ISD1700中文资料

PRELIMINARY

Publication Release Date: January 23, 2007 Revision 1.3-S2

ISD1700 Series

Multi-Message Single-Chip

Voice Record & Playback Devices

ISD1700 SERIES

TABLE OF CONTENTS

1GENERAL DESCRIPTION (3)

2FEATURES (4)

3BLOCK DIAGRAM (5)

4PINOUT CONFIGURATION (6)

5PIN DESCRIPTION (7)

6MODES OF OPERATIONS (8)

6.1Standalone (Push-Button) Mode (8)

6.2SPI Mode (8)

7TIMING DIAGRAMS (8)

7.1Standalone Operation (8)

7.2SPI Operation (12)

8ABSOLUTE MAXIMUM RATINGS (13)

8.1Operating Conditions (13)

9ELECTRICAL CHARACTERISTICS (14)

9.1DC Parameters (14)

9.2AC Parameters (15)

10TYPICAL APPLICATION CIRCUITS (16)

10.1Good Audio Design Practices (18)

11PACKAGING (19)

11.128-Lead 8x13.4mm Plastic Thin Small Outline Package (TSOP) Type 1 - IQC (19)

11.228-Lead 300-Mil Plastic Small Outline Integrated Circuit (SOIC) (20)

11.328-Lead 600-Mil Plastic Dual Inline Package (PDIP) (21)

11.4Die Information (21)

12ORDERING INFORMATION (22)

13VERSION HISTORY (23)

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ISD1700 SERIES

1 GENERAL DESCRIPTION

The Winbond? ISD1700 ChipCorder? Series is a high quality, fully integrated, single-chip multi-message voice record and playback device ideally suited to a variety of electronic systems. The message duration is user selectable in ranges from 26 seconds to 120 seconds, depending on the specific device. The sampling frequency of each device can also be adjusted from 4 kHz to 12 kHz with an external resistor, giving the user greater flexibility in duration versus recording quality for each application. Operating voltage spans a range from 2.4 V to 5.5 V to ensure that the ISD1700 devices are optimized for a wide range of battery or line-powered applications.

The ISD1700 is designed for operation in either standalone or microcontroller (SPI) mode. The device incorporates a proprietary message management system that allows the chip to self-manage address locations for multiple messages. This unique feature provides sophisticated messaging flexibility in a simple push-button environment. The devices include an on-chip oscillator (with external resistor control), microphone preamplifier with Automatic Gain Control (AGC), an auxiliary analog input, anti-aliasing filter, Multi-Level Storage (MLS) array, smoothing filter, volume control, Pulse Width Modulation (PWM) Class D speaker driver, and current/voltage output.

The ISD1700 devices also support an optional “vAlert” (voiceAlert) feature that can be used as a new message indicator. With vAlert, the device flashes an external LED to indicate that a new message is present. Besides, four special sound effects are reserved for audio confirmation of operations, such as “Start Record”, “Stop Record”, “Erase”, “Forward”, “Global Erase”, and etc.

Recordings are stored into on-chip Flash memory, providing zero-power message storage. This unique single-chip solution is made possible through Winbond’s patented Multi-Level Storage (MLS) technology. Audio data are stored directly in solid-state memory without digital compression, providing superior quality voice and music reproduction.

Voice signals can be fed into the chip through two independent paths: a differential microphone input and a single-ended analog input. For outputs, the ISD1700 provides a Pulse Width Modulation (PWM) Class D speaker driver and a separate analog output simultaneously. The PWM can directly drive a standard 8Ω speaker or typical buzzer, while the separate analog output can be configured as a single-ended current or voltage output to drive an external amplifier.

While in Standalone mode, the ISD1700 devices automatically enter into power down mode for power conservation after an operation is completed.

In the SPI mode, the user has full control via the serial interface in operating the device. This includes random access to any location inside the memory array by specifying the start address and end address of operations. SPI mode also allows access to the Analog Path Configuration (APC) register. This register allows flexible configuration of audio paths, inputs, outputs and mixing. The APC default configuration for standalone mode can also be modified by storing the APC data into a non-volatile register (NVCFG) that is loaded at initialization. Utilizing the capabilities of ISD1700 Series, designers have the control and flexibility to implement voice functionality into the high-end products.

Notice: The specifications are subject to change without notice. Please contact Winbond Sales Offices or Representatives to verify current or future specifications. Also refer to the website for any related application notes.

