring condition COG :1MHz X7R Z5U Y5V:1KHz
COG 50V
-20% X7R 50V Z5U 50V Y5V 50V
-40% -60% -80%
-100%
0
10
20
30
40
50
DC Voltage[Vdc]
Capacitance-AC Voltage
Characterics
Measuring condition COG :1MHz X7R,Z5U,Y5V:1KHz
Capacitance change_aging
Capacitance change ratio
10% 0% -10% -20% -30% -40% COG X7R Y5V,Z5U
+80% +60%^ +40% +20% 0% -20% Z5U 50V Y5V 50V X7R 50V C0G 50V
0
1
2
3
0
50 100
1000
10000
[Vrms]
Time[Hr]
58

IGBT吸收电容选型手册(EACO)

Electrical specifications, ordering codes Part Number Cap (μF) Dimention(mm) du/dt (v/μs) Ipeak A Irms max A ESR (m?) L B H STM-1200-2.2-*P# 2.2 57.5 35.0 50.0 455 1001 30.0 2.4 STM-1200-2.2-*S# 2.2 57.5 30.0 50.0 455 1001 29.5 2.4 STM-1200-2.5-*P# 2.5 57.5 35.0 50.0 455 1138 31.0 2.3 STM-1200-2.5-*S# 2.5 57.5 30.0 50.0 455 1138 30.5 2.3 STM-1200-3.0-*P# 3.0 57.5 35.0 50.0 455 1365 32.0 2.1 STM-1200-4.5-*S# 4.5 57.5 42.5 56.0 455 2047 33.0 1.7 Ur 1500Vdc, Urms 575Vac, Upk 2000Vdc STM-1500-0.33-*P# 0.33 42.5 24.5 27.5 800 264 13.5 4.6 STM-1500-0.33-*S# 0.33 42.5 18.0 31.5 800 264 13.0 4.6 STM-1500-0.39-*P# 0.39 42.5 24.5 27.5 800 312 14.0 4.3 STM-1500-0.39-*S# 0.39 42.5 22.0 30.0 800 312 13.5 4.3 STM-1500-0.47-*P# 0.47 42.5 33.5 35.5 800 376 18.0 3.7 STM-1500-0.47-*S# 0.47 42.5 28.0 37.0 800 376 17.5 3.7 STM-1500-0.68-*P# 0.68 42.5 33.5 35.5 800 544 19.5 3.1 STM-1500-0.68-*S# 0.68 42.5 28.0 37.0 800 544 19.0 3.1 STM-1500-0.75-*P# 0.75 42.5 33.5 35.5 800 600 20.5 2.8 STM-1500-1.0-*P# 1.0 42.5 33.0 45.0 800 800 23.0 2.5 STM-1500-1.0-*S# 1.0 42.5 30.0 45.0 800 800 22.5 2.5 STM-1500-1.2-*P# 1.2 57.5 30.0 45.0 560 672 25.0 2.8 STM-1500-1.5-*P# 1.5 57.5 35.0 50.0 560 840 28.0 2.5 STM-1500-1.8-*P# 1.8 57.5 35.0 50.0 560 1008 29.5 2.3 STM-1500-2.5-*S# 2.5 57.5 42.5 56.0 560 1400 31.0 1.8 Ur 1700Vdc, Urms 