VMAX3 Spec Sheet,硬件规格表

EMC VMAX3 FAMILY - VMAX 100K, 200K, 400K

The newest additions to the EMC? VMAX? family deliver the latest in Tier-1 scale-out

multi-controller architecture with consolidation and efficiency for the enterprise. With

completely redesigned hardware and software, the new VMAX 100K, 200K, and 400K

arrays provide unprecedented performance and scale. Ranging from the single or dual

engine VMAX 100K up to the 8-engine VMAX 400K, these new arrays offer dramatic

increases in floor tile density with engines and high capacity disk enclosures for both 2.5"

and 3.5" drives consolidated in the same system bay. In addition, VMAX 100K, 200K, and

400K can be configured as either hybrid or all flash arrays.

This revolutionary new VMAX3 architecture delivers Virtual Matrix Bandwidth of 175GB/s

per engine and up to 1400GB/s across an eight engine VMAX3 array. All new VMAX3

models come fully pre-configured out of the factory to significantly shorten the time to

first I/O during installation.

Specifications

UNMATCHED ARCHITECTURE

The Dynamic Virtual Matrix Architecture enables IT departments to build storage systems

that transcend the physical constraint of competing array architectures. The architecture

allows scaling of system resources through common and fully redundant building blocks

called VMAX engines. VMAX engines provide the complete foundation for high-availability

storage arrays. Each engine contains two VMAX directors and redundant interfaces to the

new Dynamic Virtual Matrix dual InfiniBand? fabric interconnect. Each director

consolidates front-end, global memory, and back-end functions, enabling direct memory

access to data for optimized I/O operations. Depending on the array chosen, up to 8

VMAX engines can be interconnected via a set of active fabrics that provide scalable

performance and high availability.

The new VMAX arrays support the use of native 6Gb/s SAS 2.5” drives, 3.5” drives, or a

mix of both drive types in the array. Individual system bays can house either one or two

engines and up to the per engine maximum of 6 High Density Disk Array Enclosures

(DAEs) available in either 3.5” (60 slot) or 2.5" (120 slot) formats. As a result, each

system bay can support up 720 2.5" drives or up to 360 3.5" drives, or a mix of the

two. In addition, all new arrays support subsequent system bay dispersion of up to 25

meters from the first system bay. All new members of the family also support 3rd party

racking. Detailed specifications and a comparison of the three new VMAX3 arrays follow.

VMAX3 FAMILY SPECIFICATIONS

VMAX 3 FAMILY CONNECTIVITY

SYSTEM BAY DISPERSION

System Bay Dispersion allows customers to separate any individual or contiguous group of system bays by up to a distance of 82 feet (25 meters) from System Bay 1. This provides unsurpassed datacenter flexibility in solving floor loading constraints or working around obstacles that mighty preclude fully contiguous configurations.

82 feet / 25 meters System Bay Dispersion

DISK DRIVE SUPPORT

The VMAX 100K, 200K, and 400K support the latest 6Gb/s dual ported native SAS drives. All drive families (Enterprise Flash, 10K, 15K and 7.2K RPM) support two independent I/O channels with automatic failover and fault isolation. Check with your EMC sales representative for the latest list of supported drives and types. Configurations with mixed-drive capacities and speeds are allowed depending upon the configuration. All capacities are based on 1 GB = 1,000,000,000 bytes. Actual usable capacity may vary depending upon configuration.

2.5” DISK DRIVES

3.5” DISK DRIVES

POWER CONSUMPTION AND HEAT DISSIPATION

1Power Values for System Bay 2 and all subsequent System Bays where applicable PHYSICAL SPECIFICATIONS

INPUT POWER REQUIREMENTS

SINGLE-PHASE NORTH AMERICAN, INTERNATIONAL, AUSTRALIAN

1.L = line or phase, N = neutral, G = ground

THREE-PHASE NORTH AMERICAN, INTERNATIONAL, AUSTRALIAN

1 L = line or phase, N = neutral, G = ground

2 An imbalance of AC input currents may exist on the three-phase power source feeding the array, depending on the configuration. The customer's

electrician must be alerted to this possible condition to balance the phase-by-phase loading conditions within the customer's data center

RADIO FREQUENCY INTERFERENCE

Electro-magnetic fields which include radio frequencies can interfere with the operation of electronic equipment. EMC Corporation products have been certified to withstand radio frequency interference in accordance with standard EN61000-4-3. In Data Centers that employ intentional radiators, such as cell phone repeaters, the maximum ambient RF field strength should not exceed 3 Volts /meter.

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EMC2, EMC, SRDF, VMAX, and the EMC logo are registered trademarks or trademarks of EMC Corporation in the United States and other countries. Intel, the Intel logo, Xeon, and Xeon Inside are trademarks or registered trademarks of Intel Corporation in the U. S. and other countries. All other trademarks used herein are the property of their respective owners. ? Copyright 2014 EMC Corporation. All rights reserved. Published in the USA. 7/14 Specification Sheet H13217.1