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AM101-DP中文资料

CUSTOMER SSC

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Approval

Approval

1. Absolute Maximum Ratings

2. Electro Characteristics

3. Outline Dimension

4. Electro-Optical characteristic Diagram

5. Rank of WH603R

6. Reliability tests

7. Packing

8. Soldering

9. Precaution for use

AM101-DP中文资料

? 1.6 X 0.8 X 0.8 mm ?Emitted Color : Amber ?

Wavelength : 607nm ?

Diffused Flat Mold

-Small size suitable for compact appliances.

-Surface-mounted chip LED device.-Pb-free and RoHS complaint component.

-High brightness, wide variety of colors are available

-Tape and Reel packing.-

Increases the life time of battery.

Applications

?

Cellular phone’s keypad lightning ?Other decoration lighting ?Information Boards ?

Lighting for Small Size Device.

2. Electro-Optical Characteristics

-40 ~ 100

T stg.

Storage Temperature

V 5V R Reverse Voltage ℃-30 ~ 85T opr.Operation Temperature mA 50I FM *1Peak Forward Current F *1 I FM conditions: Pulse width Tw ≤0.1ms and Duty ratio ≤1/10.

nm I F =20 ?Spectral Bandwidth -30-Δλ-

60080-1.9Min -

615-102.3Max 120

606120-2.0Typ ?

I F =20 ?

2θ1/2

Viewing Angle *3

V I F =20 ?V F Forward Voltage nm I F =20 ?λd Wavelength mcd I F =20 ?I V Luminous Intensity *2

?V R =5V I R Reverse Current Unit Condition Symbol Parameter-(Ta=25℃)

*2 The luminous intensity IV is measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the

LED package.

*3 θ1/2is the off-axis where the luminous intensity is 1/2 the peak intensity.

[Note] All products confirm to the listed minimum and maximum specifications for electric and optical characteristics, when operated at 20mA within the maximum ratings shown above. All measurements were made under the standardized environment of SSC.(Tolerance : I v ±10 %, λD ±2 nm, V F ±0.1 V)

AM101-DP中文资料

AM101-DP中文资料

Z-Power LED X10490Technical Data Sheet

3.Outline Dimension

( Tolerance: ±0.1, Unit: mm )

PCB

1.1

1.2

0.8

0.28

Side view

Polarity Mark

Bottom view

0.3

0.3

1.6

Top view 0.8

2.4

[Recommended Solder Pattern]

0.8

0.8

* MATERIALS

Au Plating Copper Alloy

Electrodes

Epoxy Resin Encapsulating Resin

BT Resin Package MATERIALS PARTS

1.8 1.9

2.0 2.1

1

10

F o r w a r d C u r r e n t I F (m A )

Forward Voltage V F (V)

Relative Luminous Intensity vs Forward Current

(T a =25 O C )

0510********

40

80

120

160

200

R e l a t i v e I n t e n s i t y I V (%)

-25

02550

75100

510152025F o r w a r d c u r r e n t I F [m A Ambient temperature Ta[o

C]

(T a =25 O C )

Radiation Diagram

AM101-DP中文资料

Z-Power LED X10490

Technical Data Sheet

5. Rank of AM101-DP

* Rank Division

AM101-DP-12

12

610 ~ 615

AM101-DP-1111605 ~ 610AM101-DP-1010600 ~ 605

110 ~ 160

AM101-DP-09

9

610 ~ 615

AM101-DP-088605 ~ 610AM101-DP-077600 ~ 605

80 ~ 110

2.1 ~ 2.3

AM101-DP-066610 ~ 615AM101-DP-055605 ~ 610AM101-DP-044600 ~ 605

110 ~ 160

AM101-DP-033

610 ~ 615

AM101-DP-022605 ~ 610AM101-DP-011600 ~ 605

80 ~ 110

1.9 ~

2.1

At I F =20mA At I F =20mA

At I F =20mA

Label Code

BIN

Λd [nm]

I V [mcd]V F [V]

AM101-DP中文资料

AM101-DP中文资料

Z-Power LED X10490Technical Data Sheet

6. Reliability Tests

0/221 time 2kV, 1.5k Ω; 100pF

ESD

(Human Body Model)0/40100 cycles

T a = -30oC (30min) ~ 85oC (30min) (Transfer time : 10sec, 1Cycle = 1hr)Thermal Shock

0/22

100hrs

T a = 85oC, RH = 85%, I F = 20mA

Temperature Humidity

Operating

0/221000hrs T a = 85oC, RH = 85%Temperature Humidity

Storage 0/221000hrs T a = -40oC Low Temperature Storage 0/221000hrs T a = 100oC High Temperature Storage 0/220/220/220/22Failures

1 time T s = 255 ±5oC, t = 10sec Resistance to soldering Heat

1000hrs T a = 85oC, I F = 20mA High Temperature Operating 1000hrs

T a = -30oC, I F = 20mA

Low Temperature Operating

1000hrs T a = RT, I F = 20mA Life Test

Note

Condition

Item

< Judging Criteria For Reliability Tests >

LSL [2]X 0.7

ФV

USL X 2.0I R USL [1]X 1.2V F Notes :

[1] USL : Upper Standard Level [2] LSL : Lower Standard Level.

