chipset_brochure

RVL09063101 - WIMAX WAVE2 SUBSCRIBER STATION CHIPSET VENDORS:

COMPETITIVE ANALYSIS

Reveal Wireless LLC

Information Technology Solutions

Questions Answered by This Report

?What is the WiMAX subscriber chipset market outlook? What are the main chipset features in 2009/2010?

?Which key WiMAX chipset vendors will lead the market and what are their differentiators?

?What are the key WiMAX chipset vendors’ SWOT, chipset product roadmaps, process node technology, competitive positioning and product maturity?

?What are the subscriber chipset forecasts and ASP forecasts?

?What are the latest chipset architecture trends?

?Who has the scale to address all WiMAX segments and who is offering the most-effective solution?

?How competitive are the key WiMAX chipsets and what are their projected costs/prices in 2010?

?What are the costs of the different WiMAX system platforms and what are their projected costs in 2010?

?And much more!

Who Should Buy the Report?

?WiMAX and LTE chipset vendors

?WiMAX and LTE devices manufacturers (CPE, USB dongle, MID, consumer electronics, PC card, module, portable router and handset)

?4G laptop, netbook, smartbook and handset ODMs/OEMs

?4G infrastructure providers

?4G mobile operators, MVNOs and other service providers

?Market analysts, 4G technology investors

?All entrepreneurs looking for 4G chipset benchmarks

Why Should They Buy the Report?

?The report is a unique qualitative analysis combining an overview of the key WiMAX chipset players, with very detailed teardowns of commercialized WiMAX devices.

?The report provides die microphotographs and measurements, die cost and price estimates, architecture deductions, next generation cost and price projections (2010 and beyond), key vendor SWOT and roadmaps. This

represents an extremely valuable tool for all sales, marketing, purchasing and engineering teams.

?Not only WiMAX players but also LTE vendors will understand the overall cost structure of a 2009 system platform and the success factors for building a cost effective solution in 2010.

?Newcomers to 4G can start building a competitive database on 4G chipsets and systems.

Executive Summary

While the WiMAX market has not developed as anticipated due to several factors, the value proposition of WiMAX for fixed and portable applications remains appealing to operators and there are many networks being deployed around the world. One of the main market barriers is probably the formidable competition of 3G, which has progressively delivered on the same promises as WiMAX - broadband wireless throughput albeit with much lower data rate than WiMAX, ubiquitous coverage thanks to 2.5G fallback, high speed mobility, global roaming, falling prices and introduction of flat subscription rates, and migration to flat IP networks.

However many factors should be taken into account when analyzing the value proposition of WiMAX, such as spectrum availability, propagation characteristics, and cost, IPR landscape and licensing costs, chipsets maturity and prices, networks maturity and cost of ownership, scale and strength of the ecosystem, availability of infrastructure equipment and devices, maturity of the certification process, technology evolution roadmap, access to funding, etc.

According to leading market analysts WiMAX remains a compelling technology in many markets, especially in developing economies. WiMAX is more mature than LTE, and will maintain its time to market advantage for several years since the slowdown of the economy is affecting both WiMAX and LTE.

This research focuses on the subscriber chipset ecosystem, and most specifically on the top-5 players - Beceem, Sequans, GCT, Samsung, and Intel.

The WiMAX Subscriber Station Chipset ecosystem is acutely fragmented with more than 14 chipset vendors competing for market share. This puts pressure on vendors with insufficient customer traction, lacking funding or scale, or offering only partial Chipset solutions. Several early movers that entered the WiMAX market with fixed or Wave1 mobile solutions are now shipping Wave2 compliant Chipsets, mainly composed of a Base-Band System-on-Chip (BB SoC) and a companion RF transceiver IC. However, most of the available chipsets are not highly optimized because they were slated to cover a broad range of application segments. We believe that WiMAX mass market adoption requires ubiquitous coverage and IOT mature, sub $10 chipsets that are power / performance optimized for each application-specific segment. Sequans, Beceem and GCT are best positioned to achieve the $10 price target through BB + RF monolithic die integration in 65-nm. However Intel has the ability to deliver very low cost solutions thanks to their wafer pricing advantage. Our analysis shows that their current chipset is one of the lowest cost on the market.

