半导体英文
D
大功率耗散器件high-power-dissipation device 大规模集成（LSI）large-scale integration
代工组装contract assembly
代码尔合金dymalloy
带速belt speeding
带凸点芯片技术bumped chip technique
带凸点载带技术bumped tape technique
带状键合ribbon bond
带状物stripline
单边交叉双列直插封装zigzag in-line package
单列存储器模块（SIMM）single in-line memory module
单列直插封装single in-line package
单模光纤single-mode fiber
单元element
弹素体elastomer
弹性模量modulus of elasticity
弹性模量modulus of elasticity
弹性体elastomer
氮化硅silicon nitride
氮化铝aluminum nitride
氮化硼boron nitride
导电的electrically conductive
导电环氧conductive epoxy
导热孔thermal vias
导热粘结剂thermally conductive adhesives 导热粘结性树脂thermal adheesive chemistries 导热脂thermal grease
导体conductor
导体损耗conductor loss
导体损耗condutor
倒置微带inverted microstrip
倒装芯片filp chip
德拜温度debye temperature
低a粒子辐射low alpha emission
低a粒子辐射模塑low-alpha-radiation molding
低温共烧陶瓷（LTCC）low-temperature cofired ceramic 低噪声放大器low-noise amplifier
滴涂（球形顶封装）glob-top
地平面连接器ground plane connector
典型材料typical material
典型的黏度值typical viscosities
电磁干扰（EMI）electromagnetic interference
电导率electrical conductivity
电镀electroplating
电镀electroplating
电镀钉头plated stud
电镀钉头凸点plated stud bumps
电镀工艺electroplating
电镀铜plated copper
电感inductance
电感器inductor
电解铜ED copper
电绝缘性质electrical insulation properties
电流额定值current rating
电流容量current capacity
电流泄漏current leakage
电路卡组件冷却circuit card assmbly cooling
电迁移electromigration
电容率，介电常数permittivity
电性能electrical characteristics
电性能electrical property
电性能electrical performance
电性能electrical property
电性能要求electrical requirement
电压驻波比（VSWR)voltage standing wave ratio
电噪声electrical noise
电噪声electrical noise
电阻电压系数(VCR)voltage coefficient of resistance
电阻率electrical resistivity
电阻器resistor
电阻温度系数（TCR)temperature coefficient of resistance 淀积deposition
叠层stackup
叠式微带overlay microstrip
蝶形封装butterfly package
钉头凸点stud bumping
顶部钎焊器件top-brazed device
定向线耦合器directional line
动态热机械分析dynamic mechanical analysis
动态热机械分析dynamic mechanical analysis
动态随机存储器DRAM
渡Ni基底Ni-plated substrate
镀金基板gold-plated substrate
镀通孔（PTH）plated-through hole
断裂模量modulus of rupture
堆叠BGA stacked BGA
堆叠封装stacking
堆叠封装stacked package
堆叠管芯stacked die
堆叠管芯BGA封装stacked die BGA package
堆叠焊球互连stacked solder ball interconnect
堆叠芯片stacked die
堆叠圆片stacked wafer
对流convection
对流类型type of
多层陶瓷multilayer ceramic
多层陶瓷laminated ceramic
多芯片封装（MCP）multichip package
多芯片模块（MCM)multichip module
多注入头磨具设备multiplunger molding equipment