tslx
TestStation LX and
TestStation 12X Technical Product Description
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TestStation LX and
TestStation 12X
Technical Product Description
Copyright ? Teradyne, Inc. 2004. All rights reserved under copyright laws of the United States and other countries. The technical data included herein, excluding computer software documentation, is subject to the LIMITED RIGHTS as set forth in FAR 52.227-15 (JUN 1987) and DFARS 252.227-7015 (JUN 1995). All technical data and computer software documentation contained herein is propri-etary and confidential to Teradyne, Inc. or its licensor. All computer software documentation contained herein is Commercial Com-puter Software Documentation, proprietary to Teradyne, Inc. or its licensor and furnished under limited license only. For solicitations issued by the United States, its agencies or instrumentalities (the "Government") on or after December 1, 1995 and the Department of Defense ("DoD") on or after September 29, 1995, the only rights provided in the Commercial Computer Software Documentation shall be those specified in a license customarily provided to the public by Teradyne, Inc. in accordance with FAR 12.212(a) and (b) (OCT 1995) or DFARS 227.7202-3(a) (JUN 1995). For solicitations issued before December 1, 1995 by the Government (other than DoD) use, duplication or disclosure of the documentation shall be subject to the RESTRICTED RIGHTS as set forth in subparagraph (c)(1) and (2) of the commercial computer software - restricted rights clause at FAR 52.227-19 (JUN 1987). For solicitations issued before September 29, 1995 by DoD: RESTRICTED RIGHTS LEGEND - The use, duplication, or disclosure by the Government is subject to restrictions as set forth in subparagraph (c)(1)(ii) of the Rights in Technical Data and Computer Software clause at DFARS 252.227-7013 (OCT 1988).
The following are trademarks or registered trademarks of Teradyne, Inc.
Product names listed are trademarks of their respective manufacturers. Company names listed are trademarks or trade names of their respective companies.
The material in this manual is for informational purposes only and is subject to change, without notice. Teradyne assumes no respon-sibility for any error or for consequential damages that may result from the use or misinterpretation of any of the procedures in this publication.
Access Analyzer?Ai-7 Series?Alchemist?APC?Argo?
ATG XPRESS?AutoChecker?Autogen?AutoLoad?Autopub?Autotune?BasicSCAN?Bi4-Series?Bi-420?
Boundary In-Circuit Test (BICT)?
Boundary Scan Intelligent Diagnostics (BSID)?BusBust?BusScan?Call Sentinel?Cap Xpress?CapScan?CASTOR?CatSystem?CCU?
Configural Recognition?CMU?Cshell?
Component Designer (CDES)?D2B?
Design-to-Build?D2B Alchemist?D2B DesignView?D2B ECO?
D2B Strategist?D2B DFx?D-TRACKER?
DBIU?
Defect Display Station (DDS)?DeltaScan?Diamon?DigiBridge?DRMU?EJB-Tester?EJB-Monitor?EJB-Load?EJB-TestSuite?EKB-Test?E-MANAGER?E-SENTINEL?ENCOMPASS?FAST?
FrameScan?
FrameScan Plus?GENEVA?GenRad?
GenRad CAT System?GR?
GR-X90?GR-X130?GR-X130L?GR-X160L?GR-X1002?GR-X1500?GR-X1510?GR-X1525?GR-X1550?GR-X4005?GR-X4010?GR-X4011?GR-X7005?GR-X7010?GR2000? GR4000?GR5000?
GR 228X?GR & Des. ?GR AccelerATE?GR Advise?GR Navigate?GRNet?
GR Producibility Analyzer?GR Stinger?
GR SwitchManager?GR TestManager?GR TestStation?
GR TestStation 12X?GR TestStation TSM?GR Versa?GR Versa OT?GR Xpert?
GR X-Station 2D?GR X-Station 3-D?GridScan?
Inline Device Programmer (ILDP) ?InterScan?Isolution?JUDGE?
Junction Xpress?LASAR?L-Series?L200-Series?L300-Series?Lightning?M9-Series?MicroModal?Momentum?MultiScan?MultiScan II?
Multi-Tester plus?NIM?NXR?
Opens Xpress?
