Passivated General Purpose Schottky Diodes Reliability Data
The following cumulative test results have been obtained from testing performed at Hewlett-Packard Communications Com-ponents Division in accordance with the latest revision of
MIL-STD-750. Data was gathered
from the product qualification,reliability monitor, and engineering evaluation.
For the purpose of this reliability data sheet, a failure is any part which fails to meet the electrical
and/or mechanical specification listed in the Hewlett-Packard Communications Components Designer’s Catalog.
Point [1]
90% Confidence Level [2]
Junction Temp.MTTF MTTF
T J (°C)(Hours) FIT [3](Hours) FIT [3]200 2.7 x 1053704.0 1.2 x 1058333.0175 1.4 x 106714.0 6.1 x 1051639.01508.9 x 106112.0 4.0 x 106250.01257.1 x 10714.0 3.1 x 10732.01007.4 x 108 1.3 3.2 x 108 3.1 75
1.0 x 1010
0.10
4.3 x 109
2.3
B. Failure Rate Prediction
The failure rate will depend on the junction temperature of the device. The estimated life at different temperatures is calcu-lated, using the Arrhenius plot with activation energy of 1.2eV,and listed in the following table.
1. Life Test
A. Demonstrated Performance
Units Total Total
Failure Rate Test Test Conditions Tested Device Hrs.Failed 1%/1K Hrs.
High Temp. Rev.V R = 80% V BR , T A = 200°C 676598,00000Bias (HTRB)Room Temp.P fm = 250 mW, T A = 25°C 364
364,000
Operating Life V R = 80% V BR , 60 Hz (RTOL)High Temp.T A = 200°C
367271,00000
Storage (HTS)
1N5711/12
5082-2800/04/055082-2810/115082-2815/17/185082-28265082-28355082-2080
Notes:
1. The point MTTF is simply the total device hours divided by the number of failures.
2. The MTTF and failure rate represent the performance level for which there is a 90% probability of the device doing
400J U N C T I O N T E M P E R A T U R E , T j (°C )
MEAN TIME TO FAILURE, MTTF (HRS)
350300250200
150
100
50
25A C T I V A T I O N E N E R G Y (e V )
0.7
0.8
0.91.01.5
2.0
3.04.00.6
0.5
102
103104105106107108109
better than the stated value. The confidence level is based on the statistics of failure distribution. The assumed distribution is exponential.This particular distribution is commonly used in describing useful life failures.
3. FIT is defined as Failure in Time, or specifically, failures per billion hours.The relationship between MTTF and FIT is as follows: FIT = 109/(MTTF).
C. Example of Failure Rate Calculation
At 75°C with a device operating 8 hours a day, 5 days a week, the percent utilization is:
% Utilization = (8 hrs/day x 5 days/wk) ÷ 168 hrs/wk = 25%Then the point failure rate per year is:
(1.0 x 10-10/hr.) x (25%) x (8760 hrs/yr) = 2.2 x 10-5% per year Likewise, the 90% confidence level failure rate per year is:
(2.3 x 10-10/hrs.) x (25%) x (8760 hrs/yr) = 5.1 x 10-5% per year
2. Environmental and Mechanical Tests
MIL-STD-750Units Total Test Reference Test Conditions Tested Failed Solderability2026260°C, 5 seconds1980 Solder Heat2031260°C, 10 seconds440 Resistance to Solvent1022 4 solvent groups1260 Thermal Shock1056-65/200°C, 5 min dwell,1160
200 cycles
Temperature Cycle1051-55/100°C, 10 min dwell,4160
200 cycles
Mechanical Shock20161500 g’s, 0.5 msec pulse2720
5 blows each X1, Y1, Y2
Acceleration200620,000 g’s, 1 min, X1, Y, Y21160 Vibration Variable Freq.205620–2000 Hz, 20 g, 4 min all axis1160 Hermeticity1017Fine And Gross4160 Lead Integrity 4 lbs Minimum1760 Salt Atmosphere104110–50 gr/m2 @ 35°C, 24 hrs.450
3. DOD-HDBK-1686 ESD Classification:
5082-28XX Class I