Few players have the scale to effectively address all segments and no global leader has emerged. Beceem and GCT are leading at UQCom, and Beceem is leading at Clear, while Intel continues to dominate the embedded compute segment. Samsung and GCT virtually own the WiBro market. Sequans is primarily shipping to fixed operators but is gaining traction in the portable and handset/MID markets.

Samsung SEC has not extended its reach outside of its internal captive chipset market. Although Samsung has been a driving force behind WiMAX and OFDMA in general, we believe that their strategy is to enable the market and opportunistically provide chipset solutions to their device divisions. We have not found evidence of a long term integration roadmap.

While Runcom is focusing on niche end-to-end markets and is no longer considered as a player in mobile WiMAX, smaller players such as Wavesat, Comsys, Altair, and Mediatek could emerge and potentially challenge the leading vendors in some specific applications. Wavesat is bringing its programmable PHY solution to maturity and is gaining traction in Japan with PHS OFDMA evolutions launched by Willcom. Comsys has been targeting multi-mode mobile markets with an integrated Edge/WiMAX baseband SoC, leveraging the maturity of their 2.5G modem and protocol stack.

Comsys has recently announced design wins with several handset and MID ODMs. Altair has demonstrated ultra low-power SDIO solutions optimized for the mobile market. Mediatek is gaining traction in the fixed market and has the expertise to emerge as a low-cost leader when the market matures.

Sample Graph

WiMAX Wave2 Chipset Vendor Landscape Figure 7-1summarizes the WiMAX Wave2 Chipset Vendor Landscape.

1Table of Contents

Report Summary..........................................................................................................................................................................12! 2!LIST OF TABLES.................................................................................................................................................15! 3!LIST OF FIGURES...............................................................................................................................................17! 4!EXECUTIVE SUMMARY.....................................................................................................................................20!

4.1!Key Vendors Differentiation Leadership.............................................................................................................21!

4.2!WiMAX Wave2 Chipset Vendor Landscape........................................................................................................21!

4.3!WiMAX Subscriber Station Base-Band Chips...................................................................................................24! 5!WIMAX MARKET OVERVIEW............................................................................................................................26!

5.1!Market Forecast............................................................................................................................................................26!

5.2!Market ASP Forecast..................................................................................................................................................27! 6!WIMAX SUBSCRIBER STATION CHIPSETS – OVERVIEW AND TECHNOLOGY TREND........................28!

6.1!WiMAX Subscriber Station System Architecture.............................................................................................28!

6.1.1!WiMAX Subscriber Station System Architecture.......................................................................................................................28!

6.1.2!Base-Band IC Architecture............................................................................................................................................................30!

6.1.3!RF IC Architecture..........................................................................................................................................................................31!

6.1.4!Interface between RF IC and Base-Band IC..............................................................................................................................31!

6.1.5!Technologies Trends......................................................................................................................................................................31! 7!WIMAX SUBSCRIBER STATION CHIPSETS – VENDORS COMPARISON.................................................34!

7.1!Introduction....................................................................................................................................................................34!

7.2!Vendors Comparison.................................................................................................................................................34!

7.2.1!Base-Band Solutions......................................................................................................................................................................34!

7.2.2!Single-chip Solutions......................................................................................................................................................................36! 8!WIMAX SUBSCRIBER STATION CHIPSETS – VENDORS DETAILED DESCRIPTION..............................37!

8.1!Introduction....................................................................................................................................................................37!

8.2!Five Key WiMAX Subscriber Station Players: BECEEM, GCT, INTEL, SAMSUNG and SEQUANS38!

8.3!BECEEM COMMUNICATIONS.................................................................................................................................38!

8.3.1!Company Introduction....................................................................................................................................................................38!

8.3.2!Investors...........................................................................................................................................................................................38!

8.3.3!Key Customers/Operators Estimate............................................................................................................................................39!

8.3.4!Roadmap and Chipsets Positioning Extrapolation....................................................................................................................39!

8.3.5!Chipsets Product line Deduction..................................................................................................................................................40!

8.3.6!System Architecture Evaluation....................................................................................................................................................42!

8.3.7!Base-Band Architectures Evaluation...........................................................................................................................................44!

8.3.8!RF IC Architecture Evaluation.......................................................................................................................................................46!

8.3.9!System BOM Estimate...................................................................................................................................................................47!

8.3.10!Die size, Cost and Price Estimates..........................................................................................................................................50!