575Vac, Upk 2000Vdc STM-1700-0.22-*P# 0.22 42.5 24.5 27.5 880 194 13.2 5.3 STM-1700-0.22-*S# 0.22 42.5 17.0 28.0 880 194 13.0 5.3 STM-1700-0.33-*P# 0.33 42.5 24.5 27.5 880 290 14.0 5.0 STM-1700-0.33-*S# 0.33 42.5 22.0 30.0 880 290 13.5 5.0 STM-1700-0.47-*P# 0.47 42.5 33.5 35.5 880 413 19.0 3.8 STM-1700-0.47-*S# 0.47 42.5 28.0 37.0 880 413 18.5 3.8 STM-1700-0.56-*P# 0.56 42.5 33.5 35.5 880 492 19.5 3.1 STM-1700-0.56-*S# 0.56 42.5 28.0 37.0 880 492 19.0 3.1 STM-1700-0.68-*P# 0.68 42.5 33.5 35.5 880 598 20.0 2.9 STM-1700-0.82-*P# 0.82 42.5 33.0 45.0 880 721 22.1 2.5 STM-1700-0.82-*S# 0.82 42.5 30.0 45.0 880 721 19.5 2.5 STM-1700-1.0-*P# 1.0 57.5 30.0 45.0 610 610 23.5 2.7 STM-1700-1.2-*P# 1.2 57.5 30.0 45.0 610 732 26.2 2.6 STM-1700-1.5-*P# 1.5 57.5 35.0 50.0 610 915 28.5 2.4 STM-1700-2.2-*S# 2.2 57.5 42.5 56.0 610 1342 30.0 1.8 Ur 2000Vdc, Urms 630Vac, Upk 2400Vdc STM-2000-0.10-*P# 0.10 42.5 24.5 27.5 1000 100 8.0 13.0 STM-2000-0.10-*S# 0.10 42.5 15.0 26.0 1000 100 8.5 13.0 STM-2000-0.15-*P# 0.15 42.5 24.5 27.5 1000 150 10.5 7.5 STM-2000-0.15-*S# 0.15 42.5 15.0 26.0 1000 150 10.0 7.5 STM-2000-0.22-*P# 0.22 42.5 24.5 27.5 1000 220 12.0 5.1 STM-2000-0.22-*S# 0.22 42.5 22.0 30.0 1000 220 11.5 5.1 STM-2000-0.33-*P# 0.33 42.5 33.5 35.5 1000 330 16.5 4.1 STM-2000-0.33-*S# 0.33 42.5 28.0 37.0 1000 330 16.0 4.1 STM-2000-0.39-*P# 0.39 42.5 33.5 35.5 1000 390 17.5 3.6 STM-2000-0.39-*S# 0.39 42.5 28.0 37.0 1000 390 17.0 3.6 STM-2000-0.47-*P# 0.47 42.5 33.0 45.0 1000 470 20.5 3.2 STM-2000-0.47-*S# 0.47 42.5 28.0 37.0 1000 470 20.0 3.2 STM-2000-0.56-*P# 0.56 42.5 33.0 45.0 1000 560 21.5 3.0 STM-2000-0.68-*P# 0.68 57.5 30.0 45.0 700 476 22.5 3.5 STM-2000-0.82-*P# 0.82 57.5 30.0 45.0 700 574 24.0 3.1 STM-2000-1.0-*P# 1.0 57.5 35.0 50.0 700 700 27.0 2.8

