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TPD4E001中文资料

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FEATURES

APPLICATIONS

DESCRIPTION/ORDERING INFORMATION

IO3

IO4V CC

QFN PACKAGE (TOP VIEW)

DRL PACKAGE (TOP VIEW)

IO3

IO4V CC TPD4E001

LOW-CAPACITANCE 4-CHANNEL ±15-kV ESD PROTECTION ARRAY

FOR HIGH-SPEED DATA INTERFACES

SLLS682C–JULY 2006–REVISED APRIL 2007

?USB 2.0?

ESD Protection Exceeds

?Ethernet –±15-kV Human-Body Model (HBM)

?FireWire?–±8-kV IEC 61000-4-2Contact Discharge ?Video

–±15-kV IEC 61000-4-2Air-Gap Discharge ?Cell Phones

?Low 1.5-pF Input Capacitance ?SVGA Video Connections ?Low 1-nA (Max)Leakage Current ?

Glucosemeters

?Low 1-nA Supply Current

?0.9-V to 5.5-V Supply-Voltage Range ?Four-Channel Device

?Space-Saving DRL and QFN Package Options ?

Alternate 2-,3-,6-Channel Options Available:TPD2E001,TPD3E001,and TPD6E001

The TPD4E001is a low-capacitance ±15-kV ESD-protection diode array designed to protect sensitive electronics attached to communication lines.Each channel consists of a pair of diodes that steer ESD current pulses to V CC or GND.The TPD4E001protects against ESD pulses up to ±15-kV Human-Body Model (HBM),±8-kV Contact Discharge,and ±15-kV Air-Gap Discharge,as specified in IEC 61000-4-2.This device has a 1.5-pF capacitance per channel,making it ideal for use in high-speed data IO interfaces.The TPD4E001is a quad-ESD structure designed for Ethernet and FireWire?applications.

The TPD4E001is available in DRL and thin QFN packages and is specified for –40°C to 85°C operation.

ORDERING INFORMATION

T A

PACKAGE (1)

ORDERABLE PART NUMBER TOP-SIDE MARKING 1.6×1.6DRL

Reel of 4000TPD4E001DRLR 2CR –40°C to 85°C 3×3QFN

Reel of 1000

TPD4E001DRSR

ZWM

(1)

For the most current package and ordering information,see the Package Option Addendum at the end of this document,or see the TI website at https://www.wendangku.net/doc/4c5242449.html, .

Please be aware that an important notice concerning availability,standard warranty,and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

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Absolute Maximum Ratings (1)

TPD4E001

LOW-CAPACITANCE 4-CHANNEL ±15-kV ESD PROTECTION ARRAY

FOR HIGH-SPEED DATA INTERFACES

SLLS682C–JULY 2006–REVISED APRIL 2007

FUNCTIONAL BLOCK DIAGRAM

PIN DESCRIPTION

QFN/DRL https://www.wendangku.net/doc/4c5242449.html, FUNCTION

1,2,4,5

IOx ESD-protected channel 3GND Ground

6V CC Power-supply input.Bypass V CC to GND with a 0.1-μF ceramic capacitor.EP

Exposed pad.Connect to GND.

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT V CC –0.37

V V I/O –0.3V CC +0.3

V T stg Storage temperature range –65

150°C T J

Junction temperature 150°C Infrared (15s)220Bump temperature (soldering)°C Vapor phase (60s)

215Lead temperature (soldering,10s)

300

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device.These are stress ratings only,and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied.Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

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Electrical Characteristics ESD Protection

TPD4E001 LOW-CAPACITANCE4-CHANNEL±15-kV ESD PROTECTION ARRAY

FOR HIGH-SPEED DATA INTERFACES

SLLS682C–JULY2006–REVISED APRIL2007

V CC =5V±10%,T

=-40°C to85°C(unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP(1)MAX UNIT

V CC Supply voltage0.9 5.5V

I CC Supply current1100nA

V F Diode forward voltage I F=10mA0.650.95V

V BR Breakdown Voltage I BR=10mA11V

Positive transients V CC+25

T A=25°C,±15-kV HBM,

I F=10A Negative transients–25

T A=25°C,Positive transients V CC+60

±8-kV Contact Discharge

V C Channel clamp voltage(2)V

Negative transients–60

(IEC61000-4-2),I F=24A

T A=25°C,Positive transients V CC+100

±15-kV Air-Gap Discharge

Negative transients–100

(IEC61000-4-2),I F=45A

I i/o Channel leakage current V i/o=GND to V CC±1nA

C i/o Channel input capacitance V CC=5V,Bias of V CC/2 1.5pF

(1)Typical values are at V CC=5V and T A=25°C.