8.3.11!Beceem: Our final Analysis, Chipsets/Dies roadmap, Chipsets Price Estimates and SWOT.......................................54!

8.4!SEQUANS.......................................................................................................................................................................57!

8.4.1!Company Introduction....................................................................................................................................................................57!

8.4.2!Investors...........................................................................................................................................................................................57!

8.4.3!Key Customers/Operators Estimate............................................................................................................................................58!

8.4.4!Roadmap and Product Positioning Extrapolation......................................................................................................................58!

8.4.5!Chipset Product Line Deduction...................................................................................................................................................59!

8.4.6!System Architecture Evaluation....................................................................................................................................................62!

8.4.7!Base-Band Architectures Evaluation...........................................................................................................................................64!

8.4.8!RF IC Architecture Evaluation.......................................................................................................................................................66!

8.4.9!System BOM Estimate...................................................................................................................................................................67!

8.4.10!Die Size, Cost and Price Estimates.........................................................................................................................................70!

8.4.11!Sequans: Our Final Analysis, Chipsets/Dies Roadmap, Chipsets Price Estimates and SWOT...................................75!

8.5!GCT SEMICONDUCTOR, Inc....................................................................................................................................78!

8.5.1!Company Introduction....................................................................................................................................................................78!

8.5.2!WiMAX Wave2 Key Customers/Operators Estimate................................................................................................................79!

8.5.3!Roadmap and Chipsets Positioning Extrapolation....................................................................................................................79!

8.5.4!Chipset Product Line Deduction...................................................................................................................................................80!

8.5.5!System Architecture Evaluation....................................................................................................................................................81!

8.5.6!Single-chip Base-Band + RF Architectures Evaluation............................................................................................................82!

8.5.7!RF IC Architecture Evaluation.......................................................................................................................................................84!

8.5.8!System BOM Estimate...................................................................................................................................................................84!

8.5.9!Die size, Cost and Price Estimates..............................................................................................................................................86!

8.5.10!GCT: Our final Analysis, Chipsets/Dies Roadmap, Chipsets Price Estimates and SWOT............................................89!

8.6!INTEL................................................................................................................................................................................91!

8.6.1!Company Introduction....................................................................................................................................................................91!

8.6.2!Investors...........................................................................................................................................................................................91!

8.6.3!Key Customers/Operators Deduction..........................................................................................................................................91!

8.6.4!Roadmap and Chipsets Positioning Extrapolation....................................................................................................................92!

8.6.5!Chipsets Product line Deduction..................................................................................................................................................93!

8.6.6!System Architecture Evaluation....................................................................................................................................................95!

8.6.7!Base-Band Architectures Evaluation...........................................................................................................................................98!

8.6.8!RF IC Architecture Evaluation.....................................................................................................................................................100!

8.6.9!System BOM Estimate.................................................................................................................................................................101!

8.6.10!Die size, Cost and Price Estimates........................................................................................................................................106!

8.6.11!Intel Our final Analysis, Chipsets/Dies Roadmap, Chipsets Price Estimates and SWOT............................................108!

8.7!SAMSUNG ELECTRONICS CO. (SEC)................................................................................................................110!

8.7.1!Company Introduction..................................................................................................................................................................110!

8.7.2!Key Customers/Operators Estimate..........................................................................................................................................110!

8.7.3!Roadmap and Product Positioning Extrapolation....................................................................................................................111!

8.7.4!Chipset Product Line Deduction.................................................................................................................................................112!

8.7.5!System Architecture Evaluation..................................................................................................................................................112!

8.7.6!Base-Band Architecture Evaluation...........................................................................................................................................113!

8.7.7!System BOM Estimate.................................................................................................................................................................114!

8.7.8!Die size, Cost and Price Estimates............................................................................................................................................116!

8.7.9!Samsung: Our final Analysis, Chipsets/Dies Roadmap, Chipsets Price Estimates and SWOT......................................118!

8.8!Company directory....................................................................................................................................................121!