电解电容的电参数介绍

电解电容的电参数介绍 这里的电解电容器主要指铝电解电容器,其基本的电参数包括下列五点: 1、电容值 电解电容器的容值,取决于在交流电压下工作时所呈现的阻抗。因此容值,也就是交流电容值,随着工作频率、电压以及测量方法的变化而变化。在标准JISC5102规定:铝电解电容的电容量的测量条件是在频率为120Hz,最大交流电压为0.5Vrms,DC bias电压为1.5~2.0V的条件下进行。可以断言,铝电解电容器的容量随频率的增加而减小。 2、损耗角正切值Tanδ 在电容器的等效电路中,串联等效电阻ESR同容抗1/ωC之比称之为Tanδ,这里的ESR是在120Hz下计算获得的值。显然,Tanδ随着测量频率的增加而变大,随测量温度的下降而增大。 3、阻抗Z 在特定的频率下,阻碍交流电流通过的电阻即为所谓的阻抗(Z)。它与电容等效电路中的电容值、电感值密切相关,且与ESR也有关系。 Z=√[ESR2+(XL-XC)2] 式中,XC=1/ωC=1/2πfC XL=ωL=2πfL

电容的容抗(XC)在低频率范围内随着频率的增加逐步减小,频率继续增加达到中频范围时电抗(XL)降至ESR的值。当频率达到高频范围时感抗(XL)变为主导,所以阻抗是随着频率的增加而增加。 4、漏电流 电容器的介质对直流电流具有很大的阻碍作用。然而,由于铝氧化膜介质上浸有电解液,在施加电压时,重新形成的以及修复氧化膜的时候会产生一种很小的称之为漏电流的电流。通常,漏电流会随着温度和电压的升高而增大。 5、纹波电流和纹波电压 在一些资料中将此二者称做“涟波电流”和“涟波电压”,其实就是ripplecurrent,ripple voltage。含义即为电容器所能耐受纹波电流/电压值。它们和ESR之间的关系密切,可以用下面的式子表示: Urms=Irms×R 式中,Vrms表示纹波电压 Irms表示纹波电流 R表示电容的ESR 由上可见,当纹波电流增大的时候,即使在ESR保持不变的情况下,涟波电压也会成倍提高。换言之,当纹波电压增大时,纹波电流也随之增大,这也是要求电容具备更低ESR值的原因。叠加入纹波电流后,由于电容内部的等效串连电阻(ESR)引起发热,从而影响到电容器的使用寿命。一般的,纹波电流与频率成正比,因此低频时纹波电流也比较低。

TDK贴片电容型号选型规格书

C1005X5R1A475KTJ00E0402 X5R 10V 4.5UF 10% C1005X5R1E224KT000E0402 X5R 25V 220NF 10% C1005X5R1E225KT000E0402 X5R 25V 2.2UF 10% C1005X7R1C104KT000F0402 X7R 16V 100NF 10% C1005X7R1C224kT000E0402 X7R 16V 220NF 10% C1005X7R1H104KT000F0402 X7R 50V 100NF 10% C1608C0G1E103JT000N0603 C0G 25V 10NF 5% C1608C0G1H101JT000N0603 C0G 50V 100PF 5% C1608C0G1H152JT000N0603 C0G 50V 1.5NF 5% C1608C0G1H221JT000N0603 C0G 50V 220PF 5% C1608C0G1H222JT000N 0603 C0G 50V 2.2NF 5% C1608C0G1H472JT000N0603 C0G 50V 4.7NF 5% C1608C0G1H562JT000N0603 C0G 50V 5.2NF 5% C1608X5R0J106MTJ00N0603 X5R 6.3V 10UF 20% C1608X5R0J225KT000N0603 X5R 6.3V 2.2UF 10% C1608X5R0J226MT000N0603 X5R 6.3V 22UF 20% C1608X5R0J335KT000N0603 X5R 6.3V 3.3UF 10% C1608X5R0J475KT000N0603 X5R 6.3V 4.7UF 10% C1608X5R1A105KTJ00N0603 X5R 10V 1UF 10% C1608X5R1A106MT000E0603 X5R 10V 10UF 20% C1608X5R1A225KT000E0603 X5R 10V 2.2UF 10% C1608X5R1A226MTE00E0603 X5R 10V 22UF 20% C1608X5R1A475KT000N0603 X5R 10V 4.7UF 10% C1608X5R1C225KT000N0603 X5R 16V 2.2UF 10%

