L6234PD013TR;L6234;L6234PD;中文规格书,Datasheet资料

November 2011Doc ID 1107 Rev 101/16

L6234

Three phase motor driver

Features

■Supply voltage from 7 to 52 V ■ 5 A peak current

■R DSon 0.3 Ω typ. value at 25 °C ■Cross conduction protection ■TTL compatible driver

■Operating frequency up to 150 kHz ■Thermal shutdown

■Intrinsic fast free wheeling diodes

■Input and enable function for each half bridge ■

10 V external reference available

Description

The L6234 is a triple half bridge to drive a brushless DC motor.

It is realized in BCDmultipower technology which combines isolated DMOS power transistors with CMOS and Bipolar circuits on the same chip.By using mixed technology it has been possible to optimize the logic circuitry and the power stage to achieve the best possible performance.The output DMOS transistors can sustain a very high current due to the fact that the DMOS

structure is not affected by the second breakdown effect, the RMS maximum current is practically limited by the dissipation capability of the package.

All the logic inputs are TTL, CMOS and μP compatible. Each channel is controlled by two separate logic input.

L6234 is available in 20 pin PowerDIP package (16+2+2) and in PowerSO20.

Table 1.

Device summary

Order code Package Packing L6234PowerDIP20Tube L6234PD PowerSO20Tube L6234PD013TR

PowerSO20

T ape and reel

https://www.wendangku.net/doc/554918597.html,

Contents L6234

Contents

1Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

4Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

4.1Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 5Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 6Circuit description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 7Typical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 8Mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 9Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

2/16Doc ID 1107 Rev 10

L6234Block diagram

Doc ID 1107 Rev 103/16

1 Block diagram

Pin connections L6234

4/16Doc ID 1107 Rev 10

2 Pin connections

Table 2.Pin functions

PowerDIP PowerSO20 Name

Function

1 2010 6 5 15 OUT 1OUT 2OUT 3 Output of the channels 1/2/3.

219 9 7 4 14 IN 1 IN 2IN 3 Logic input of channels 1/2/3. A logic HIGH level (when the

corresponding EN pin is HIGH) switches ON the upper DMOS Power Transistor, while a logic LOW switches ON the corresponding low side DMOS Power.

3 18 8

8 3 13

EN 1EN 2 EN 3

Enable of the channels 1/2/3. A logic LOW level on this pin switches off both power DMOS of the related channel. 4,7 9, 12 V s

Power supply voltage.

14 19 SENSE2

A sense resistor connected to this pin provides feedback for motor current control for the bridge 3. 17 2 SENSE1

A sense resistor connected to this pin provides feedback for

motor current control for the bridges 1 and 2. 11 16 VREF

Internal voltage reference. A capacitor connected from this pin

to GND increases the stability of the Power DMOS drive circuit.

12 17 VCP

Bootstrap oscillator. Oscillator output for the external charge

pump. 13 18 VBOOT Overvoltage input to drive the upper DMOS 5,6 15,16

1,10 11,20

GND

Common ground terminal. In PowerDIP and SO packages these pins are used to dissipate the heat forward the PCB.

L6234Thermal data

Doc ID 1107 Rev 105/16

3 Thermal data

Table 3.

Thermal data

Symbol Parameter DIP16+2+2 PowerSO20 Unit R th j-pin

Thermal resistance, junction to pin

12 (1)1.The thermal resistance is referred to the thermal path from the dissipating region on the top surface of the

silicon chip, to the points along the four central pins of the package, at a distance of 1.5 mm away from the stand-offs.– °C/W R th j-amb1Thermal resistance, junction to ambient 40 (2)2.If a dissipating surface, thick at least 35 mm, and with a surface similar or bigger than the one shown in

Figure 3, is created making use of the printed circuit. Such heatsinking surface is considered on the bottom side of an horizontal PCB (worst case).– °C/W R th j-amb2

Thermal resistance, junction characteristics) to

ambient

50 (3)3.If the power dissipating pins (the four central ones), as well as the others, have a minimum thermal

connection with the external world (very thin strips only) so that the dissipation takes place through still air and through the PCB itself. It is the same situation of note 2, without any heatsinking surface created on purpose on the board.

