Power MOSFET
IRFPC50LC, SiHFPC50LC
Vishay Siliconix
FEATURES
?Ultra Low Gate Charge
?Reduced Gate Drive Requirement ?Enhanced 30 V V GS Rating ?Reduced C iss , C oss , C rss
?Isolated Central Mounting Hole ?Dynamic dV/dt Rating
?Repetitive Avalanche Rated ?Lead (Pb)-free Available
DESCRIPTION
This new series of low charge Power MOSFETs achieve significantly lower gate charge over conventional MOSFETs.Utilizing advanced Power MOSFET technology the device improvements allow for reduced gate drive requirements,faster switching speeds and increased total system savings.These device improvements combined with the proven ruggedness and reliability of Power MOSFETs offer the designer a new standard in power transistors for switching applications.
The TO-247 package is preferred for commercial-industrial applications where higher power levels preclude the use of TO-220 devices. The TO-247 is similar but superior to the earlier TO-218 package because its isolated mounting hole.
Notes
a.Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b.V DD = 25 V, starting T J = 25 °C, L = 13 mH, R G = 25 Ω, I AS = 11 A (see fig. 12).
c.I SD ≤ 11 A, dI/dt ≤ 100 A/μs, V DD ≤ V DS , T J ≤ 150 °C.
d. 1.6 mm from cas
e.
PRODUCT SUMMARY
V DS (V)600
R DS(on) (Ω)V GS = 10 V
0.60
Q g (Max.) (nC)84Q gs (nC)18Q gd (nC)36Configuration
Single
TO-247
G
D
S
ORDERING INFORMATION
Package TO-247
Lead (Pb)-free IRFPC50LCPbF SiHFPC50LC-E3SnPb
IRFPC50LC SiHFPC50LC
ABSOLUTE MAXIMUM RATINGS T C = 25 °C, unless otherwise noted
ARAMETER SYMBOL LIMIT UNIT
Drain-Source Voltage V DS
600V
Gate-Source Voltage V GS ±
30 Continuous Drain Current V GS at 10 V T C = 25 °C I D
11
A
T C = 100 °C 7.3Pulsed Drain Current
a I DM 44Linear Derating Factor 1.5W/°C
Single Pulse Avalanche Energy b
E AS 920mJ Repetitive Avalanche Current a I AR 11 A Repetitive Avalanche Energy
a E AR 19mJ Maximum Power Dissipation T C = 25 °C
P D 190W Peak Diode Recovery dV/dt c
dV/dt 3.0V/ns Operating Junction and Storage Temperature Range T J , T stg
- 55 to + 150 °C
Soldering Recommendations (Peak Temperature)for 10 s 300d
Mounting Torque 6-32 or M3 screw
10 lbf · in
1.1N · m * Pb containing terminations are not RoHS compliant, exemptions may apply
IRFPC50LC, SiHFPC50LC
Vishay Siliconix
Notes
a.Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b.Pulse width ≤ 300 μs; duty cycle ≤ 2 %.
THERMAL RESISTANCE RATINGS
ARAMETER SYMBOL TY
.MAX.UNIT
Maximum Junction-to-Ambient R thJA -40°C/W Case-to-Sink, Flat, Greased Surface R thCS 0.24-Maximum Junction-to-Case (Drain)
R thJC
-0.65
IRFPC50LC, SiHFPC50LC
Vishay Siliconix
Fig. 6 - Typical Gate Charge vs. Gate-to-Source Voltage
Fig. 12a - Unclamped Inductive Test Circuit Fig. 12b - Unclamped Inductive Waveforms
Fig. 13a - Basic Gate Charge Waveform Fig. 13b - Gate Charge Test Circuit
IRFPC50LC, SiHFPC50LC
Vishay Siliconix Array Fig. 14 - For N-Channel
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see https://www.wendangku.net/doc/1e15421470.html,/ppg?91242.
Disclaimer Legal Disclaimer Notice
Vishay
All product specifications and data are subject to change without notice.
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