RVT贴片铝电解电容470UF35V 10X10规格书

Note: All design and specifications are for reference only and is subject to change without prior notice. If any doubt about safety for your application, please contact us immediately for technical assistance before purchase. 注: 以上所提供的設計及特性參數僅供參考,任何修改不作預先通知。如果在使用上有疑問,請在採購前與我們聯繫,以便提供技術上的協助。 WIDE TEMPERATURE 寬溫品 Operating with wide temperature range -40~+105°C 適用於 -40~+105°C 的寬溫範圍 Load life of 1000~2000 hours 負荷壽命1000~2000小時 Comply with the RoHS directive 符合RoHS 指令 SPECIFICATIONS 特性表 Items 項目 Characteristics 主要特性 Operation Temperature Range 使用温度範圍 -40 ~ +105°C Voltage Range 額定工作電壓範圍 4 ~ 450V Capacitance Range 靜電容量範圍 0.1 ~ 6800μ F Capacitance Tolerance 靜電容量允許偏差 ±20% at 120Hz, 20°C Leakage Current 漏電流 Rated Voltage 額定工作電壓 6.3 ~ 100V 160 ~ 450V Case size 尺寸 ?4~?10 ?12.5~?16 ?6.3~? 16 Time 時間 after 2 min. (application of rated voltage)2分鐘後(施加額定工作電壓)after 1 min. (application of rated voltage) 1分鐘後(施加額定工作電壓) after 5 min. (application of rated voltage)5分鐘後(施加額定工作電壓)Leakage current 漏電流 ≤0.01CV or 3μA, whichever is greater ≤0.01CV 或3μA ,取較大值 ≤0.03CV or 4μA, whichever is greater ≤0.03CV 或4μA ,取較大值 ≤0.04CV+100μA, whichever is greater ≤0.04CV+100μA ,取較大值 Dissipation Factor (tan δ) 損耗角正切 Measurement frequency 測試頻率: 120Hz, Temperature 温度: 20°C Rated Voltage (V) 額定工作電壓 4 6.3101625 3550 63 100 160~250350~450tan δ (max.) 最大損耗角正切 ?4~?10 0.420.300.260.220.160.14 0.12 0.10 0.100.20 0.25 ?12.5~?160.450.380.340.300.26 0.22 0.18 0.14 0.100.20 0.25 Stability at Low Temperature 低溫特性 Measurement frequency 測試頻率: 120Hz Rated Voltage (V) 額定工作電壓 4 6.3101625 35 50~63 100160~250350~450 Impedance Ratio 阻抗比 ZT/Z20 (max.) ?4~?10 Z(-25°C)/Z(20°C)7 4 3 2 2 2 2 3 2 3 Z(-40°C)/Z(20°C)158 6 4 4 3 3 4 3 6 ?12.5~?16 Z(-25°C)/Z(20°C)7 5 4 3 2 2 2 2 2 4 Z(-40°C)/Z(20°C)1712108 5 4 3 3 6 10 Load Life 高溫負荷特性 After 2000 hrs. (1000 hrs. for ?4~?6.3×5.4) application of the rated voltage at 105°C, they meet the characteristics listed below. 在105°C 環境中施加額定工作電壓2000小時(?4~?6.3×5.4為1000小時)後,電容器的特性符合下表的要求。 Capacitance Change 靜電容量變化率 Within ±20% of initial value for capacitors of 10V or more (Within ±30% of initial value for capacitors of 4V or less) ≥10V 為初始值的±20%以內(≤4V 為初始值的±30%以內) Dissipation Factor 損耗角正切 200% or less of initial specified value 不大於規範值的200% Leakage Current 漏電流 initial specified value or less 不大於規範值 Shelf Life 高溫貯存特性 After leaving capacitors under no load at 105°C for 1000 hours, they meet the specified value for load life characteristics listed above. 在105°C 環境中無負荷放置1000小時後,電容器的特性符合高溫負荷特性中所列的規定值。 Resistance to Soldering Heat 耐焊接熱特性 After reflow soldering and restored at room temperature, they meet the characteristics listed below. 經過回流焊並冷卻至室溫後,電容器的特性符合下表的要求。 Capacitance Change 靜電容量變化率 Within ±10% of initial value 初始值的±10%以内 Dissipation Factor 損耗角正切 initial specified value or less 不大於規範值 Leakage Current 漏電流 initial specified value or less 不大於規範值 Marking 標識 Black print on the case top. 鋁殼頂部黑字印刷。 DRAWING (Unit: mm) 外形圖 *1. Voltage mark for 6.3V is [6V] *2. Applicable to ?6.3×7.7 *3. Applicable to ?8×10.5~?10 *4. Applicable to ?12.5~?16 6.3V 的產品標識為 [6V] 適用於?6.3×7.7 適用於?8×10.5~?10 適用於?12.5~?16 Series SMD aluminum electrolytic capacitor东莞市合粤电子有限公司www.heyuecap.com

通用型贴片电容规格书(选型手册)

【 南京南山半导体有限公司 — 贴片电容选型资料】
https://www.wendangku.net/doc/1610928343.html,
MULTILAYER CHIP CERAMIC CAPACITOR
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0805
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101
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WB
W
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L mm L 0402 0603 0805 1206 1005 1608 2012 3216 1.00 1.60 2.00 3.20 0.05 0.10 0.20 0.30 W 0.50 0.80 1.25 1.60 0.05 0.50 0.10 0.80 0.20 0.80 1.00 1.25 0.20 0.80 1.00 1.25 T WB 0.05 0.25 0.10 0.30 0.20 0.50 0.20 0.20 0.20 0.60 0.20 0.20 0.10 0.10 0.20 0.30
15

