CUSTOMER SSC
Drawn
Approval
Approval
1. Absolute Maximum Ratings
2. Electro Characteristics
3. Outline Dimension
4. Electro-Optical characteristic Diagram
5. Rank of WH603R
6. Reliability tests
7. Packing
8. Soldering
9. Precaution for use
? 1.6 X 0.8 X 0.8 mm ?Emitted Color : Amber ?
Wavelength : 607nm ?
Diffused Flat Mold
-Small size suitable for compact appliances.
-Surface-mounted chip LED device.-Pb-free and RoHS complaint component.
-High brightness, wide variety of colors are available
-Tape and Reel packing.-
Increases the life time of battery.
Applications
?
Cellular phone’s keypad lightning ?Other decoration lighting ?Information Boards ?
Lighting for Small Size Device.
2. Electro-Optical Characteristics
℃
-40 ~ 100
T stg.
Storage Temperature
V 5V R Reverse Voltage ℃-30 ~ 85T opr.Operation Temperature mA 50I FM *1Peak Forward Current F *1 I FM conditions: Pulse width Tw ≤0.1ms and Duty ratio ≤1/10.
nm I F =20 ?Spectral Bandwidth -30-Δλ-
60080-1.9Min -
615-102.3Max 120
606120-2.0Typ ?
I F =20 ?
2θ1/2
Viewing Angle *3
V I F =20 ?V F Forward Voltage nm I F =20 ?λd Wavelength mcd I F =20 ?I V Luminous Intensity *2
?V R =5V I R Reverse Current Unit Condition Symbol Parameter-(Ta=25℃)
*2 The luminous intensity IV is measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the
LED package.
*3 θ1/2is the off-axis where the luminous intensity is 1/2 the peak intensity.
[Note] All products confirm to the listed minimum and maximum specifications for electric and optical characteristics, when operated at 20mA within the maximum ratings shown above. All measurements were made under the standardized environment of SSC.(Tolerance : I v ±10 %, λD ±2 nm, V F ±0.1 V)
Z-Power LED X10490Technical Data Sheet
3.Outline Dimension
( Tolerance: ±0.1, Unit: mm )
PCB
1.1
1.2
0.8
0.28
Side view
Polarity Mark
Bottom view
0.3
0.3
1.6
Top view 0.8
2.4
[Recommended Solder Pattern]
0.8
0.8
* MATERIALS
Au Plating Copper Alloy
Electrodes
Epoxy Resin Encapsulating Resin
BT Resin Package MATERIALS PARTS
1.8 1.9
2.0 2.1
1
10
F o r w a r d C u r r e n t I F (m A )
Forward Voltage V F (V)
Relative Luminous Intensity vs Forward Current
(T a =25 O C )
0510********
40
80
120
160
200
R e l a t i v e I n t e n s i t y I V (%)
-25
02550
75100
510152025F o r w a r d c u r r e n t I F [m A Ambient temperature Ta[o
C]
(T a =25 O C )
Radiation Diagram
Z-Power LED X10490
Technical Data Sheet
5. Rank of AM101-DP
* Rank Division
AM101-DP-12
12
610 ~ 615
AM101-DP-1111605 ~ 610AM101-DP-1010600 ~ 605
110 ~ 160
AM101-DP-09
9
610 ~ 615
AM101-DP-088605 ~ 610AM101-DP-077600 ~ 605
80 ~ 110
2.1 ~ 2.3
AM101-DP-066610 ~ 615AM101-DP-055605 ~ 610AM101-DP-044600 ~ 605
110 ~ 160
AM101-DP-033
610 ~ 615
AM101-DP-022605 ~ 610AM101-DP-011600 ~ 605
80 ~ 110
1.9 ~
2.1
At I F =20mA At I F =20mA
At I F =20mA
Label Code
BIN
Λd [nm]
I V [mcd]V F [V]
Z-Power LED X10490Technical Data Sheet
6. Reliability Tests
0/221 time 2kV, 1.5k Ω; 100pF
ESD
(Human Body Model)0/40100 cycles
T a = -30oC (30min) ~ 85oC (30min) (Transfer time : 10sec, 1Cycle = 1hr)Thermal Shock
0/22
100hrs
T a = 85oC, RH = 85%, I F = 20mA
Temperature Humidity
Operating
0/221000hrs T a = 85oC, RH = 85%Temperature Humidity
Storage 0/221000hrs T a = -40oC Low Temperature Storage 0/221000hrs T a = 100oC High Temperature Storage 0/220/220/220/22Failures
1 time T s = 255 ±5oC, t = 10sec Resistance to soldering Heat
1000hrs T a = 85oC, I F = 20mA High Temperature Operating 1000hrs
T a = -30oC, I F = 20mA
Low Temperature Operating
1000hrs T a = RT, I F = 20mA Life Test
Note
Condition
Item
< Judging Criteria For Reliability Tests >
LSL [2]X 0.7
ФV
USL X 2.0I R USL [1]X 1.2V F Notes :
[1] USL : Upper Standard Level [2] LSL : Lower Standard Level.