2 List of Tables

TABLE 4-1 – EXECUTIVE SUMMARY - COMPARISON OF WIMAX SUBSCRIBER STATION BASE-BAND CHIPS (SOURCE REVEAL WIRELESS)..................................................................................................................................................................................................24! TABLE 4-2 – EXECUTIVE SUMMARY - COMPARISON OF WIMAX SUBSCRIBER STATION SINGLE-CHIP SOLUTIONS (SOURCE REVEAL WIRELESS)..................................................................................................................................................................................25! TABLE 7-1 – COMPARISON OF WIMAX SUBSCRIBER STATION SOLUTIONS (SOURCE REVEAL WIRELESS)...............................35! TABLE 7-2 – COMPARISON OF WIMAX SUBSCRIBER STATION SINGLE-CHIP SOLUTIONS (SOURCE REVEAL WIRELESS)......36! TABLE 8-1 - BECEEM MAIN CUSTOMERS/OPERATORS MATRIX TABLE ESTIMATE (SOURCE REVEAL WIRELESS)...................39! TABLE 8-2 – BCS200 PLATFORM SYSTEM BOM ESTIMATE – 2008 XOHM/ZTE TU25 USB DONGLE (SOURCE REVEAL WIRELESS)..................................................................................................................................................................................................49! TABLE 8-3 – BCSM250 PLATFORM SYSTEM BOM PROJECTION – 2009 USB DONGLE APPLICATION (SOURCE REVEAL WIRELESS)..................................................................................................................................................................................................50! TABLE 8-4 – BCS200 CHIPSET DIE SIZES, COST AND PRICE ESTIMATES IN 4Q2008 (SOURCE REVEAL WIRELESS).................51! TABLE 8-5 – BCSM250 SYSTEM-IN-PACKAGE CONSTRUCTION RATIONAL (SOURCE REVEAL WIRELESS).................................52! TABLE 8-6 – BCSM250 CHIPSET DIE SIZE, COST AND PRICE ESTIMATES IN 2009 (SOURCE REVEAL WIRELESS).....................53! TABLE 8-7 – BCSX250 65NM MONOLITHIC DIE SIZE PROJECTION (SOURCE REVEAL WIRELESS).................................................53! TABLE 8-8 – BCSX250 COST AND PRICE ESTIMATES IN 4Q10 (SOURCE REVEAL WIRELESS)........................................................54! TABLE 8-9 – BECEEM WIMAX CHIPSET SWOT ANALYSIS (SOURCE REVEAL WIRELESS)................................................................56! TABLE 8-10 – SEQUANS MAIN CUSTOMERS/OPERATORS MATRIX TABLE ESTIMATE (SOURCE REVEAL WIRELESS)............58! TABLE 8-11 – SQN1130 CPE PLATFORM BOM ESTIMATE (SOURCE REVEAL WIRELESS)................................................................68! TABLE 8-12 – SQN1170 SDIO MODULE BOM ESTIMATE (SOURCE REVEAL WIRELESS)...................................................................70! TABLE 8-13 – IMPACT OF ARCHITECTURE & IMPLEMENTATION OPTIONS ON BASEBAND DIE SIZE ESTIMATE (SOURCE REVEAL WIRELESS)..................................................................................................................................................................................71! TABLE 8-14 - SQN1130/MAX2839 CHIPSET DIE SIZES, COST AND PRICE ESTIMATES IN 2008 (SOURCE REVEAL WIRELESS)72! TABLE 8-15 - SQN1170 CHIPSET DIE SIZES AND 2009 COST AND PRICE ESTIMATES (SOURCE REVEAL WIRELESS)...............73! TABLE 8-16 – SQN1210 DIE SIZE ESTIMATE (SOURCE REVEAL WIRELESS)........................................................................................74! TABLE 8-17 – SQN1210 COST AND PRICE ESTIMATES (SOURCE REVEAL WIRELESS).....................................................................75! TABLE 8-18 – SEQUANS WIMAX CHIPSET SWOT ANALYSIS (SOURCE REVEAL WIRELESS)...........................................................77! TABLE 8-19 – GCT MAIN CUSTOMERS/OPERATORS MATRIX TABLE ESTIMATE (SOURCE REVEAL WIRELESS).......................79! TABLE 8-20 – GDM7205 PLATFORM SYSTEM BOM ESTIMATE – 2008 HALF-MINI-CARD APPLICATION (SOURCE REVEAL WIRELESS)..................................................................................................................................................................................................86! TABLE 8-21– GDM7205 CHIPSET DIE SIZE, COST AND PRICE ESTIMATES IN 2008 (SOURCE REVEAL WIRELESS)....................88! TABLE 8-22 – GDM7205 (65NM) MONOLITHIC DIE SIZE PROJECTION (SOURCE REVEAL WIRELESS)...........................................88! TABLE 8-23 – GDM7205 (65NM) COST AND PRICE ESTIMATES IN 4Q10 (SOURCE REVEAL WIRELESS)........................................89! TABLE 8-24 - GCT WIMAX CHIPSET SWOT ANALYSIS (SOURCE REVEAL WIRELESS).......................................................................90! TABLE 8-25 - INTEL MAIN CUSTOMERS/OPERATORS MATRIX TABLE ESTIMATE (SOURCE REVEAL WIRELESS)......................92! TABLE 8-26 – CONNECTION 2400 MINI-CARD PLATFORM BOM ESTIMATE (SOURCE REVEAL WIRELESS)................................104! TABLE 8-27 – CONNECTION 2500 MINI-CARD PLATFORM BOM ESTIMATE (SOURCE REVEAL WIRELESS)................................105!

