当前位置：文档库 › NA556NE4中文资料

NA556NE4中文资料

https://www.wendangku.net/doc/436709315.html, FEATURES

APPLICATIONS

1DISCH

1THRES

1CONT

1RESET

1OUT

1TRIG

GND

V CC

2DISCH

2THRES

2CONT

2RESET

2OUT

2TRIG NA556...D OR N PACKAGE

NE556...D,N,OR NS PACKAGE

SA556...D OR N PACKAGE

SE556...J PACKAGE

(TOP VIEW)

DESCRIPTION/ORDERING INFORMATION NA556,NE556,SA556,SE556 DUAL PRECISION TIMERS SLFS023G–APRIL1978–REVISED JUNE2006

?Two Precision Timing Circuits Per Package

?Astable or Monostable Operation

?TTL-Compatible Output Can Sink or Source

up to150mA

?Active Pullup or Pulldown

?Designed to Be Interchangeable With

Signetics NE556,SA556,and SE556

?Precision Timers From Microseconds to

Hours

?Pulse-Shaping Circuits

?Missing-Pulse Detectors

?Tone-Burst Generators

?Pulse-Width Modulators

?Pulse-Position Modulators

?Sequential Timers

?Pulse Generators

?Frequency Dividers

?Application Timers

?Industrial Controls

?Touch-Tone Encoders

These devices provide two independent timing circuits of the NA555,NE555,SA555,or SE555type in each package.These circuits can be operated in the astable or the monostable mode with external resistor-capacitor (RC)timing control.The basic timing provided by the RC time constant can be controlled actively by modulating the bias of the control-voltage input.

The threshold(THRES)and trigger(TRIG)levels normally are two-thirds and one-third,respectively,of V CC. These levels can be altered by using the control voltage(CONT)terminal.When the trigger input falls below trigger level,the flip-flop is set and the output goes high.If the trigger input is above the trigger level and the threshold input is above the threshold level,the flip-flop is reset,and the output is low.The reset(RESET)input can override all other inputs and can be used to initiate a new timing cycle.When RESET goes low,the flip-flop is reset and the output goes low.When the output is low,a low-impedance path is provided between the discharge(DISCH)terminal and ground(GND).

https://www.wendangku.net/doc/436709315.html,

GND

RESET can override TRIG,which can override THRES.

NA556,NE556,SA556,SE556DUAL PRECISION TIMERS

SLFS023G–APRIL 1978–REVISED JUNE 2006

ORDERING INFORMATION

V T (MAX)T A

PACKAGE (1)

ORDERABLE PART NUMBER TOP-SIDE MARKING V CC =15V

PDIP –N

Tube of 25NE556N NE556N Tube of 50NE556D 0°C to 70°C

11.2V

SOIC –D NE556Reel of 2500NE556DR SOP –NS

Reel of 2000NE556NSR NE556–40°C to 85°C 11.2V PDIP –N Tube of 25SA556N SA556N PDIP –N Tube of 25NA556N NA556N –40°C to 105°C

11.2V

Tube of 50NA556D SOIC –D NA556Reel of 2500NA556DR SE556J SE556J –55°C to 125°C 10.6V

CDIP –J

Tube of 25

SE556JB

(1)

Package drawings,standard packing quantities,thermal data,symbolization,and PCB design guidelines are available at https://www.wendangku.net/doc/436709315.html,/sc/package.

FUNCTION TABLE

(each timer)

TRIGGER THRESHOLD DISCHARGE RESET OUTPUT VOLTAGE (1)VOLTAGE (1)SWITCH

Low Irrelevant Irrelevant Low On High <1/3V DD Irrelevant High Off High >1/3V DD >2/3V DD Low

High >1/3V DD

<2/3V DD

As previously established

(1)

Voltage levels shown are nominal.

FUNCTIONAL BLOCK DIAGRAM,EACH TIMER

https://www.wendangku.net/doc/436709315.html,

Absolute Maximum Ratings(1) Recommended Operating Conditions NA556,NE556,SA556,SE556 DUAL PRECISION TIMERS SLFS023G–APRIL1978–REVISED JUNE2006

over operating free-air temperature range(unless otherwise noted)

MIN MAX UNIT V CC Supply voltage(2)18V

V I Input voltage CONT,RESET,THRES,and TRIG V CC V

I O Output current±225mA

D package86

θJA Package thermal impedance(3)(4)N package80°C/W

NS package76

θJC Package thermal impedance(5)(6)J package15.05°C/W T J Operating virtual junction temperature150°C Lead temperature1,6mm(1/16in)from case for60s J package300°C

Lead temperature1,6mm(1/16in)from case for10s D,N,or NS package260°C

T stg Storage temperature range–65150°C (1)Stresses beyond those listed under"absolute maximum ratings"may cause permanent damage to the device.These are stress ratings

only,and functional operation of the device at these or any other conditions beyond those indicated under"recommended operating conditions"is not implied.Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)All voltage values are with respect to network ground terminal.