Orient Xpress?Panel-Test?PinPoint?PRISM?
Production Solutions International?
Process Quality Manager?ProcessWatch?ProgramGuide?Program Xplorer?PrompTest?PXIscan?
Quick-Check?QuickScan?RCU?RMU?SAC?
Safecracker?SafeTest?
Scan Pathfinder?Scavenger?Scot?
ScratchProbe?SierraMate?SIMUL?Softbridge?
Softbridge & Des.? SoftProbe?Spectrum?
Spectrum 8800-Series?SpeedPlus?Stinger?Stronghold?Syncload?
The Technology of Knowledge?Teracode?Teradyne?TeraNet?
Teradyne & Des. ?TestAdvisor?TestStudio?Test Toolbox?TEST XPRESS?TestLink?Testnet?
TPS Converter Studio?TRACS?Vector Bus?
Vector Performance (VP)?VICTORY?
Virtual In-Circuit Test (VICT)?
Virtual Component and Cluster Test (VCCT)?VRS?VXIscan?WaveScan?XFrame?XLT?
Xpress Model?Xpress Start?Xpress Train?Xpress Transfer?Xpress Yield?XStation?
XStation Combo?XStation HS?Z1800VP?Z1800-Series?Z1820VP?Z1840VP?Z1850VP?Z1880VP?Z1890VP?
WARNINGS
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Do not remove covers. Potentially lethal voltages are present inside the system. Observe all WARNING markings on the equipment and WARNING notices in the manual. If servicing is necessary, it should be performed only by a qualified person familiar with the electrical shock hazards present inside the system.?Grounding circuit continuity is vital for safe operation of the equipment. Never operate equipment with grounding conductor disconnected.
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Safeguard your hands and fingers while handling any fixture or other accessory. Be sure it is securely supported if you reach under it. If it is heavy, you must have another person help to move it.
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The symbol on equipment signifies that the manual contains information to prevent injury or equipment damage. Observe and heed all WARNING notices in the manuals and the equipment. WARNINGS call attention to personnel safety information.
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Replace any fuse only with the same type and ratings as labeled on the equipment and/or listed in the manual.
MISES EN GARDE
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Ne pas enlever les couvercles. Les niveaux de tension se trouvant dans le système sont extrêmement dangereux. Respectez toutes les consignes de sécurité figurant sur l'équipement et les MISES EN GARDE données dan ce manuel. Seule une personne qualifée, connaisant les risques de décharge électrique du système, est autorisée à effecteur les opérations de nettoyage ou de réparation du système.
?Le circuit doit être mis à la terre sans discontinuation pour garantir un fonctionnement sans danger de l'équipement. Ne jamais faire fonctionner l'équipement pendant que le raccord à la terre est déconnecté.?
Protégez-vous les mains et les doigts pendant le maniement de tout dispositif de serrage ou autre accessoire.Assurez-vous que ceux-ci soient bien solidement fixés en place, avant de vous pencher sous eux. Si l'accessoire en question est trop lourd, faites-vous aider pour le déplacer.
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Le symbole figurant sur l'équipement signifie que le manuel contient des informations permettant d'empêcher les accidents ou l'endommagement de l'équipement. Respectez toutes les consignes de MISES EN GARDE données dans le manuel et figurant sur l'équipement. Les MISES EN GARDE attirent l'attention sur la nécessité de se protéger.
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Ne remplacez les fusibles qu'avec des fusibles du même type et de la même valuer que ceux mentionnés sur l'équipement et figurant dans le manuel.
WARNHINWEISE
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Abdeckungen nicht entfernen. Potentiell lebensgef?hrliche Spannungsbedingungen innerhalb des Systems vorhanden. Alle auf der Einrichtung befindlichen WARNMARKIERUNGEN und im Handbuch enthaltenen WARNHINWEISE beachten. Wartungsarbeiten dem qualifizierten Personal überlassen, das mit den innerhalb des Systems vorhandenen Gefahren eines elektrischen Schlags vertraut ist.
?Die Erdung des Schaltungsdurchgangs ist eine Grundvoraussetzung für den sicheren Betrieb der Einrichtung.Einrichtung niemals ohne Erdleiter betreiben.