TABLE 8-28 – CONNECTION 2400/2300R CHIPSET DIE SIZES, COST AND PRICE ESTIMATES IN 4Q2008 (SOURCE REVEAL WIRELESS)................................................................................................................................................................................................107! TABLE 8-29 – CONNECTION 2400/2320R CHIPSET DIE SIZES, COST AND PRICE ESTIMATES IN 2Q2009 (SOURCE REVEAL WIRELESS)................................................................................................................................................................................................107! TABLE 8-30 – INTEL WIMAX CHIPSET SWOT ANALYSIS (SOURCE REVEAL WIRELESS).................................................................109! TABLE 8-31 – SEC MAIN CUSTOMERS/OPERATORS MATRIX TABLE ESTIMATE (SOURCE REVEAL WIRELESS).....................110! TABLE 8-32 – SEC CMC730 EXPRESS CARD PLATFORM BOM ESTIMATE (SOURCE REVEAL WIRELESS).................................116! TABLE 8-33 – CMC730/NXP UXA23465 CHIPSET DIE SIZES, COST AND PRICE ESTIMATES IN 2008 (SOURCE REVEAL WIRELESS)................................................................................................................................................................................................118! TABLE 8-34 – SEC WIMAX CHIPSET SWOT ANALYSIS (SOURCE REVEAL WIRELESS)....................................................................120!

!!