Publication Release Date: January 23, 2007

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ISD1700 SERIES

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2 FEATURES

y Integrated message management systems for single-chip, push-button applications

o REC : level-trigger for recording

o PLAY : edge-trigger for individual message or level-trigger for looping playback sequentially o ERASE : edge-triggered erase for first or last message or level-triggered erase for all messages o FWD : edge-trigger to advance to the next message or fast message scan during the playback o VOL : 8 levels output volume control

o INT RDY : ready or busy status indication o RESET : return to the default state

o Automatic power-down after each operation cycle

y Selectable sampling frequency controlled by an external oscillator resistor

y

Selectable message

duration

o A wide range selection from 20 secs to 480 secs pending upon sampling frequency chosen

Sample Freq. ISD1730

ISD1740 ISD1750

ISD1760ISD1790ISD17120ISD17150ISD17180 ISD17210ISD1724012 kHz

20 secs 26 secs 33 secs 40 secs 60 secs 80 secs 100 secs 120 secs 140 secs 160 secs 8 kHz 30 secs 40 secs 50 secs 60 secs 90 secs 120 secs 150 secs 180 secs 210 secs 240 secs 6.4 kHz 37 secs 50 secs 62 secs 75 secs 112 secs 150 secs 187 secs 225 secs 262 secs 300 secs 5.3 kHz 45 secs 60 secs 75 secs 90 secs 135 secs 181 secs 226 secs 271 secs 317 secs 362 secs 4 kHz

60 secs

80 secs

100 secs

120 secs

180 secs

240 secs

300 secs

360 secs 420 secs

480 secs

y Message and operation indicators

o Four customizable Sound Effects (SEs) for audible indication

o Optional vAlert (voiceAlert) to indicate the presence of new messages

o LED: stay on during recording, blink during playback, forward and erase operations

y Dual operating modes o Standalone mode:

Integrated message management techniques Automatic power-down after each operation cycle o SPI mode:

Fully user selectable and controllable options via APC register and various SPI commands y Two individual input channels

o MIC+/MIC-: differential microphone inputs with AGC (Automatic Gain Control) o AnaIn: single-ended auxiliary analog input for recording or feed-through y Dual output channels

o Differential PWM Class D speaker outputs directly drives an 8 ? speaker or a typical buzzer o Configurable AUD (current) or AUX (voltage) single-ended output drives external audio amplifier y ChipCorder standard features

o High-quality, natural voice and audio reproduction o 2.4V to 5.5V operating voltage

o 100-year message retention (typical) o 100,000 record cycles (typical)

Sampling Frequency

12 kHz 8 kHz 6.4 kHz 5.3 kHz 4 kHz Rosc

53 k Ω 80 k Ω100 k Ω 120 k Ω 160 k Ω

ISD1700 SERIES

y Temperature options:

o Commercial: 0°C to +50°C (die); 0°C to +70°C (packaged units)

o Industrial: -40°C to +85°C (packaged units)

y Packaging types: available in die, PDIP, SOIC and TSOP

y Package option: Lead-free packaged units

3 BLOCK DIAGRAM

Publication Release Date: January 23, 2007

- 5 - Revision 1.3-S2

ISD1700 SERIES

4 PINOUT CONFIGURATION

Refer to Design Guide for details before performing any design or PCB layout.

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ISD1700 SERIES

5 PIN DESCRIPTION

Refer to Design Guide for details before performing any design or PCB layout.

Publication Release Date: January 23, 2007

- 7 - Revision 1.3-S2

ISD1700 SERIES

6 MODES OF OPERATIONS

The ISD1700 Series can operate in either Standalone (Push-Button) or microcontroller (SPI) mode.

6.1 S TANDALONE (P USH-B UTTON)M ODE

One can utilize the REC, PLAY, FT, FWD, ERASE, VOL or RESET control to initiate a desired operation. As completed, the device automatically enters into the power-down state.

6.2 SPI M ODE

In SPI mode, control of the device is achieved through the 4-wire serial interface via SPI commands.

For technical details, please refer to the design guide.

7 TIMING DIAGRAMS

The following estimated timing diagrams are not in proper scale.

7.1 B ASIC O PERATION

Figure 12.1: Record Operation with No Sound Effect

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ISD1700 SERIES

Figure 12.2: Start and Stop Playback Operation

Figure 12.3: Single Erase Operation with No Sound Effect

Publication Release Date: January 23, 2007

- 9 - Revision 1.3-S2

ISD1700 SERIES

Figure 12.4: Forward Operation with No Sound Effect

Figure 12.5: Global Erase Operation with or without Sound Effects

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ISD1700 SERIES

Figure 12.6: Reset Operation

Figure 12.7: Playback Operation with ramp up and ramp down effect at AUD output

Publication Release Date: January 23, 2007

- 11 - Revision 1.3-S2

ISD1700 SERIES

7.2 SPI O PERATION

Figure 12.8: SPI Operation

slower sampling frequency.