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H?nde und Finger bei der Handhabung einer Spannvorrichtung oder eines anderen Zubeh?rteils schützen.Sich vor der Plazierung der H?nde unterhalb der Einrichtung vergewissern, da? die Einrichtung über ausreichenden Halt verfügt. Falls die Einrichtung schwer ist, sich von einer anderen Person beim Tragen helfen lassen.
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Das auf der Einrichtung befindliche Symbol bedeutet, da? das Handbuch Informationen zur Verhinderung von K?rperverletzungen oder Sachsch?den enth?lt. Alle in den Handbüchern enthaltenen und auf der Einrichtung befindlichen WARNHINWEISE beachten und befolgen. WARNHINWEISE sollen auf Informationen zur pers?nlichen Sicherheit aufmerksam machen.
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Sicherungen nur durch Sicherungen des gleichen Typs und der gleichen Nennleistung ersetzen. Auf der Einrichtung befindliche Etiketten und im Handbuch enthaltene Informationen zu Rate ziehen.
!IEC417
!IEC417
!IEC417
AVISOS
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N?o remova as tampas. Há voltagens potencialmente fatais presentes na parte interna do sistema. Observe todas as marca??es de AVISOS no equipamento e discri??es de AVISOS no manual. Se for necessário fazer manuten??o, esta deve ser feita somente por uma pessoa qualificada familiarizada com os perigos de choques elétricos presentes na parte interna do sistema.
? A continuidade do circuito de aterramento é vital para a opera??o segura do equipamento. Nunca opere o equipamento com o cabo de aterramento desligado.
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Proteja as suas m?os e dedos ao operar qualquer dispositivo ou outro acessório. Certifique-se que ele esteja suportado com seguran?a se você tiver que alcan?ar algo debaixo dele. Se for pesado, você deve ter a ajuda de uma outra pessoa para movê-lo.
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O simbolo no equipamento significa que o manual contém informa??es para prevenir ferimentos ou danos ao equipamento. Observe e preste aten??o a todos os AVISOS nos manuais e no equipamento.Os AVISOS chamam a aten??o a informa??es sobre a seguran?a pessoal.
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Substitua qualquer fusivel somente com um do mesmo tipo e da mesma capacidade nominal como marcado no equipamento e listado no manual.
ADVERTENCIAS
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No quitar las tapas. En el interno del sistema hay voltajes potencialmente mortales. Obsérvense todos los rótulos de ADVERTENCIA presentes en el equipo, así como la descripción de las notas de ADVERTENCIA presentadas en el manual. De ser necesario, el servicio de mantenimiento deberá ser efectuado únicamente por personal calificado que esté familiarizado con los peligros de choque eléctrico presentes en el sistema.?La continuidad del circuito de puesta a tierra es de vital importancia para el functionamiento seguro del equipo.Nunca se debe usar el equipo con el conductor de puesta a tierra desconectado.
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Protéjanse las manos y los dedos toda vez que sea necesario manipular un dispositivo u accesorio.Cerciorarse de que el mismo esté firmemente sujetado antes de proceder a trabajar debajo de él. Si el aparato u accesorio fuera pesado, pedir la ayuda de otra persona para moverlo.
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El simbolo que aparece en el equipo significa que el manual contiene informaciones para evitar lesiones personales o da?os al equipo. Obsérvense y préstese atención a toda las notas de ADVERTENCIA presentes en los manuales y en el equipo. Las ADVERTENCIAS sirven para llamar la atención sobre informaciones de seguridad para el personal.
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Reemplazar los fusibles únicamente con otros del mismo tipo y capacidad, según lo indique el rótulo en el equipo y la descripción en el manual.
CAUTIONS
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Observe and heed all CAUTION notices in the manuals and on the equipment. CAUTIONS call attention to information about safeguarding equipment from damage.
!IEC417
!IEC417
HANDLING PRECAUTIONS FOR ELECTRONIC DEVICES SUBJECT TO DAMAGE BY STATIC ELECTRICITY
Place instrument or module to be serviced, spare parts in conductive (anti-static) envelopes or carriers, hand tools etc. on a work surface defined as follows. The work surface must be conductive and reliably connected to earth ground through a safety resistance of approximately 250 kilohms. The sur-face must NOT be metal. (A resistivity of 30 to 300 kilohms per square inch is suggested.) Avoid placing tools or electri-cal parts on insulators.