3 List of Figures

FIGURE 4-1 – WIMAX WAVE2 CHIPSET VENDOR LANDSCAPE (SOURCE REVEAL WIRELESS).......................................................23! FIGURE 5-1 – WIMAX CHIPSET FORECAST (MU) – SOURCE REVEAL WIRELESS...............................................................................26! FIGURE 5-2 – WIMAX CHIPSET MARKET ASP FORECAST ($) – SOURCE REVEAL WIRELESS.........................................................27! FIGURE 6-1 – SUBSCRIBER STATION SYSTEM ARCHITECTURE............................................................................................................28! FIGURE 6-2 – USB DONGLE ARCHITECTURE..............................................................................................................................................29! FIGURE 6-3 – EXPRESS CARD ARCHITECTURE.........................................................................................................................................29! FIGURE 6-4 – PCIE MINICARD ARCHITECTURE..........................................................................................................................................29! FIGURE 6-5 – FIXED CPE ARCHITECTURE...................................................................................................................................................30! FIGURE 6-6 - EMBEDDED SDIO ARCHITECTURE........................................................................................................................................30! FIGURE 6-7 – SUBSCRIBER STATION BASE-BAND IC ARCHITECTURE.................................................................................................31! FIGURE 6-8 – SUBSCRIBER STATION RF IC ARCHITECTURE..................................................................................................................31! FIGURE 6-9 – SUBSCRIBER STATION SINGLE-CHIP ARCHITECTURE...................................................................................................32! FIGURE 6-10 – SUBSCRIBER STATION SINGLE-CHIP VOIP NPU + WIMAX ARCHITECTURE.............................................................33! FIGURE 8-1 – MAIN WIMAX CHIPSET PLAYERS PRICE PROJECTION - 2008/2010 (SOURCE REVEAL WIRELESS).......................37! FIGURE 8-2 – BECEEM WIMAX CHIPSETS POSITIONING EXTRAPOLATION (SOURCE REVEAL WIRELESS)................................40! FIGURE 8-3 – BCS200 SUBSCRIBER STATION SYSTEM ARCHITECTURE EVALUATION (SOURCE REVEAL WIRELESS)...........43! FIGURE 8-4 – BCSM250 SUBSCRIBER STATION SYSTEM ARCHITECTURE EVALUATION (SOURCE REVEAL WIRELESS)........43! FIGURE 8-5 – BCSM250 REFERENCE BOARD PRESENTED AT CTIA WIRELESS 2008.......................................................................43! FIGURE 8-6 – BCS5200 VOICE & DATA WIMAX SYSTEM ARCHITECTURE EVALUATION (SOURCE REVEAL WIRELESS)...........44! FIGURE 8-7 – BCSB200 CHIP BLOCK DIAGRAM EVALUATION (SOURCE REVEAL WIRELESS).........................................................45! FIGURE 8-8 – BCSM250 SINGLE-CHIP BLOCK DIAGRAM EVALUATION (SOURCE REVEAL WIRELESS).........................................45! FIGURE 8-9 – BCSB5200 SINGLE-CHIP BLOCK DIAGRAM EVALUATION (SOURCE REVEAL WIRELESS).......................................46! FIGURE 8-10 – BCSR200 RF IC BLOCK DIAGRAM EVALUATION (SOURCE REVEAL WIRELESS)......................................................46! FIGURE 8-11 – BCS200 PLATFORM – ZTE/XOHM TU25 USB DONGLE TEAR DOWN (SOURCE REVEAL WIRELESS)...................47! FIGURE 8-12 – BCS200 PLATFORM SYSTEM BLOCK DIAGRAM DEDUCTION – ZTE USB DONGLE (SOURCE REVEAL WIRELESS)..................................................................................................................................................................................................48! FIGURE 8-13 – BCSB200 DIE PHOTO (SOURCE REVEAL WIRELESS)....................................................................................................51! FIGURE 8-14 – BCSM250 SIP - DIES IMPLEMENTATION PROJECTION (SOURCE REVEAL WIRELESS)..........................................52! FIGURE 8-15 – BECEEM WIMAX CHIPSETS/DIES ROADMAP EXTRAPOLATION (SOURCE REVEAL WIRELESS)..........................55! FIGURE 8-16 – BECEEM WIMAX CHIPSETS PRICE EROSION ESTIMATES (SOURCE REVEAL WIRELESS)...................................55! FIGURE 8-17 – SEQUANS SUBSCRIBER PRODUCT ROADMAP EXTRAPOLATION (SOURCE REVEAL WIRELESS)......................59! FIGURE 8-18 – SQN1130 XPRESS CARD AND MINI CARD REFERENCE DESIGNS (SOURCE SEQUANS).......................................61! FIGURE 8-19 – MITSUMI/SQN1170 SDIO MODULE (SOURCE SEQUANS)...............................................................................................62! FIGURE 8-20 - SEQUANS SQN1130 PLATFORM ARCHITECTURE EVALUATION (SOURCE REVEAL WIRELESS)..........................63! FIGURE 8-21 – ZYXEL MAX-206M2 FIXED VOIP CPE SYSTEM ARCHITECTURE EVALUATION (SOURCE REVEAL WIRELESS).64! FIGURE 8-22 – SQN1130 BLOCK DIAGRAM EVALUATION (SOURCE REVEAL WIRELESS).................................................................65!