(3)Maximum power dissipation is a function of T J(max),θJA,and T A.The maximum allowable power dissipation at any allowable ambient

temperature is P D=(T J(max)–T A)/θJA.Operating at the absolute maximum T J of150°C can affect reliability.

(4)The package thermal impedance is calculated in accordance with JESD51-7.

(5)Maximum power dissipation is a function of T J(max),θJC,and T C.The maximum allowable power dissipation at any allowable case

temperature is P D=(T J(max)–T C)/θJC.Operating at the absolute maximum T J of150°C can affect reliability.

(6)The package thermal impedance is calculated in accordance with MIL-STD-883.

MIN MAX UNIT

NA556,NE556,SA556 4.516

V CC Supply voltage V

SE556 4.518

V I Input voltage CONT,RESET,THRES,and TRIG V CC V

I O Output current±200mA

NA556–40105

NE556070

T A Operating free-air temperature°C

SA556–4085

SE556–55125

https://www.wendangku.net/doc/436709315.html,

Electrical Characteristics

NA556,NE556,SA556,SE556DUAL PRECISION TIMERS

SLFS023G–APRIL 1978–REVISED JUNE 2006

V CC =5V to 15V,T A =25°C (unless otherwise noted)

NA556NE556SE556PARAMETER

TEST CONDITIONS

UNIT

SA556MIN

TYP MAX MIN TYP MAX V CC =15V 8.81011.29.41010.6Threshold voltage V T V level

V CC =5V

2.4

3.3

4.2 2.7

3.34I T

Threshold current (1)

3025030250nA 4.5

5.6

4.85

5.2V CC =15V

T A =–55°C to 125°C

36V TRIG

Trigger voltage level

V 1.1

1.67

2.2

1.45

1.67

1.9V CC =5V

T A =–55°C to 125°C

1.9I TRIG Trigger current TRIG at 0V

0.520.50.9μA 0.3

0.7

0.3

0.7

1V RESET Reset voltage level V T A =–55°C to 125°C 1.1RESET at V CC 0.10.40.10.4I RESET Reset current mA RESET at 0V

–0.4 1.5–0.4–1Discharge switch I DISCH

2010020100nA off-state current 9

9.610

10.4V CC =15V T A =–55°C to 125°C

9.610.4Control voltage V CONT

V (open circuit)

2.6

3.3

2.9

3.3 3.8V CC =5V T A =–55°C to 125°C

2.9

3.80.1

0.25

0.10.15V CC =15V,I OL =10mA T A =–55°C to 125°C

0.20.4

0.75

0.4

0.5V CC =15V,I OL =50mA

T A =–55°C to 125°C

2.5

2.2V CC =15V,I OL =100mA Low-level

T A =–55°C to 125°C

2.7

V OL

V output voltage

V CC =15V,I OL =200mA

2.5

V CC =5V,T A =–55°C to 125°C

0.35

I OL =3.5mA 0.1

0.25

0.1

0.15V CC =5V,I OL =5mA

T A =–55°C to 125°C

0.8V CC =5V,I OL =8mA 0.15

0.3

0.150.25

12.75

13.3

1313.3

V CC =15V,I OH =–100mA

T A =–55°C to 125°C

High-level V OH

V CC =15V,I OH =–200mA 12.5

12.5V

output voltage

2.75

3.3

3 3.3

V CC =5V,I OH =–100mA T A =–55°C to 125°C 2

V CC =15V 20302024Output low,No load

V CC =5V 612610I CC

Supply current

V CC =15V 18261820Output high,No load

V CC =5V

(1)

This parameter influences the maximum value of the timing resistors R and R B in the circuit of Figure 1.For example,when V CC =5V,the maximum value is R =R A +R B ≈3.4M ?,and for V CC =15V,the maximum value is ≈10M ?.

https://www.wendangku.net/doc/436709315.html,

Operating Characteristics NA556,NE556,SA556,SE556 DUAL PRECISION TIMERS SLFS023G–APRIL1978–REVISED JUNE2006

=5V and15V

NA556

NE556SE556

TEST

PARAMETER UNIT

SA556

CONDITIONS(1)

MIN TYP MAX MIN TYP MAX

Each timer,

130.5 1.5(4) monostable(3)

Initial error of timing

T A=25°C

interval(2)Each timer,astable(5) 2.25% 1.5%

Timer1–Timer2±1±0.5

Each timer,

5030100(4) Temperature monostable(3)

coefficient of timing T A=MIN to MAX ppm/°C Each timer,astable(5)15090

interval

Timer1–Timer2±10±10

Each timer,

0.10.50.050.2(4)

Supply voltage monostable(3)

sensitivity of timing T A=25°C%/V Each timer,astable(5)0.30.15

interval

Timer1–Timer2±0.2±0.1

C L=15pF,

Output-pulse rise time100300100200(4)ns

T A=25°C

C L=15pF,

Output-pulse fall time100300100200(4)ns

T A=25°C

(1)For conditions shown as MIN or MAX,use the appropriate value specified under recommended operating conditions.

