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STTH6004W中文资料

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Table 1: Main product characteristics

I F(AV)60 A V RRM 400 V T j (max)175 °C V F (typ)0.83 V t rr (max)

50 ns

STTH6004W

Ultrafast high voltage rectifier

Table 3: Absolute ratings (limiting values)Symbol Parameter

Value Unit V RRM Repetitive peak reverse voltage

400V I F(RMS)RMS forward current 90A I F(AV)Average forward current

T c = 125 °C δ = 0.560A I FSM Surge non repetitive forward current t p = 10 ms sinusoidal

600A T stg Storage temperature range

-65 to + 175

°C T j

Maximum operating junction temperature

175

°C

October 2005REV. 1Features and benefits

■ Ultrafast switching ■ Low reverse current ■ Low thermal resistance

■

Reduces switching & conduction losses

Description

The STTH6004W uses ST 400V technology and is specially suited for use in switching power supplies, welding equipment and industrial applications, as an output rectification diode.

Table 2: Order codes

Part number Marking STTH6004W

STTH6004W

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Table 4: Thermal Resistance Table 5: Static electrical characteristics Pulse test:

* t p = 5 ms, δ < 2%** t p = 380 μs, δ < 2%

To evaluate the conduction losses use the following equation: P = 0.8 x I F(AV) + 0.0033 I F 2

(RMS)

Table 6: Dynamic characteristics Symbol Parameter

Value (max).

Unit R th(j-c)

Junction to case

0.70

°C/W

Symbol Parameter

Test conditions

Min.Typ Max.Unit I R *Reverse leakage current T j = 25 °C

V R = V RRM

50μA

T j = 150 °C

100

1000V F **

Forward voltage drop

T j = 25 °C I F = 60 A

1.2V

T j = 150 °C

0.83

1.0

Symbol Parameter

Test conditions

Min Typ Max Unit

t rr Reverse recovery time

T j = 25 °C I F = 1 A dI F /dt = 50 A/μs V R =30 V 6690ns

I F = 1 A dI F /dt = 200 A/μs V R =30 V

50I RM Reverse recovery current T j = 125 °C I F = 60 A V R = 200 V dI F /dt = 100 A/μs 15A S factor Softness factor

T j = 125 °C I F = 60 A V R = 200 V

dI F /dt = 100 A/μs

0.4

t fr Forward recovery time

T j = 25 °C I F = 60 A dI F /dt = 200 A/μs V FR = 1.1 x V Fmax

600ns V FP

Forward recovery voltage

T j = 25 °C I F = 60 A dI F /dt = 200 A/μs V FR = 1.1 x V Fmax

3.2

V Figure 1: Conduction losses versus average forward current

Figure 2: Forward voltage drop versus forward current

STTH6004W

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Figure 3: Relative variation of thermal impedance junction to case versus pulse duration

Figure 4: Peak reverse recovery current versus dI F /dt (typical values)

Figure 5: Reverse recovery time versus dI F /dt (typical values)

Figure 6: Reverse recovery charges versus dI

/dt (typical values)

Figure 7: Reverse recovery softness factor versus dI

/dt (typical values)

Figure 8: Relative variations of dynamic parameters versus junction temperature

STTH6004W

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Figure 9: Transient peak forward voltage versus dI

/dt (typical values)

Figure 10: Forward recovery time versus dI F /dt (typical values)

Figure 11: Junction capacitance versus reverse voltage applied (typical values)

STTH6004W

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Figure 12: DO-247 Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK? packages. These

packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: https://www.wendangku.net/doc/5b148332.html,.

Table 7: Ordering information

■

Epoxy meets UL94, V0

■Cooling method: by conduction (C)■Recommended torque value: 0.8 Nm.■Maximum torque value: 1.0 Nm.Ordering type Marking Package Weight Base qty

Delivery mode

STTH6004W

STTH6004W DO-247 4.40 g 30Tube

Table 8: Revision history

Date Revision

Description of Changes

18-Oct-2005

First issue

STTH6004W

Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.

The ST logo is a registered trademark of STMicroelectronics.

All other names are the property of their respective owners

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