Ground the frame of any line-powered equipment, test instru-ments, lamps, soldering irons, etc., directly to earth ground. To avoid shorting out the safety resistance, be sure that grounded equipment has rubber feet or other means of insu-lation from the work surface. The module being serviced should be insulated while grounded through the power-cord ground wire, but must be connected to the work surface before, during and after any disassembly or other procedure in which the line cord is disconnected.
Exclude any hand tools (such as non-conductive plunger-type solder suckers) that can generate a static charge.Ground yourself reliably, through a resistance, to the work surface; use, for example, a conductive strap or cable with a wrist cuff. The cuff must make electrical contact directly with your skin; do NOT wear it over clothing. (Resistance between skin contact and work surface through a commer-cially available personnel grounding device is typically 250 kilohms to 1 megohm.)
If any circuit or IC packages are to be stored or transported, enclose them in conductive envelopes or carriers. Remove them only with the above precautions; handle IC packages without touching the contact pins.
Avoid circumstances that are likely to produce static charges, such as wearing clothes of synthetic material, sitting on a plastic-covered stool (particularly while wearing wool), comb-ing your hair, or making extensive erasures. These circum-stances are most significant when the air is dry.
When testing static sensitive devices, be sure DC power is on before, during, and after application of test signals. Be sure all pertinent voltages have been switched off while boards or
components are removed or inserted.
Contents
Using This Manual
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xi Technical Support Center . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xi How To Order Additional Documentation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xii Patent Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xii
Introduction
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 - 1 Standard System Configuration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 - 3 System Software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 - 3 Test Hardware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 - 4 Computer and Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 - 6 Service and Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 - 6 Optional System Software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 - 6 Optional System Hardware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 - 7 Optional Computer Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 - 8 Overview of Software Licenses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 - 8
Analog Subsystem
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 - 1 Instrumentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 - 2 ICA Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 - 2 Digital Voltmeter (DVM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 - 3 AC and DC Current Measure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 - 3 DC/AC Source Amplifiers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 - 3 Impedance Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 - 4 Arbitrary Waveform Generator (AWG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 - 4 Digital Multimeter (DMM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 - 5 ICA Controls, Triggers, and Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 - 5 ICA Instrument Multiplexer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 - 6 High Voltage Source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 - 6 Calibration Daughter Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 - 6 Self-Test Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 - 6 IEEE-488 Multiplexer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 - 7
Contents
Relay-Driver Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 - 7 ICA Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 - 8 High Voltage Source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 - 11 AWG Source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 - 14 Scanner Switching Matrix. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 - 16 Switching Matrix Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 - 20 Measurement Methods and Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 - 22 UUT Shorts Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 - 22 Opens Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 - 22 Capacitive Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 - 23 Junction Xpress . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 - 25 Resistance Measurements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 - 25 Impedance Measurements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 - 32 AC Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 - 32 Capacitance Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 - 33 Inductance Test Procedures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 - 35 6-Wire AC Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 - 36 Diode Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 - 37 Transistor Test. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 - 38 NPN and PNP Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 - 38 FET Channel Impedance Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 - 39 Zener Diode Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 - 39 SCR Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 - 40 Operational Amplifier Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 - 41 Analog Functional/Mixed Signal Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 - 42
Digital Subsystem
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 - 1 System Controller. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 - 2 Controller Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 - 2 Clock/Sync/Trigger Logic. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 - 3 Timing Specifications for the CST . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 - 4 Clock Drive/Synchronization for the CST . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 - 4 Trigger Pins for the CST . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 - 5 Driver/Sensor Modules. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 - 6 Driver/Sensor Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 - 7 Additional Features of Ultra 12X Pin Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 - 9 SafeTest. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 - 10