贴片电阻、贴片电容规格、封装、尺寸

贴片电阻、贴片电容规格、封装、尺寸·功率 贴片电阻常见封装有9种,用两种尺寸代码来表示。一种尺寸代码是由4位数字表示的EIA(美国电子工业协会)代码,前两位与后两位分别表示电阻的长与宽,以英寸为单位。我们常说的0603封装就是指英制代码。另一种是米制代码,也由4位数字表示,其单位为毫米。下表列出贴片电阻封装英制和公制的关系及详细的尺寸: 英制(inch) 公制 (mm) 长(L) (mm) 宽(W) (mm) 高(t) (mm) a (mm) b (mm) 0201 0603 0.60±0.050.30±0.050.23±0.050.10±0.050.15±0.05 0402 1005 1.00±0.100.50±0.100.30±0.100.20±0.100.25±0.10 0603 1608 1.60±0.150.80±0.150.40±0.100.30±0.200.30±0.20 0805 2012 2.00±0.20 1.25±0.150.50±0.100.40±0.200.40±0.20 1206 3216 3.20±0.20 1.60±0.150.55±0.100.50±0.200.50±0.20 1210 3225 3.20±0.20 2.50±0.200.55±0.100.50±0.200.50±0.20 1812 4832 4.50±0.20 3.20±0.200.55±0.100.50±0.200.50±0.20 2010 5025 5.00±0.20 2.50±0.200.55±0.100.60±0.200.60±0.20 2512 6432 6.40±0.20 3.20±0.200.55±0.100.60±0.200.60±0.20 贴片电阻电容功率与尺寸对应表 电阻封装尺寸与功率关系,通常来说: 0201 1/20W 0402 1/16W 0603 1/10W 0805 1/8W 1206 1/4W 电容电阻外形尺寸与封装的对应关系是: 0402=1.0x0.5 0603=1.6x0.8 0805=2.0x1.2 1206=3.2x1.6 1210=3.2x2.5 1812=4.5x3.2 2225=5.6x6.5 常规贴片电阻(部分) 常规的贴片电阻的标准封装及额定功率如下表:

贴片电容系列材质及规格

贴片电容材质及规格 贴片电容目前使用NPO、X7R、Z5U、Y5V等不同的材质规格,不同的规格有不同的用途。 NPO、X7R、Z5U和Y5V的主要区别是它们的填充介质不同。在相同的体积下由于填充介质不同所组成的电容器的容量就不同,随之带来的电容器的介质损耗、容量稳定性等也就不同。所以在使用电容器时应根据电容器在电路中作用不同来选用不同的电容器。 下面我们仅就常用的NPO、X7R、Z5U和Y5V来介绍一下它们的性能和应用以及采购中应注意的订货事项以引起大家的注意。不同的公司对于上述不同性能的电容器可能有不同的命名方法,这里我们引用的是敝司三巨电子公司的命名方法,其他公司的产品请参照该公司的产品手册。 一NPO电容器 NPO是一种最常用的具有温度补偿特性的单片陶瓷电容器。它的填充介质是由铷、钐和一些其它稀有氧化物组成的。 NPO电容器是电容量和介质损耗最稳定的电容器之一。在温度从-55℃到+125℃时容量变化为0±30ppm/℃,电容量随频率的变化小于±0.3ΔC。NPO电容的漂移或滞后小于±0.05%,相对大于±2%的薄膜电容来说是可以忽略不计的。其典型的容量相对使用寿命的变化小于±0.1%。NPO电容器随封装形式不同其电容量和介质损耗随频率变化的特性也不同,大封装尺寸的要比小封装尺寸的频率特性好。NPO电容器适合用于振荡器、谐振器的槽路电容,以及高频电路中的耦合电容。 二X7R电容器 X7R电容器被称为温度稳定型的陶瓷电容器。当温度在-55℃到+125℃时其容量变化为15%,需要注意的是此时电容器容量变化是非线性的。 X7R电容器的容量在不同的电压和频率条件下是不同的,它也随时间的变化而变化,大约每10年变化1%ΔC,表现为10年变化了约5%。 X7R电容器主要应用于要求不高的工业应用,而且当电压变化时其容量变化是可以接受的条件下。它的主要特点是在相同的体积下电容量可以做的比较大。 三Z5U电容器 Z5U电容器称为”通用”陶瓷单片电容器。这里首先需要考虑的是使用温度范围,对于Z5U电容器主要的是它的小尺寸和低成本。对于上述三种陶瓷单片电容起来说在相同的体积下Z5U电容器有最大的电容量。但它的电容量受环境和工作条件影响较大,它的老化率最大可达每10年下降5%。 尽管它的容量不稳定,由于它具有小体积、等效串联电感(ESL)和等效串联电阻(ESR)低、良好的频率响应,使其具有广泛的应用范围。尤其是在退耦电路的应用中。 Z5U电容器的其他技术指标如下: 工作温度范围+10℃--- +85℃ 温度特性+22% ---- -56% 介质损耗最大4%