(2)Timing-interval error is defined as the difference between the measured value and the average value of a random sample from each

process run.

(3)Values specified are for a device in a monostable circuit similar to Figure2,with the following component values:R A=2k?to100k?,

C=0.1μF.

(4)On products compliant to MIL-PRF-38535,this parameter is not production tested.

(5)Values specified are for a device in an astable circuit similar to Figure1,with the following component values:R A=1k?to100k?,

C=0.1μF.

https://www.wendangku.net/doc/436709315.html,

APPLICATION INFORMATION

OUT

R OUT

NOTE A:Bypassing the control-voltage input to ground with a

capacitor might improve operation.This should be evaluated for individual applications.

NA556,NE556,SA556,SE556DUAL PRECISION TIMERS

SLFS023G–APRIL 1978–REVISED JUNE 2006

Figure 1.Circuit for Astable Operation Figure 2.Circuit for Monostable Operation

PACKAGING INFORMATION

Orderable Device Status(1)Package

Type Package

Drawing

Pins Package

Qty

Eco Plan(2)Lead/Ball Finish MSL Peak Temp(3)

JM38510/10902BCA ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type NA556D ACTIVE SOIC D1450Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

NA556DG4ACTIVE SOIC D1450Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

NA556DR ACTIVE SOIC D142500Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

NA556DRG4ACTIVE SOIC D142500Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

NA556N ACTIVE PDIP N1425Pb-Free

(RoHS)

CU NIPDAU N/A for Pkg Type

NA556NE4ACTIVE PDIP N1425Pb-Free

(RoHS)

CU NIPDAU N/A for Pkg Type

NE556D ACTIVE SOIC D1450Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

NE556DBR ACTIVE SSOP DB142000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

NE556DBRE4ACTIVE SSOP DB142000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

NE556DE4ACTIVE SOIC D1450Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

NE556DR ACTIVE SOIC D142500Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

NE556DRE4ACTIVE SOIC D142500Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

NE556N ACTIVE PDIP N1425Pb-Free

(RoHS)

CU NIPDAU N/A for Pkg Type

NE556NE4ACTIVE PDIP N1425Pb-Free

(RoHS)

CU NIPDAU N/A for Pkg Type

NE556NSR ACTIVE SO NS142000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

NE556NSRE4ACTIVE SO NS142000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM SA556D OBSOLETE SOIC D14TBD Call TI Call TI

SA556DR OBSOLETE SOIC D14TBD Call TI Call TI

SA556N ACTIVE PDIP N1425Pb-Free

(RoHS)

CU NIPDAU N/A for Pkg Type

SA556NE4ACTIVE PDIP N1425Pb-Free

(RoHS)

CU NIPDAU N/A for Pkg Type SE556FKB OBSOLETE LCCC FK20TBD Call TI Call TI

SE556J ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type

SE556JB ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type (1)The marketing status values are defined as follows:

ACTIVE:Product device recommended for new designs.

LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.

NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.

PREVIEW:Device has been announced but is not in production.Samples may or may not be available.

OBSOLETE:TI has discontinued the production of the device.

https://www.wendangku.net/doc/436709315.html,31-Jul-2006

(2)

Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check https://www.wendangku.net/doc/436709315.html,/productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.

Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)

(3)

MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual

basis.

https://www.wendangku.net/doc/436709315.html,

31-Jul-2006

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.

Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:

Products Applications

Amplifiers https://www.wendangku.net/doc/436709315.html, Audio https://www.wendangku.net/doc/436709315.html,/audio

Data Converters https://www.wendangku.net/doc/436709315.html, Automotive https://www.wendangku.net/doc/436709315.html,/automotive

DSP https://www.wendangku.net/doc/436709315.html, Broadband https://www.wendangku.net/doc/436709315.html,/broadband

Interface https://www.wendangku.net/doc/436709315.html, Digital Control https://www.wendangku.net/doc/436709315.html,/digitalcontrol

Logic https://www.wendangku.net/doc/436709315.html, Military https://www.wendangku.net/doc/436709315.html,/military

Power Mgmt https://www.wendangku.net/doc/436709315.html, Optical Networking https://www.wendangku.net/doc/436709315.html,/opticalnetwork Microcontrollers https://www.wendangku.net/doc/436709315.html, Security https://www.wendangku.net/doc/436709315.html,/security

Low Power Wireless https://www.wendangku.net/doc/436709315.html,/lpw Telephony https://www.wendangku.net/doc/436709315.html,/telephony

Video & Imaging https://www.wendangku.net/doc/436709315.html,/video

Wireless https://www.wendangku.net/doc/436709315.html,/wireless

Mailing Address:Texas Instruments

Post Office Box 655303 Dallas, Texas 75265