Z-Power LED X10490Technical Data Sheet
7. Packing
Tolerance: ±0.2, Unit: ㎜
(1) Quantity: 4,000pcs./Reel
(2) Cumulative Tolerance: Cumulative Tolerance/10pitches to be ±0.2mm
(3) Adhesion Strength of Cover Tape: Adhesion strength to be 0.1-0.7N when the over tape is
turned off from the carrier tape at10?angle to be the carrier tape.
(4) Package: P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof
Package.
Z-Power LED X10490Technical Data Sheet
●Reel Packing Structure
Aluminum Vinyl Bag
Outer Box
Reel
CHIP LED
SEOUL SEMICONDUCTOR CO.,LTD
a
b
Q'YT : 40,000EA
DATE :
LOT NO : CODE : b 220
*Material: Paper(SW3B(B))SIZE(mm)7inch TYPE
c
a
245
c 142
P
/N : ##########
L
o t N o #########?? 4000
?? 4000
P
/N : ##########L
o t N o ###########
##
Semiconductor EcoLight
Acriche
TUV
RoHS
MADE IN KOREA
??? SSC-AM101-DP
??? SSC-AM101-DP
PART : SSC-AM101-DP
Z-Power LED X10490
Technical Data Sheet
8. Soldering
10 sec. Max.
Soldering time
Condition
240℃Max.
Peak-Temperature 120 sec. Max.Pre-heat time 120~150℃Pre-heat Lead Solder
10 sec. Max.
Soldering time
Condition
260℃Max.
Peak-Temperature 120 sec. Max.Pre-heat time 150~200℃Pre-heat Lead Free Solder
260 C
Max.10 sec. Max.
o 60sec. Max.
Above 220 C
120sec. Max.
Pre-heating
150~200 C
1~5 C / sec.
o o o o 1~5 C / sec.Lead Solder
2.5~5 C / sec.o o o Pre-heating 120~150 C
120sec. Max.
60sec. Max.
Above 200 C
o 240 C
Max.10 sec. Max.
2.5~5 C / sec.
(1) Lead Solder
(2) Lead-Free Solder
Lead-frame Solder
(3) Hand Soldering conditions
Do not exceed 3 seconds at maximum 280oC under soldering iron.
(4) The encapsulated material of the LEDs is silicone.
Precautions should be taken to avoid the strong pressure on the encapsulated part.
So when using the chip mounter, the picking up nozzle that does not affect the silicone resign should be used.
Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products.
Z-Power LED X10490Technical Data Sheet
9. Precaution for use
(1) Storage
In order to avoid the absorption of moisture, it is recommended to store in a dry box (or
a desiccator) with a desiccant. Otherwise, to store them in the following environment is
recommended.
Temperature : 5oC ~30oC Humidity : maximum 65%RH
(2) Attention after open.
LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect
the light transmission efficiency, causing the light intensity to drop. Attention in followed;
a. After opened and mounted the soldering shall be quickly.
b. Keeping of a fraction
Temperature : 5 ~ 40oC Humidity : less than 30%
(3) In the case of more than 1 week passed after opening or change color of indicator
on desiccant, components shall be dried 10-12hr. at 60±5oC.
(4) Any mechanical force or any excess vibration shall not be accepted to apply during
cooling process to normal temperature after soldering.
(5) Quick cooling shall be avoided.
(6) Components shall not be mounted on warped direction of PCB.
(7) Anti radioactive ray design is not considered for the products.
(8) This device should not be used in any type of fluid such as water, oil, organic solvent
etc. When washing is required, IPA should be used.
(9) When the LEDs are illuminating, operating current should be decided after
considering the ambient maximum temperature.
(10) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3
months or more after being shipped from SSC, a sealed container with a nitrogen
atmosphere should be used for storage.
(11) The LEDs must be soldered within seven days after opening the moisture-proof
packing.
(12) Repack unused products with anti-moisture packing, fold to close any opening and
then store in a dry place.
(13) The appearance and specifications of the product may be modified for improvement
without notice.