Product Bulletin
Dimensions – Millimeters (Inches)
See Capacitance Value Table
below for thickness dimension.
C 0805
F 684K 4R A C
Style
C - Ceramic Size Code
See dimension table Specification F - Open Mode
Capacitance Code, pF
First two digits represent significant figures.
Third digit specifies number of zeros. 100 pF = 101.(Use “9” for 1.0 through 9.9 pF)(Use “8” for 0.1 through .99 pF)Capacitance Tolerance K = ± 10%M = ±20%
Voltage 4 = 16V 3 = 25V 5 = 50V
Temperature Characteristic
Designated by Capacitance Change Over Temperature Range R = X 7R (±15%) (-55°C +125°C)End Metallization C = Standard (Tin-plate
nickel barrier)
Failure Rate Level A = Not Applicable
F-9073B 9/06
Surface Mount Ceramic Chip Capacitors – Open Mode - X7R - Capacitance Extensions
EIA Size Metric Size L
W B
S
Code Code Length
Width
Bandwidth Seperation 08052012 2.0 (.079) ± 0.02 (.008) 1.25 (.049) ± 0.2 (.008)0.5 (.020) ± 0.25 (.010)0.75 (.030)
12063216 3.2 (1.26) ± 0.2(.008) 1.6 (.063) ± 0.2 (.008)0.5 (.020) ± 0.25 (.010)-1210
3225
3.2 (.126) ± 0.2 (.008)
2.5 (.098) ± 0.2 (.008)
0.5 (.020) ± 0.25 (.010)
-
The open-mode dimension (OM)exceeds the termination bandwidth dimensions: OM >BW
? KEMET Electronics Corporation ? P .O. Box 5928 ? Greenville, SC 29606 (864) 963-6300 ? https://www.wendangku.net/doc/393623441.html,
F-9073B 9/06
Electrical Parameters
As detailed in the KEMET Surface Mount Catalog F3102 for X7R, with the following specific requirements based on room temperature (25°C) parameters:
? Operating Range: -55°C to +125°C, with no-bias capacitance shift limited to the ± 15% over that range. ? Insulating Resistance (IR) measured after 2 minutes at rated voltage @25°C: Limit is 500 megohm-
microfarads or 10,000M ?
, whichever of the two is smaller.
? Capacitance and Dissipation Factor (DF) are measured under the following conditions:
1kHz and 1 Vrms if capacitance * 10μF 120Hz and 0.5 Vrms if capacitance $ 10μF ? DF limits:
50 -200 Volts ü 2.5% 16 -25 Volts ü 3.5% 6.3 / 10 Volts ü 5.0%
Soldering Process
All parts incorporate the standard KEMET barrier layer of pure nickel, with an ove rplate of pure tin to provide excellent solderability as well as resistance to leaching. The recommended mounting techniques are as follows: ? 0402 / 1210 case size s ü Solder Reflow
? 0603 / 0805 / 1206 case sizes ü Solder Wave / Solder Reflow
Marking
These chips will be supplied unmarked. If required, they can be laser-marked as an extra option. Details on the marking format are included in KEMET Surface Mount catalog F3102.
In general, the information provided in the KEMET Surface Mount catalog F3102 applies to these capacitors. The Information in this bulletin supplements that in the catalog