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BP 产品使用说明1.2

BPS Product Operation Specification

BPS 产品使用注意事项

Moisture Proof package

防潮说明

When moisture is absorbed into the package it may vaporize and expand during soldering. There is a possibility that it can cause delamination and damage to

electronically characteristics of the IC. For this reason, the moisture proof package is used to keep moisture to a minimum in the package. There is a humidity indictor card in the package. The products absorb the moisture, if the 60% point change from blue to pink.

当潮气进入产品后,在过回流焊时潮气会快速膨胀,

导致产品分层损坏,

所以产

品要隔离潮湿。产品是包装在防潮的铝箔袋中,

袋中还有湿度指示卡。

当湿度指示卡60%点从蓝色变成粉红色时。说明产品已受潮。

BP 产品使用说明1.2

BP 产品使用说明1.2

BP 产品使用说明1.2

BP 产品使用说明1.2

BP 产品使用说明1.2

BP 产品使用说明1.2

BP 产品使用说明1.2

BP 产品使用说明1.2

BP 产品使用说明1.2

Storage Conditions

产品储存/仓储条件

The IC should be kept at 30℃ or less and 80%RH or less. The IC's shelf life is two year.

在打开包装(铝箔袋)前,(仓储,运输时)在打开包装前,产品需存放在≤30℃和≤80%湿度环境中,保质期为2年。

The IC should be kept at 30℃or less and 70%RH or less. The IC should be soldered within 168 hours after opening the package. For the de-pack unused IC, they should be stored in moisture proof packages with desiccant, and record the exposed time. Total exposed time shall within 168 hours.

打开包装后,产品要存放在≤30℃和≤70%湿度环境中,并确保168小时内上板过焊接。用不完产品要重新包装在防潮袋中并放干燥剂,并记录已使用时间。累计使用时间不可超过168小时。

If the humidity indictor card's 60% point change from blue to pink or exceeded

the life time, baking treatment should be performed using the following

conditions

如果袋中的湿度指示卡变色或者超过使用期,产品需要烘烤。

baking condition:

烘烤条件:125℃ +/- 5℃≥8小时.

Carrier ,tape and reel can't be baked

*卷带外包装不可以烘烤

Soldering conditions

锡焊条件

IR reflow

回流焊

N2 reflow is recommended

建议使用氮气回流焊。

Reflow soldering should not be done more than two times.

产品不可以超过两次回流焊。

BP 产品使用说明1.2

v

BP 产品使用说明1.2

Solder waving

波峰焊

For lead solder, the soldering temperature shall be controlled in 235-245 degree, for lead-free solder, the soldering temperature shall be controlled in 250-260 degree. Soldering time is 5 seconds max. The compound will be decomposed, even cause the IC function fail, if the soldering temperature beyond the control temperature.

有铅波峰焊锡炉温度控制在235-245℃, 无铅锡炉温度控制在250-260℃. 焊接时间控制在5秒内。炉温超过指导温度,产品塑封料将会分解,从而引起产品的功能失效。

ESD Protection 静电防护要求:

ESD will make IC malfunction, degrade performance, even reliability fail, so it shall be strictly control ESD during, purchasing, storage, inspection, inventory, and

assembly. ESD protection is comply with "ANSI/ESD-S20.20-2007" specification. 静电会造成电子产品功能失效,降低可靠性,顾电子产品在购买、入库、发料、检验、储存、调试、

和安装过程中严格控制静电影响。静电保护请按照《ANSI/ESD-S20.20-2007》执行。

BPS product pass ESD class2 HBM 2000v to 4000v, by ANSI/ESD-S20.20-2007 specification.

Picture 1

Picture 2

我司产品ESD等级为Class2 《 ANSI/ESDA/JEDEC JS-001-2012》人体模式耐压为2000至4000伏特。

ESD sensitive logo printed on the inner and outer packing.

产品外包装及内包装上均有ESD敏感标志如下图。

BP 产品使用说明1.2