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SN74HC175NE4中文资料

PACKAGING INFORMATION

Orderable Device Status(1)Package

Type Package

Drawing

Pins Package

Qty

Eco Plan(2)Lead/Ball Finish MSL Peak Temp(3)

84089012A ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type 8408901EA ACTIVE CDIP J161TBD A42SNPB N/A for Pkg Type 8408901FA ACTIVE CFP W161TBD A42N/A for Pkg Type JM38510/65308BEA ACTIVE CDIP J161TBD A42SNPB N/A for Pkg Type JM38510/65308BFA ACTIVE CFP W161TBD A42N/A for Pkg Type SN54HC175J ACTIVE CDIP J161TBD A42SNPB N/A for Pkg Type SN74HC175D ACTIVE SOIC D1640Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74HC175DBR ACTIVE SSOP DB162000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74HC175DBRE4ACTIVE SSOP DB162000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74HC175DE4ACTIVE SOIC D1640Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74HC175DR ACTIVE SOIC D162500Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74HC175DRE4ACTIVE SOIC D162500Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74HC175DT ACTIVE SOIC D16250Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74HC175DTE4ACTIVE SOIC D16250Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74HC175N ACTIVE PDIP N1625Pb-Free

(RoHS)

CU NIPDAU N/A for Pkg Type

SN74HC175NE4ACTIVE PDIP N1625Pb-Free

(RoHS)

CU NIPDAU N/A for Pkg Type

SN74HC175NSR ACTIVE SO NS162000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74HC175NSRE4ACTIVE SO NS162000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74HC175PW ACTIVE TSSOP PW1690Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74HC175PWE4ACTIVE TSSOP PW1690Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM SN74HC175PWLE OBSOLETE TSSOP PW16TBD Call TI Call TI

SN74HC175PWR ACTIVE TSSOP PW162000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74HC175PWRE4ACTIVE TSSOP PW162000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74HC175PWT ACTIVE TSSOP PW16250Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

SN74HC175PWTE4ACTIVE TSSOP PW16250Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM SNJ54HC175FK ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type SNJ54HC175J ACTIVE CDIP J161TBD A42SNPB N/A for Pkg Type SNJ54HC175W ACTIVE CFP W161TBD A42N/A for Pkg Type (1)The marketing status values are defined as follows:

https://www.wendangku.net/doc/2810363319.html,14-Mar-2007

ACTIVE:Product device recommended for new designs.

LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.

NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.

PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.

(2)

Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check https://www.wendangku.net/doc/2810363319.html,/productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.

Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)

(3)

MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual

basis.

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14-Mar-2007

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