Contents
Automatic Driver Verification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 - 10 Real-Time Backdrive Current Measurement Capabilities . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 - 10 Closed Loop, Low Output Impedance Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 - 10 Multi-Level Digital Isolation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 - 10 Per Pin Programmable Logic Level Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 - 10 Programmable Backdrive Currents and Duration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 - 11 Specialized Digital Controller and Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 - 11
Optional Test Hardware
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 - 1 Analog Functional Test Module (AFTM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 - 1 AFTM Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 - 2 DC Voltage Measure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 - 2 AC Voltage Measure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 - 3 DC Source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 - 3 AC Source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 - 4 Sync Source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 - 4 Instrument Multiplexer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 - 4 Frequency/Time Interval Meter (FTM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 - 5 Deep Serial Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 - 5 DSM Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 - 6 Custom Function Board (CFB). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 - 7 Custom Function Board Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 - 8 Vehicle Control Interface (VCI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 - 8 Frequency/Time Interval Instrument Module (FTI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 - 8 FTI Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 - 9 Duty Cycle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 - 10 System Frequency/Time Meter (SFTM). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 - 10
Unit Under Test Power Supplies
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 - 1 Programmable Voltage Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 - 1 Common Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 - 2 Programmable Power Supply Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 - 3 Optional Fixed Voltage Power Supplies. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 - 4
System Layout and Mechanical/Industrial Specifications
System Layout. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 - 1 Power Bay . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 - 1
Contents
Pin Bay . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 - 1 Environmental Requirements. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 - 2 System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 - 2 Personal Computer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 - 3 System Input Power Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 - 3 Compressed Air Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 - 3 Space and Weight Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 - 4 Receiver and Test Fixture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 - 5 Pin Bay Power Tilt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 - 7
Using This Manual
Overview
The overall purpose of this document is to give the user an in depth understanding of the
TestStation 12X and TestStation LX systems. This manual provides an overview of the hardware and software available on test systems as well as detailed specifications.
Technical Support Center
You can contact the Technical Support Center for assistance at any time if you are unable to solve
a problem through the use of online Help or product documentation.
Before contacting the Technical Support Center, please have the following information available:?Your customer number
?Hardware system type
?System serial number
?Software version number
You can contact the Technical Support Center using the information below.
Phone Worldwide Support Line
1-800-TERADYNE (1-800-837-2396)
Fax(978) 370-6260
E-mail cs1@https://www.wendangku.net/doc/4f11376109.html,
Mail Teradyne, Inc.
Assembly Test Division
600 Riverpark Drive, MS NR6001-8
North Reading, MA 01864
World Wide Web https://www.wendangku.net/doc/4f11376109.html,
Click the Circuit Board Test & Inspection link on the webpage.
eKnowledge Web https://https://www.wendangku.net/doc/4f11376109.html,/cbti
Teradyne’s product support website offers customers 24/7
access to product manuals, software patches and updates,
emergency license keys, application notes, technical literature,
IC modules, and on-line incident management.
Using This Manual
How To Order Additional Documentation
To reorder this manual or any others, contact Technical Support.
Worldwide Support Line
1-800-TERADYNE (1-800-837-2396)
Part Number
034-357-00
Patent Information
The Teradyne software, firmware and test systems described in this manual are protected under one or more of the following US patents:
40705654835379512463855485256128759
42165394856001512700955549286163160
42478174857833517237755947706175230
44596934864219532170156024906363217
45009934884024535923756152196363507
45219024901315539199356315726449744
45362394931742541471556823926507920
46203044977370545738057270216563352
46601975020086547131057368626618629
46863915057775548675357486726622272
4688241506028854917375786697RE31828
4734637510115055008865811980RE35423
4791356510310955065105861743
4791359511140655215136052809
4809308512463655418566114848
Chapter 1
Introduction
Introduction
The TestStation? LX and TestStation 12X systems are optimized to detect and report defects that can occur in the manufacturing of printed circuit boards (PCBs). These advanced board test
systems provide precise fault diagnosis on the most demanding of PCBs. The TestStation system is recognized for delivering the highest fault coverage and highest throughput in a production test environment.
SafeTest? protection technologies make Teradyne's TestStation in-circuit test systems the
industry's best ICT solution for safely and reliably testing today's new low voltage technologies.