贴片电容封装尺寸

7343 7227

“钽贴片电解电容有黑色或灰色标志的一头是正极,另外一头是负极。对于铝贴片电解电容就和普通直插电解电容一样,有杠杠的那端为负极。” 在网上查到这么一句话,可算是把板子上的钽电解全部平反了! 之前在复位电路总是不正常,查来查去,是复位的钽电解极性接反了! 以往用贴片电解大都就是对付钽电解电容,隐约在意识里知道画杠的一边是接高电位,就没有太注意其极性的表示方法。给医疗组的一哥们问起来:“它不跟普通电解电容一样么普通电解画白道子的一端是‘负’极啊再或者它应该和贴片二极管一样吧二极管也是画白道子的那头是‘负’极诶!”——歪着头一想也是!极性的标识方法也应该有个‘统一’的原则吧于是在此后焊的板子里所有的钽电解都掉了个头…… 终究是以有电容的地方电平被拉得特别低这一现象,标志着我对电解电容极性的表示方法完全混乱。真服了这种‘下贱’的表示方法,同样是电解电容,钽电解虽然昂贵一点,也不能搞特殊啊! 无极性电容以0805、0603两类封装最为常见; 0805具体尺寸:×× 1206具体尺寸:×× 贴片电容以钽电容为多,根据其耐压不同,又可分为A、B、C、D四个系列,具体分类如下: 类型封装形式耐压 A 3216 10V B 3528 16V C 6032 25V

D 7343 35V 贴片钽电容的封装是分为A型(3216),B型(3528),C型(6032),D型(7343),E型(7845)。 ------------------------------------- 贴片电容正负极区分 一种是常见的钽电容,为长方体形状,有“-”标记的一端为正; 另外还有一种银色的表贴电容,想来应该是铝电解。上面为圆形,下面为方形,在光驱电路板上很常见。这种电容则是有“-”标记的一端为负。 发光二极管:颜色有红、黄、绿、蓝之分,亮度分普亮、高亮、超亮三个等级,常用的封装形式有三类:0805、1206、1210 二极管:根据所承受电流的的限度,封装形式大致分为两类,小电流型(如1N4148)封装为1206,大电流型(如IN4007)暂没有具体封装形式,只能给出具体尺寸:X 3 X 电容:可分为无极性和有极性两类: 无极性电容下述两类封装最为常见,即0805、0603; 有极性电容也就是我们平时所称的电解电容,一般我们平时用的最多的为铝电解电容,由于其电解质为铝,所以其温度稳定性以及精度都不是很高,而贴片元件由于其紧贴电路版,所以要求温度稳定性要高,所以贴片电容以钽电容为多,根据其耐压不同,贴片电容又可分为A、B、C、D四个系列,具体分类如下: 类型封装形式耐压 A 3216 10V B 3528 16V C 6032 25V D 7343 35V

YAGEO贴片电容规格书

1. SUBJECT: This specification applies on the chip capacitor made by Yageo Corporation. 2. PART NUMBER: Part number of the chip capacitor is identified by the size, tolerance, packing, material and capacitor value. Example:

