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CD4098B

Data sheet acquired from Harris Semiconductor SCHS065C ? Revised November 2004

These types are supplied in 16-lead hermetic dual-in-line ceramic packages (F3A suffix), 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (M, M96, and MT suffixes), and 16-lead thin shrink small-outline packages (PW and PWR suffixes). The CD4098B is similar to type MC14528.

CD4098B

CD4098B

CD4098B

CD4098B

PACKAGING INFORMATION

Orderable Device Status(1)Package

Type Package

Drawing

Pins Package

Qty

Eco Plan(2)Lead/Ball Finish MSL Peak Temp(3)

CD4098BE ACTIVE PDIP N1625Pb-Free

(RoHS)

CU NIPDAU N/A for Pkg Type

CD4098BEE4ACTIVE PDIP N1625Pb-Free

(RoHS)

CU NIPDAU N/A for Pkg Type CD4098BF ACTIVE CDIP J161TBD A42N/A for Pkg Type CD4098BF3A ACTIVE CDIP J161TBD A42N/A for Pkg Type CD4098BFB ACTIVE CDIP J161TBD Call TI Call TI

CD4098BM ACTIVE SOIC D1640Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CD4098BM96ACTIVE SOIC D162500Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CD4098BM96E4ACTIVE SOIC D162500Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CD4098BM96G4ACTIVE SOIC D162500Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CD4098BME4ACTIVE SOIC D1640Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CD4098BMG4ACTIVE SOIC D1640Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CD4098BMT ACTIVE SOIC D16250Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CD4098BMTE4ACTIVE SOIC D16250Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CD4098BMTG4ACTIVE SOIC D16250Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CD4098BPW ACTIVE TSSOP PW1690Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CD4098BPWE4ACTIVE TSSOP PW1690Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CD4098BPWG4ACTIVE TSSOP PW1690Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CD4098BPWR ACTIVE TSSOP PW162000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CD4098BPWRE4ACTIVE TSSOP PW162000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CD4098BPWRG4ACTIVE TSSOP PW162000Green(RoHS&

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM JM38510/17504BEA ACTIVE CDIP J161TBD A42N/A for Pkg Type (1)The marketing status values are defined as follows:

ACTIVE:Product device recommended for new designs.

LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.

NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.

PREVIEW:Device has been announced but is not in production.Samples may or may not be available.

OBSOLETE:TI has discontinued the production of the device.

(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check http://www.wendangku.net/doc/4ba7f379a26925c52cc5bf19.html/productcontent for the latest availability information and additional product content details.

TBD:The Pb-Free/Green conversion plan has not been defined.

Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements

for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die and package,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above.

Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)

(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.

TAPE AND REEL INFORMATION

CD4098B

*All dimensions are nominal Device Package Type Package Drawing

Pins

SPQ Reel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant CD4098BM96SOIC

D 162500330.016.4 6.510.3 2.18.016.0Q1CD4098BPWR TSSOP PW 162000

330.012.4 6.9 5.6 1.68.012.0Q1

CD4098B

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) CD4098BM96SOIC D162500333.2345.928.6

CD4098BPWR TSSOP PW162000346.0346.029.0

CD4098B

CD4098B

CD4098B

CD4098B

CD4098B

CD4098B

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