AM101-DP中文资料

Z-Power LED X10490Technical Data Sheet

AM101-DP中文资料

7. Packing

Tolerance: ±0.2, Unit: ㎜

(1) Quantity: 4,000pcs./Reel

(2) Cumulative Tolerance: Cumulative Tolerance/10pitches to be ±0.2mm

(3) Adhesion Strength of Cover Tape: Adhesion strength to be 0.1-0.7N when the over tape is

turned off from the carrier tape at10?angle to be the carrier tape.

(4) Package: P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof

Package.

AM101-DP中文资料

AM101-DP中文资料

Z-Power LED X10490Technical Data Sheet

●Reel Packing Structure

Aluminum Vinyl Bag

Outer Box

Reel

CHIP LED

SEOUL SEMICONDUCTOR CO.,LTD

a

b

Q'YT : 40,000EA

DATE :

LOT NO : CODE : b 220

*Material: Paper(SW3B(B))SIZE(mm)7inch TYPE

c

a

245

c 142

P

/N : ##########

L

o t N o #########?? 4000

?? 4000

P

/N : ##########L

o t N o ###########

##

Semiconductor EcoLight

Acriche

TUV

RoHS

MADE IN KOREA

??? SSC-AM101-DP

??? SSC-AM101-DP

PART : SSC-AM101-DP

AM101-DP中文资料

Z-Power LED X10490

Technical Data Sheet

8. Soldering

10 sec. Max.

Soldering time

Condition

240℃Max.

Peak-Temperature 120 sec. Max.Pre-heat time 120~150℃Pre-heat Lead Solder

10 sec. Max.

Soldering time

Condition

260℃Max.

Peak-Temperature 120 sec. Max.Pre-heat time 150~200℃Pre-heat Lead Free Solder

260 C

Max.10 sec. Max.

o 60sec. Max.

Above 220 C

120sec. Max.

Pre-heating

150~200 C

1~5 C / sec.

o o o o 1~5 C / sec.Lead Solder

2.5~5 C / sec.o o o Pre-heating 120~150 C

120sec. Max.

60sec. Max.

Above 200 C

o 240 C

Max.10 sec. Max.

2.5~5 C / sec.

(1) Lead Solder

(2) Lead-Free Solder

Lead-frame Solder

(3) Hand Soldering conditions

Do not exceed 3 seconds at maximum 280oC under soldering iron.

(4) The encapsulated material of the LEDs is silicone.

Precautions should be taken to avoid the strong pressure on the encapsulated part.

So when using the chip mounter, the picking up nozzle that does not affect the silicone resign should be used.

Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products.

Z-Power LED X10490Technical Data Sheet

AM101-DP中文资料

9. Precaution for use

(1) Storage

In order to avoid the absorption of moisture, it is recommended to store in a dry box (or

a desiccator) with a desiccant. Otherwise, to store them in the following environment is

recommended.

Temperature : 5oC ~30oC Humidity : maximum 65%RH

(2) Attention after open.

LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect

the light transmission efficiency, causing the light intensity to drop. Attention in followed;

a. After opened and mounted the soldering shall be quickly.

b. Keeping of a fraction

Temperature : 5 ~ 40oC Humidity : less than 30%

(3) In the case of more than 1 week passed after opening or change color of indicator

on desiccant, components shall be dried 10-12hr. at 60±5oC.

(4) Any mechanical force or any excess vibration shall not be accepted to apply during

cooling process to normal temperature after soldering.

(5) Quick cooling shall be avoided.

(6) Components shall not be mounted on warped direction of PCB.

(7) Anti radioactive ray design is not considered for the products.

(8) This device should not be used in any type of fluid such as water, oil, organic solvent

etc. When washing is required, IPA should be used.

(9) When the LEDs are illuminating, operating current should be decided after

considering the ambient maximum temperature.

(10) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3

months or more after being shipped from SSC, a sealed container with a nitrogen

atmosphere should be used for storage.

(11) The LEDs must be soldered within seven days after opening the moisture-proof

packing.

(12) Repack unused products with anti-moisture packing, fold to close any opening and

then store in a dry place.

(13) The appearance and specifications of the product may be modified for improvement

without notice.