(2)Channel clamp voltage is not production tested

PARAMETER TYP UNIT HBM±15kV

IEC61000-4-2Contact Discharge±8kV

IEC61000-4-2Air-Gap Discharge±15kV 元器件交易网https://www.wendangku.net/doc/4c5242449.html,

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TYPICAL OPERATING

CHARACTERISTICS

0.00

1.00

2.00

2.50

3.00

4.00

5.00

IO Voltage (V)

1.00

1.201.401.601.80

2.002.20I O C a p a c i t a n c e (p F

)

110

100

1000

–40

Temperature (°C)

I O L e a k a g e C u r r e n t (p A )

TPD4E001

LOW-CAPACITANCE 4-CHANNEL ±15-kV ESD PROTECTION ARRAY

FOR HIGH-SPEED DATA INTERFACES

SLLS682C–JULY 2006–REVISED APRIL 2007

IO CAPACITANCE

IO VOLTAGE (V CC =5.0V)

IO LEAKAGE CURRENT

TEMPERATURE (V CC =5.5V)

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APPLICATION INFORMATION

Detailed Description

TPD4E001

LOW-CAPACITANCE 4-CHANNEL ±15-kV ESD PROTECTION ARRAY

FOR HIGH-SPEED DATA INTERFACES

SLLS682C–JULY 2006–REVISED APRIL 2007

When placed near the connector,the TPD4E001ESD solution offers little or no signal distortion during normal operation due to low IO capacitance and ultra-low leakage current specifications.The TPD4E001ensures that the core circuitry is protected and the system is functioning properly in the event of an ESD strike.For proper operation,the following layout/design guidelines should be followed:

1.Place the TPD4E001solution close to the connector.This allows the TPD4E001to take away the energy associated with ESD strike before it reaches the internal circuitry of the system board.

2.Place a 0.1-μF capacitor very close to the V CC pin.This limits any momentary voltage surge at the IO pin during the ESD strike event.

3.Ensure that there is enough metallization for the V CC and GND loop.During normal operation,the TPD4E001consumes nA leakage current.But during the ESD event,V CC and GND may see 15A to 30A of current,depending on the ESD level.Sufficient current path enables safe discharge of all the energy associated with the ESD strike.

4.Leave the unused IO pins floating .

5.The V CC pin can be connected in two different ways:

a.If the V CC pin is connected to the system power supply,the TPD4E001works as a transient suppressor

for any signal swing above V CC +V F .A 0.1-μF capacitor on the device V CC pin is recommended for ESD bypass.

b.If the V CC pin is not connected to the system power supply,the TPD4E001can tolerate higher signal

swing in the range up to 10V.Please note that a 0.1μF capacitor is still recommended at the V CC pin for ESD bypass.

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PACKAGING INFORMATION

Orderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)

Lead/Ball Finish MSL Peak Temp (3)TPD4E001DRLR ACTIVE SOT-553DRL 64000Green (RoHS &

no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TPD4E001DRLRG4

ACTIVE

SOT-553

DRL

4000Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

(1)

The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.

LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.

NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.

PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.

(2)

Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check https://www.wendangku.net/doc/4c5242449.html,/productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.

Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)

(3)

MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but

may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.

PACKAGE OPTION ADDENDUM

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17-May-2007

TAPE AND REEL INFORMATION

Device Package Pins Site Reel

Diameter

(mm)

Reel

Width

(mm)

A0(mm)B0(mm)K0(mm)P1

(mm)

Pin1

Quadrant

TPD4E001DRLR DRL6HNT1809 1.78 1.780.6948Q3

TAPE AND REEL BOX INFORMATION

Device Package Pins Site Length(mm)Width(mm)Height(mm) TPD4E001DRLR DRL6HNT201.0192.026.0

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