FIGURE 8-23 – SQN1170 BLOCK DIAGRAM EVALUATION (SOURCE REVEAL WIRELESS).................................................................65! FIGURE 8-24 – SQN1210 SINGLE-DIE BLOCK DIAGRAM EVALUATION (SOURCE REVEAL WIRELESS)..........................................66! FIGURE 8-25 – SQN1140 BLOCK DIAGRAM EVALUATION (SOURCE REVEAL WIRELESS).................................................................66! FIGURE 8-26 – ZYXEL MAX-206M2 CPE WIMAX BOARD TEAR DOWN (SOURCE REVEAL WIRELESS)...........................................67! FIGURE 8-27 – SQN1130/ZYXEL MAX-206M2 CPE BLOCK DIAGRAM DEDUCTION (SOURCE REVEAL WIRELESS)......................67! FIGURE 8-28 – MITSUMI SDIO MODULE KEY COMPONENTS ESTIMATE (SOURCE SEQUANS AND REVEAL WIRELESS)..........69! FIGURE 8-29 – SQN1170 SDIO MODULE BLOCK DIAGRAM DEDUCTION (SOURCE REVEAL WIRELESS)......................................69! FIGURE 8-30 – SQN1130 DIE PHOTO (SOURCE REVEAL WIRELESS)....................................................................................................70! FIGURE 8-31 - SQN1170 SIP ANALYSIS PREDICTION (SOURCE REVEAL WIRELESS)........................................................................72! FIGURE 8-32 – SQN1170 SIP POTENTIAL STRUCTURE DEDUCTION (SOURCE REVEAL WIRELESS).............................................73! FIGURE 8-33 – SQN1210 PHYSICAL STRUCTURE DEDUCTION (SOURCE REVEAL WIRELESS)......................................................74! FIGURE 8-34 – SEQUANS SUBSCRIBER CHIPSET AND DIE ROADMAP EXTRAPOLATION (SOURCE REVEAL WIRELESS)........76! FIGURE 8-35 – SQN1130, SQN1170 AND SQN1210 CHIPSET PRICE EROSION ESTIMATES (SOURCE REVEAL WIRELESS)......77! FIGURE 8-36 – GCT WIMAX CHIPSETS POSITIONING AND OUR VISION FOR THE NEXT GENERATION (SOURCE REVEAL WIRELESS)..................................................................................................................................................................................................80! FIGURE 8-37 – GDM7205 SYSTEM ARCHITECTURE EVALUATION - MOBILE TERMINALS (SOURCE REVEAL WIRELESS).........82! FIGURE 8-38 – GDM7201+GRF7204 SYSTEM ARCHITECTURE EVALUATION - CPE (SOURCE REVEAL WIRELESS)...................82! FIGURE 8-39 – GDM7205 WIMAX SINGLE-CHIP/SINGLE-DIE BLOCK DIAGRAM EVALUATION (SOURCE REVEAL WIRELESS)..83! FIGURE 8-40 – GDM7215 WIMAX AND WIFI SINGLE-DIE BLOCK DIAGRAM PREDICTION (SOURCE REVEAL WIRELESS)..........83! FIGURE 8-41 – GRF7204 RF IC BLOCK DIAGRAM EVALUATION (SOURCE REVEAL WIRELESS)......................................................84! FIGURE 8-42 – GCT GDM7205 PLATFORM TEAR DOWN – HALF-MINI-CARD (SOURCE REVEAL WIRELESS)................................84! FIGURE 8-43 – GDM7205 PLATFORM SYSTEM BLOCK DIAGRAM DEDUCTION – HALF-MINI-CARD (SOURCE REVEAL WIRELESS)..................................................................................................................................................................................................85! FIGURE 8-44 –GDM7201 RF CORE ANALYSIS FROM DIE PHOTO (SOURCE REVEAL WIRELESS)...................................................86! FIGURE 8-45 –GDM7201 DIE PHOTO (SOURCE REVEAL WIRELESS).....................................................................................................87! FIGURE 8-46 – GCT SUBSCRIBER CHIPSET AND DIE ROADMAP EXTRAPOLATION (SOURCE REVEAL WIRELESS)..................89! FIGURE 8-47 – GCT CHIPSETS PRICE EROSION ESTIMATES (SOURCE REVEAL WIRELESS).........................................................90! FIGURE 8-48 – INTEL WIMAX CHIPSETS POSITIONING EXTRAPOLATION (SOURCE REVEAL WIRELESS)....................................93! FIGURE 8-49 – CONNECTION 2400 WIMAX SUBSCRIBER STATION SYSTEM ARCHITECTURE EVALUATION (SOURCE REVEAL WIRELESS)..................................................................................................................................................................................................97! FIGURE 8-50 – CONNECTION 2500 WIMAX/WIFI SYSTEM ARCHITECTURE EVALUATION (SOURCE REVEAL WIRELESS).........98! FIGURE 8-51 – CONNECTION 2400 CHIP BLOCK DIAGRAM EVALUATION (SOURCE REVEAL WIRELESS)....................................99! FIGURE 8-52 – CONNECTION 2500 SINGLE-CHIP WIMAX/WIFI BLOCK DIAGRAM EVALUATION (SOURCE REVEAL WIRELESS) ....................................................................................................................................................................................................................100! FIGURE 8-53 – CONNECTION 2300R RF IC BLOCK DIAGRAM EVALUATION (SOURCE REVEAL WIRELESS)...............................101! FIGURE 8-54 – CONNECTION 2320R RF MODULE BLOCK DIAGRAM DEDUCTION (SOURCE REVEAL WIRELESS)....................101! FIGURE 8-55 – CONNECTION 2400 PLATFORM TEAR DOWN – INTEL 5350 MINI-CARD (SOURCE REVEAL WIRELESS)...........102! FIGURE 8-56 – CONNECTION 2400 PLATFORM SYSTEM BLOCK DIAGRAM DEDUCTION – INTEL 5350 MINI-CARD..................103! FIGURE 8-57 – CONNECTION 250PLATFORM TEAR DOWN– INTEL 5150 MINI-CARD (SOURCE REVEAL WIRELESS)...............104! FIGURE 8-58 – CONNECTION 2500M PLATFORM SYSTEM BLOCK DIAGRAM DEDUCTION– INTEL 5150 MINI-CARD (SOURCE REVEAL WIRELESS)................................................................................................................................................................................105! FIGURE 8-59 – CONNECTION 2400 DIE PHOTO (SOURCE REVEAL WIRELESS)................................................................................106!

