2.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER
Features
? Guard Ring Die Construction for Transient Protection
? Ideally Suited for Automated Assembly
? Low Power Loss, High Efficiency
? Surge Overload Rating to 50A Peak
? For Use in Low Voltage, High Frequency Inverters, Free Wheeling, and Polarity Protection Application
? High Temperature Soldering: 260°C/10 Second at Terminal ? Lead Free Finish/RoHS Compliant (Note 1)Mechanical Data
? Case: SMA/SMB
? Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0
? Moisture Sensitivity: Level 1 per J-STD-020D
? Terminals: Lead Free Plating (Matte Tin Finish). Solderable per MIL-STD-202, Method 208
? Polarity: Cathode Band or Cathode Notch
? Marking Information: See Page 3
? Ordering Information: See Page 3
? Weight: SMA 0.064 grams (Approximate)
SMB 0.093 grams (Approximate)
Top View Bottom View
Maximum Ratings@T A = 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic Symbol B220/A B230/A B240/A B250/A B260/A Unit
Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage V RRM
V RWM
V R
20 30 40 50 60 V
RMS Reverse Voltage V R(RMS)14 21 28 35 42 V Average Rectified Output Current @ T T = 100°C I O 2.0 A Non-Repetitive Peak Forward Surge Current, 8.3ms
Single Half Sine-Wave Superimposed on Rated Load
I FSM50 A Thermal Characteristics
Characteristic Symbol Value Unit Typical Thermal Resistance, Junction to Terminal RθJT20 °C/W Typical Thermal Resistance, Junction to Ambient (Note 2) RθJA25 °C/W Operating and Storage Temperature Range T J, T STG-65 to +150 °C
Electrical Characteristics@T A = 25°C unless otherwise specified
Characteristic Symbol Min Typ Max Unit Test Condition
Forward Voltage Drop B220/A, B230/A, B240/A
B250/A, B260/A V F
- -
0.50
0.70
V I F = 2.0A, T A = 25°C
Leakage Current (Note 3) I R -
-
-
-
0.5
20
mA
@ Rated V R, T A = 25°C
@ Rated V R, T A = 100°C
Total Capacitance C T- - 200 pF V R = 4V, f = 1MHz Notes: 1. EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied, see EU Directive 2002/95/EC Annex Notes.
2. Thermal Resistance: Junction to terminal, unit mounted on PC board with 5.0 mm2 (0.013 mm thick) copper pad as heat sink.
3. Short duration pulse test used to minimize self-heating effect.
I , I N S T A N T A N E O U S R E V E R S E C U R R E N T (m A )
R PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
Fig. 2 Typical Reverse Characteristics
0.01
0.1
1.0
10
I , I N S T A N T A N E O U S F O R W A R D C U R R E N T (A )
F V , INSTANTANEOUS FORWARD VOLTAGE (V)
Fig. 1 Typical Forward Characteristics
F
10
100
C , T O T A L C
A P A C I T A N C E (p F )
T V , DC REVERSE VOLTAGE (V)
Fig. 3 Total Capacitance vs. Reverse Voltage R
I ,A V E R A G E F O R W A R D C U R R E N T (A )
F (A V
)T , TERMINAL TEMPERATURE (oC)Fig. 4 Forward Current Derating Curve
T 2.0
20
304050T , D E R A T E D A M B I E N T T E M P E R A T U R E (°C )
A V , DC REVERSE VOLTAGE (V)
Fig. 5 Operating Temperature Derating (B240)R 607080120130100110150140
16090
I , P E A K F O R W A R D S U R G E C U R R E N T (A )
F S M NUMBER OF CYCLES AT 60 Hz
Fig. 6 Max Non-Repetitive Peak Forward Surge Current 4. Device mounted on FR-4 PC board with minimum recommended pad layout pattern as per https://www.wendangku.net/doc/4514005376.html,/datasheets/ap02001.pdf.
Ordering Information (Note 5)
Part Number Case Packaging B2xxA-13-F SMA
5000/Tape & Reel B2xx-13-F
SMB 3000/Tape & Reel
* x = Device type, e.g. B260A-13-F (SMA package); B240-13-F (SMB package).
Notes: 5. For packaging details, go to our website at https://www.wendangku.net/doc/4514005376.html,/datasheets/ap02007.pdf.
Marking Information
B2X0A = Product type marking code, ex: B220A (SMA package) B2X0 = Product type marking code, ex: B230 (SMB package) = Manufacturers’ code marking YWW = Date code marking
Y = Last digit of year ex: 2 for 2002 WW = Week code 01 to 52
Package Outline Dimensions
Suggested Pad Layout
IMPORTANT NOTICE
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product
described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website, harmless against all damages.
LIFE SUPPORT
Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written approval of the President of Diodes Incorporated.
SMB
Dim Min Max A 3.30 3.94 B 4.06 4.57 C 1.96 2.21 D 0.15 0.31 E 5.00 5.59 G 0.05 0.20 H 0.76 1.52 J 2.00 2.62 All Dimensions in mm
SMA
Dim Min Max A 2.29 2.92 B 4.00 4.60 C 1.27 1.63 D 0.15 0.31 E 4.80 5.59 G 0.05 0.20 H 0.76 1.52 J 2.01 2.30 All Dimensions in mm
SMA
Dimensions
Value (in mm)
Z 6.5 G 1.5 X 1.7 Y 2.5 C 4.0 SMB
Dimensions
Value (in mm)
Z 6.7 G 1.8 X 2.3 Y 2.5 C 4.3