SafeTest protection technology is made up of a powerful combination of Teradyne's patented
UltraPin? digital pin electronics and key TestStation software features. SafeTest protection
technologies assure product quality and reduce overall product costs by providing the voltage
accuracy, backdrive current measurement, and multi-level isolation techniques that are necessary to perform accurate, reliable, and safe powered-up testing of today's new low-voltage devices.
With its synchronized analog and digital subsystems, the TestStation system performs accurate and repeatable testing of analog, digital and mixed-signal devices and circuits. Specialized
modules are available and targeted at reducing steps in the manufacturing process. From
programming and verifying flash memory and ISP devices to functional testing of specific
standards, such as the automotive industry’s J1850 and ISO 9141 serial protocols, these
application specific instruments dramatically improve downstream test yields.
Test programs are generated automatically with the industry’s most advanced circuit-analyzer
based automatic test generation. Utilizing the PCB’s circuit description and the system’s vast
component test libraries, automatic test generation determines device test limits and test
parameters, performs device and functional cluster isolation, and compensates for different device wiring configurations. Tests are developed with pin-level diagnostics for memory devices and
banks, bussed digital ICs, and complex mixed-signal components. For non-standard devices such as ASICs, PALs, and FPGAs. TestStation systems offer both powered and unpowered test
techniques which virtually eliminate the time and expense of test development. After automatic
test generation is complete, automatic program verification and fault grading is accomplished,
delivering a stable, repeatable and high (known) fault coverage test program to production. During production, integrated data collection, process optimization and graphical repair tools are available to identify the problem areas for immediate process correction.
Introduction
Test programs and fixtures developed and utilized on previous GR227X or GR228X systems can run on TestStation systems. Additionally, translators are available that modify non-Teradyne test sets to work on Teradyne systems providing significant cost savings in fixturing, program
development and test execution time.
Support programs for TestStation systems are tailored to meet customer needs. Standard and
customized training classes are available and delivered both on-site and at Teradyne’s training
facilities. Application support is available both on-site and on-line, providing the knowledge and
expertise to address the needs of our global customer base.
The TestStation systems meet the demands of PCB manufacturing test strategies aimed at
achieving higher product quality, increased volume and lower costs. TestStation systems are
flexible in that they can be configured with Teradyne’s extensive range of driver/sensor pin cards.
These pin cards can be combined with instruments such as Analog Functional Test Module, Deep Serial Memory, Vehicle Control Interface, and Frequency Time Instruments. The extensive range of pin cards and varied instruments makes multiple configurations possible. In addition, TestStation systems can be upgraded on the factory floor with the addition of resources.
Designed for today's manufacturing environment, the TestStation system provides a small,
ergonomic package with a clear and concise user interface that meets or exceeds most industry and geographic standards. When tilted, the system allows for comfortable operating, loading and unloading of PCBs. For automation, the system is placed in the horizontal or flat position for easy integration with automated board handling equipment. Figure1-1 shows the TestStation system.
Figure1-1 TestStation System
Introduction
Standard System Configuration
The standard system hardware and software components and product services are described in the following sections.
