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SN74HC164DG4中文资料

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PACKAGING INFORMATION

Orderable Device Status(1)Package

Type Package

Drawing

Pins Package

Qty

Eco Plan(2)Lead/Ball Finish MSL Peak Temp(3)

5962-8416201VCA ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type 5962-8416201VDA ACTIVE CFP W141TBD A42N/A for Pkg Type 84162012A ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type 8416201CA ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type SN54HC164J ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type SN74HC164D ACTIVE SOIC D1450Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74HC164DE4ACTIVE SOIC D1450Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74HC164DG4ACTIVE SOIC D1450Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74HC164DR ACTIVE SOIC D142500Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74HC164DRE4ACTIVE SOIC D142500Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74HC164DRG4ACTIVE SOIC D142500Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74HC164DT ACTIVE SOIC D14250Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74HC164DTE4ACTIVE SOIC D14250Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74HC164DTG4ACTIVE SOIC D14250Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74HC164N ACTIVE PDIP N1425Pb-Free

(RoHS)

CU NIPDAU N/A for Pkg Type SN74HC164N3OBSOLETE PDIP N14TBD Call TI Call TI

SN74HC164NE4ACTIVE PDIP N1425Pb-Free

(RoHS)

CU NIPDAU N/A for Pkg Type

SN74HC164NSR ACTIVE SO NS142000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74HC164NSRE4ACTIVE SO NS142000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74HC164PW ACTIVE TSSOP PW1490Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74HC164PWE4ACTIVE TSSOP PW1490Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74HC164PWR ACTIVE TSSOP PW142000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74HC164PWRE4ACTIVE TSSOP PW142000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74HC164PWT ACTIVE TSSOP PW14250Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74HC164PWTE4ACTIVE TSSOP PW14250Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM SNJ54HC164FK ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type SNJ54HC164J ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type

SNJ54HC164W ACTIVE CFP W141TBD A42N/A for Pkg Type https://www.wendangku.net/doc/158293547.html,23-Apr-2007

(1)

The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.

LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.

NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.

PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.

(2)

Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check https://www.wendangku.net/doc/158293547.html,/productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.

Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)

(3)

MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual

basis.

https://www.wendangku.net/doc/158293547.html,

23-Apr-2007

TAPE AND REEL

INFORMATION

https://www.wendangku.net/doc/158293547.html,

3-May-2007

Device

Package Pins Site

Reel Diameter (mm)Reel Width (mm)A0(mm)B0(mm)K0(mm)

P1(mm)W (mm)Pin1Quadrant SN74HC164DR D 14MLA 33016 6.59.0 2.1816Q1SN74HC164DR D 14FMX 3300 6.59.0 2.1816Q1SN74HC164NSR

NS 14MLA 330168.210.5 2.51216Q1SN74HC164PWR

MLA

330

7.0

5.6

1.6

TAPE AND REEL BOX INFORMATION

Device Package

Pins Site Length (mm)

Width (mm)Height (mm)

SN74HC164DR D 14MLA 333.2333.228.58SN74HC164DR D 14FMX 333.2333.228.58SN74HC164NSR NS 14MLA 333.2333.228.58SN74HC164PWR

MLA

338.1

340.5

20.64

https://www.wendangku.net/doc/158293547.html,

3-May-2007

https://www.wendangku.net/doc/158293547.html,3-May-2007