–

°C/W

R th j-case Thermal resistance junction-case

–

1.5 °C/W

Maximum ratings L6234

6/16Doc ID 1107 Rev 10

4 Maximum ratings

4.1 Recommended operating conditions

Table 4.

Absolute maximum ratings

Symbol Parameter Value Unit V S Power

supply voltage 52 V V IN , V EN Input enable voltage – 0.3 to 7

V

I peak Pulsed output current (1) 1.Pulse width limited only by junction temperature and the transient thermal impedance 5 A V SENSE

Sensing voltage (DC voltage)

-1 to 4 V V boot Bootstrap peak voltage 62 V V OD

Differential output voltage (between any of the 3 OUT pins)

60

V

f C Commutation frequency 150 kHz V REF Reference voltage 12 V P tot T otal power dissipation L6234PD, T A = 70°C 2.3 W P tot T otal power dissipation L6234, T A = 70°C 1.6 (2)2.Mounted on board with minimized copper area

W T stg , T j

Storage and junction temperature range

-40 to 150

°C

Table 5.

Recommended operating conditions

Symbol Parameter Value Unit V S Supply voltage

7 to 42 V V OD Peak to peak differential voltage (between any of the 3 out pins) 52 V I out

DC output current powerSO20 (T A = 25°C)

4 A DC output current powerDIP (T A = 25°C) with infinite heatsink 2.8 A V SENSE

Sensing voltage (pulsed t w < 300 nsec) -4 to 4 V Sensing voltage (DC) -1 to 1 V T j

Junction temperature range

-40 to 125

°C

L6234Electrical characteristics

Doc ID 1107 Rev 107/16

5 Electrical characteristics

V S = 42 V; T j = 25 °C unless otherwise specified.

Table 6.

Electrical characteristics

Symbol Parameter Test condition Min. Typ. Max. Unit V S Supply voltage 7

52 V

V ref

Reference voltage

10 V I S Quiescent supply current 6.5

mA T S Thermal shutdown 150

°C T D

Dead time protection

300

ns

Output dmos transistor

I DSS Leakage current 1 mA

R DSon

ON resistance

0.3

?

Source drain diode

V SD

Forward ON voltage

I SD = 4A; EN =

LOW

1.2 V T RR Reverse recovery time I F = 4A 900 ns T pr

Forward recovery time

200

ns

Logic levels

V INL , V ENL Input LOW voltage -0.3 0.8 V V INH , V ENH

I nput H I GH voltage 2

7 V I INL , I ENL Input LOW current V IN ,V EN = L -10

μA I INH , I ENH Input HIGH current

V IN ,V EN = H

30

μA

Circuit description L6234

8/16Doc ID 1107 Rev 10

6 Circuit description

L6234 is a triple half bridge designed to drive brushless DC motors. Each half bridge has 2

power DMOS transistors with R DSon = 0.3 Ω.

The 3 half bridges can be controlled independently by means of the 3 inputs IN1, IN2, IN3 and the 3 inputs EN1, EN2, and EN3. An external connection to the 3 common low side DMOS sources is provided to connect a sensing resistor for constant current chopping application.

The driving stage and the logic stage are designed to work from 7 V to 52 V .

7 Typical

characteristics

Figure 5.Normalized quiescent current vs.

Figure 4.Quiescent current vs. supply

Doc ID 1107 Rev 109/16

Figure 8.Typical diode forward ON

Figure 9.Reference voltage vs. supply

Figure 10.Reference voltage vs. junction

10/16Doc ID 1107 Rev 10

分销商库存信息:

STM

L6234PD013TR L6234L6234PD