System Software
?ATG Xpress Single User License
?Device Libraries:
–Analog
–Digital
–Flash
–Boundary Scan
–Mixed-Signal
?Xpress Model
?Circuit Analyzer-Based Test Generators
?Multiple Level Digital Isolation Software
?Hybrid Test Generator License for automatic generation of complex analog and mixed-signal tests
?Panel-Test Program Preparation Software
?On-board Programming (Flash/ISP) Software
?Fixture design and probe placement software using Teradyne’s D2B Alchemist software
?Vectorless Test Techniques Licenses
–Junction Xpress or FrameScan
–Opens Xpress
?Test/Debug System Software License including:
–Graphical Real Time Analog Debug Tool with Program Xplorer
–Automatic Fault Grading of Test Programs
–Digital Waveform Display
–Runtime Software
–Panel-Test Runtime Software
–Memory Bank Test Software
–Diagnostic Software
–SoftProbe - detects open or stuck pins on digital ICs
–Guided Probe - used to determine the source or cause of a digital IC fault
–BusBust - test technique used to detect and diagnose device defects on bus nodes
–Real Time Data Collection
–Data Display Report Generation Software
Introduction
?Test Quality Tools including:
–AutoDebug
–Adjust Limits
–Fault Coverage Analysis
–Throughput Optimizer
?Microsoft Windows XP Professional License including:
–Single User License per system
–TCP?/IP, IPX/SPX, & NetBIOS Networking and Support
–DOS/Windows Support
Test Hardware
?In-Circuit Analog (ICA) Board with:
–AC/DC voltage source
–AC/DC current source
–AC/DC voltage measure
–AC/DC current measure
–DC resistance measure
–Quadrature AC impedance measurement
–Arbitrary Waveform Generator
–Calibration daughter board
–Eight channel instrument multiplexer
–Digital Multimeter/Waveform digitizer
–Input instrument multiplexer for IEEE-488 and VXI instruments
–High Voltage DC Voltage/Current Source ±120V/±50 mA (Daughter Card for ICA Board)?Scanner driver/sensor pin bay
?Power bay/power supplies
?Run-Time controller
?Receiver for UUT test fixture
?EC-92 compliant
?16 Clock driver pins - Optional
?8 Clock synchronizer pins ? Optional
?28 Trigger pins ? Optional
Introduction
Table 1-1 TestStation System Configurations
Figure 1-2 TestStation Functional Block Diagram
System
TS 121
TS 124
TS 128
TS 128L
TS 124L
Pin Board Type Ultra 121Ultra 124Ultra 128Ultra 128L Ultra 124Ultra 124L Pin Board Slots 3030303030Driver/Sensors per board
12832163264Maximum Number of Test Nails 38403840384076807680Real Pin Count 38409604809601920Mux Ratio 1:11:41:81:8, 1:41:4Data Rate
5MHz
5MHz
5MHz
5MHz
5MHz
Introduction
Computer and Peripherals
?Pentium-based Personal Computer
?Fixed disk drive
?15" or 17” LCD
?CD-RW Drive
? 3.5" 1.44 MB floppy drive
?Keyboard with trackball (mouse optional)
?PCI MXI II interface board
?IEEE ? 488 interface board
?Operator keypad
?Ethernet networking interface (10/100 BASE-T/Thin wire)
?EC-92 compliant
?RS-232 interface board
? 2 USB Ports (Minimum)
? 1 parallel port
Service and Support
?Instruction manuals
?One year system warranty
?On-site installation
Optional System Software
?Backdrive Current Report and Programmable backdrive features
?Opens Xpress license for vectorless test technique for detecting:
– Open device pins
– Open connector pins
– Polarized capacitor orientation
– Correct device orientation
?BasicSCAN model generator license for boundary scan devices
?Scan Pathfinder software for complete tests of limited access boards with boundary scan chains
–Scan Pathfinder Test/Diagnostic license
–Scan Pathfinder Program Preparation License
?TRACS Process Information System
?System Frequency/Test Module Software
Introduction
Optional System Hardware
?Hybrid Pin Boards
Pin Boards Multiplex Ratio
Ultra 1281:8 multiplex ratio with 16 driver/sensors per board
Ultra 1241:4 multiplex ratio with 32 driver/sensors per board
Ultra 128L1:8 multiplex ratio with 32 driver/sensors per board
Ultra 124L1:4 multiplex ratio with 64 driver/sensors per board
Ultra 1211:1 multiplex ratio with 128 driver/sensors per board
?Programmable Voltage Power Supply with:
– Programmable Voltage Supply 0-7V @ 15 A
– Programmable Voltage Supply 0-20V @ 8 A
– Programmable Voltage Supply 0-60V @ 2.5 A
–+5V at 6 A, ±15V at 1.0 A or
+5V at 6A, ±12V at 1.3 A
?Analog Functional Test Module (AFTM)
–AC/DC voltage source and measure
–Frequency and time measure
–High frequency multiplexer
–Triggering for synchronous mixed-signal testing
?IEEE-488 Interface Controller
?DSM2 Board
?Deep Serial Memory (DSM2/SC) Module for the System Controller
?Vacuum Pump
?System Frequency/Time Meter (SFTM)
?Custom Function Board (CFB)
?Vehicle Control Interface (VCI) Module
?Frequency Time Interval (FTI) Module
?Clock/Sync/Trigger Module