FIGURE 8-60 – INTEL WIMAX CHIPSETS/DIES ROADMAP EXTRAPOLATION (SOURCE REVEAL WIRELESS).............................108! FIGURE 8-61 – INTEL WIMAX CHIPSETS PRICE ESTIMATES (SOURCE REVEAL WIRELESS).........................................................109! FIGURE 8-62 – SEC WIMAX WAVE2 SUBSCRIBER PRODUCT ROADMAP EXTRAPOLATION (SOURCE REVEAL WIRELESS)..111! FIGURE 8-63 - SEC CMC730 PLATFORM ARCHITECTURE EVALUATION (SOURCE REVEAL WIRELESS)....................................113! FIGURE 8-64 – CMC730 BASE-BAND BLOCK DIAGRAM EVALUATION (SOURCE REVEAL WIRELESS).........................................114! FIGURE 8-65 – XOHM/SAMSUNG SWC-E100 EXPRESS CARD WIMAX BOARD AND KEY COMPONENTS TEAR DOWN (SOURCE REVEAL WIRELESS)................................................................................................................................................................................114! FIGURE 8-66 – XOHM/SAMSUNG SWC-E100 EXPRESS CARD BLOCK DIAGRAM DEDUCTION (SOURCE REVEAL WIRELESS) ....................................................................................................................................................................................................................115! FIGURE 8-67 – SEC CMC730 DIE PHOTO (SOURCE REVEAL WIRELESS)...........................................................................................117! FIGURE 8-68 – SEC SUBSCRIBER CHIPSET AND DIE ROADMAP EXTRAPOLATION (SOURCE REVEAL WIRELESS)................119! FIGURE 8-69 – SEC CMC730 CHIPSET PRICE EROSION ESTIMATE (SOURCE REVEAL WIRELESS).............................................120!

About Maravedis

MARAVEDIS is a leading analyst firm focusing on disruptive technologies including smart networks using WiMAX, IEEE, and 3GPP/LTE. Maravedis works with system and service providers, vendors, regulators, and institutional investors. Learn more at https://www.wendangku.net/doc/2f2942773.html,

Published 3Q 2009

?2009 Reveal Wireless LLC

info@https://www.wendangku.net/doc/2f2942773.html,

All rights reserved

No part of this document may be reproduced, recorded, photocopied, entered into a spreadsheet or information storage, and/or retrieval system of any kind by any means, electronic, mechanical, or otherwise without the expressed written permission of Reveal Wireless LLC.

The content of this report represents the interpretation and analysis of information that is either generally available to the public or released by responsible agencies or individuals. The information contained in this report is believed to be reliable but is not guaranteed as to its accuracy or completeness. Reveal Wireless LLC reserves all rights herein.

The material contained herein is for the individual use of the purchasing Licensee and may not be distributed to any other person or entity by such Licensee including, without limitation, to persons within the same corporate or other entity as such Licensee, without the express written permission of Reveal Wireless LLC.