3. ELECTRICAL CHARACTERISTICS

4. DIMENSION (mm) L W T L 1;L 2 L 3 Style MIN. MAX. MIN. MAX. Min. CC0402 1.0±0.05 0.5±0.05 0.45 0.55 0.15 0.30 0.40 CC0603 1.6±0.10 0.8±0.10 0.70 0.90 0.20 0.60 0.40 CC0805 2.0±0.10 1.25±0.10 0.50 1.35 0.25 0.75 0.55 CC1206 3.2±0.15 1.6±0.15 0.50 1.35 0.25 0.75 1.40 CC1210 3.2±0.20 2.5±0.20 0.50 1.80 0.25 0.75 1.40 CC1812 4.5±0.20 3.2±0.20 0.50 1.80 0.25 0.75 2.20 CC2220 5.7±0.20 5.0±0.20 0.50 1.80 0.25 0.75 2.20 Unit: mm

钽电容选型和外形介绍

钽电容选型介绍及外形尺寸 | | 2010年08月23日 | [字体:小大] | 点击推荐给好友 关键词:钽电容 一、钽电容介绍 钽电容是由稀有金属钽加工而成,先把钽磨成微细粉,再与其它的介质一起经烧结而成。目前的工艺有干粉成型法和湿粉成型法两种。钽电容由于金属钽的固有本性,具有稳定好、不随环境的变化而改变、能做到容值很大等特点,在某些方面具有陶瓷电容不可比较的一些特性,因此在很多无法使用陶瓷电容的电路上钽电容被广泛采用。 目前全球主要有以下几个品牌的钽电容:AVX、KEMET、VISHAY、NEC,其中AVX 和VISHAY的产量最大,而且质量最好。 二、钽电容技术规格和选型(以VISHAY和AVX为例说明) (一)VISHAY 1、型号表示方法 293D 107 X9 010 D 2 W ① ② ③ ④ ⑤ ⑥ ⑦ ① 表示系列,VISHAY有293D和593D两个系列,293D表示普通钽电容,593D 表示的是低阻抗钽电容,直流电阻小于1欧,一般在100毫欧到500毫欧之间。 ② 表示电容的容量,范围从0.1UF----680UF ③ 表示容量误差,钽电容的容量误差有两种:一是±10%(K)和±20%(M) ④ 表示电容的耐压,指在85℃时额定直流电压,钽电容的耐压范围从4V---50V ⑤ 表示钽电容的尺寸大小,有A、B、C、D、E、P五种尺寸 ⑥ 表示电容的焊点材料,一般是镍银,和钯银 ⑦ 表示包装方式,有两种包装方式,7寸盘和13寸盘

2、外形尺寸 3、容量与电压和尺寸的范围关系表 293D普通系列 593D低阻系列(通用低阻钽电容为100UF----470UF)

贴片电解电容的规格

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E.CAP.No1.2008/2009(E) 39 SMD Aluminum Electrolytic Capacitors VE Features ? 3 ~ 16φ, 85℃, 2,000 hours assured ? C hip type large capacitance capacitors ? D esigned for surface mounting on high density PC board. ? R oHS Compliance LEAD SPACING AND DIAMETER Unit: mm φD L A B C W P ± 0.2Fig. No.3 5.3 ± 0.2 3.3 3.3 1.5 0.45 ~ 0.750.8 3 4 5.3 ± 0.2 4.3 4.3 2.0 0.5 ~ 0.8 1.0 1 5 5.3 ± 0.2 5.3 5.3 2.3 0.5 ~ 0.8 1.5 1 6.3 5.3 ± 0.2 6.6 6.6 2.7 0.5 ~ 0.8 2.0 1 6.3 7.7 ± 0.3 6.6 6.6 2.7 0.5 ~ 0.8 2.0 1 8 10 ± 0.58.48.4 3.0 0.7 ~ 1.1 3.1 1 8 10.3 ± 0.58.48.4 3.0 0.7 ~ 1.1 3.1 1 10 10 ± 0.510.410.4 3.3 0.7 ~ 1.1 4.7 1 10 10.3 ± 0.510.410.4 3.3 0.7 ~ 1.1 4.7 1 12.513.5 ± 0.513.013.0 4.8 1.1 ~ 1.4 4.4 2 12.516 ± 0.513.013.0 4.8 1.1 ~ 1.4 4.4 2 DIAGRAM OF DIMENSIONS Fig. 1 Fig. 2 16 16.5 ± 0.517.017.0 5.8 1.1 ~ 1.4 6.4 2 MARKING φD = 3 mm φD = 4 ~ 6.3mm φD = 8 ~ 10 mm φD ≧ 12.5mm

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