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PRINCIPAL DEVICE TYPES
CZT3120
GEOMETRY
PROCESS DETAILS R3 (26-March 2004)
GROSS DIE PER 4 INCH WAFER
2,200
Central
Semiconductor Corp.
TM
PROCESS CP312
Power Transistor
NPN - Amp/Switch Transistor Chip
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Central
Semiconductor Corp.
TM
PROCESS CP312
Typical Electrical Characteristics
145 Adams Avenue
Hauppauge, NY 11788 USA Tel:(631) 435-1110Fax:(631) https://www.wendangku.net/doc/1110419051.html,
R3 (26-March 2004)
元器件交易网https://www.wendangku.net/doc/1110419051.html,