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ISD1700 SERIES

Publication Release Date: January 23, 2007

- 13 - Revision 1.3-S2

8 ABSOLUTE MAXIMUM RATINGS

ABSOLUTE MAXIMUM RATINGS (DIE) [1] CONDITIONS

VALUES

Junction temperature

1500C

Storage temperature range -650C to +1500C

Voltage Applied to any pads

(V SS - 0.3V) to (V CC + 0.3V) Power supply voltage to ground potential

-0.3V to +7.0V

ABSOLUTE MAXIMUM RATINGS (PACKAGED PARTS) [1]

CONDITIONS

VALUES

Junction temperature

1500C

Storage temperature range -650C to +1500C

Voltage Applied to any pins

(V SS - 0.3V) to (V CC + 0.3V) Voltage applied to any pin (Input current limited to +/-20 mA) (V SS – 1.0V) to (V CC + 1.0V) Power supply voltage to ground potential

-0.3V to +7.0V

[1]

Stresses above those listed may cause permanent damage to the device. Exposure to the absolute maximum ratings may affect device reliability. Functional operation is not implied at these conditions.

8.1 O PERATING C ONDITIONS

OPERATING CONDITIONS (DIE) CONDITIONS

VALUES

Operating temperature range 0°C to +50°C Supply voltage (V CC ) [1] +2.4 V to +5.5 V

Ground voltage (V SS ) [2]

0 V

Input voltage (V CC ) [1]

0 V to 5.5 V Voltage applied to any pins (V SS –0.3 V) to (V CC +0.3 V)

OPERATING CONDITIONS (PACKAGED PARTS) CONDITIONS

VALUES

Operating temperature range (Case temperature) -40°C to +85°C

Supply voltage (V DD ) [1] +2.4V to +5.5V

Ground voltage (V SS ) [2]

0V Input voltage (V DD ) [1] 0V to 5.5V Voltage applied to any pins (V SS –0.3V) to (V DD +0.3V)

[1] V CC = V CCA = V CCD = V CCP

[2]

V SS = V SSA = V SSD = V SSP1 V SSP2

ISD1700 SERIES

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9 ELECTRICAL CHARACTERISTICS

9.1 DC P ARAMETERS

PARAMETER SYMBOL MIN TYP [1]MAX UNITS CONDITIONS

Supply Voltage V DD 2.4 5.5 V Input Low Voltage V IL V SS -0.3 0.3xV DD V Input High Voltage V IH 0.7xV DD V DD V Output Low Voltage V OL V SS -0.3 0.3xV DD V I OL = 4.0 mA [2] Output High Voltage V OH 0.7xV DD V DD V I OH = -1.6 mA [2]

Record Current I DD_Record 20 mA

Playback Current I DD_Playback 20 mA

Erase Current I DD_Erase 20 mA

V DD = 5.5 V, No load, Sampling freq = 12 kHz Standby Current I SB 1 10 μA [3] [4]

Input Leakage Current I ILPD1 ±1 μA Force V DD Input Current Low I ILPD2 -3 -10 μA Force V SS , others at Vcc Preamp Input Impedance R MIC+,R MIC- 7 k ? Power-up AGC AnaIn Input Impedance R AnaIn 42 k ? When active MIC Differential Input V IN1 15 300 mV Peak-to-Peak [5] AnaIn Input Voltage V IN2 1 V Peak-to-Peak Gain from MIC to SP+/- A MSP 6 40 dB V IN = 15~300 mV, AGC =

4.7 μF, V CC = 2.4V~

5.5V

Speaker Output Load R SPK 8 ? Across both Speaker pins AUX Output Load R Aux 5 k ? When active 670 mW V DD = 5.5 V 313 mW V DD = 4.4 V 117 mW V DD = 3 V Speaker Output Power Pout 49 mW V DD = 2.4 V 1Vp-p,

1 kHz sine

wave at

AnaIn. R SPK = 8 ?.

Speaker Output Voltage V OUT1 V DD V R SPK = 8? (Speaker),

Typical buzzer

AUX Output Swing V OUT2 1 V Peak-to-Peak AUX Output DC Level V OUT3 1.2 V When active AUD I AUD -3.0 mA V DD =4.5 V, R EXT = 390 ? Volume Output A Vol 0 to -28 dB 8 steps of 4dB each

reference to output

Total Harmonic Distortion THD 1 % 15 mV p-p 1 kHz sine

wave, Cmessage weighted

Notes: [1]

Conditions: V CC = 4.5V, 8 kHz sampling frequency and T A = 25°C, unless otherwise stated.

[2]

LED output during Record operation. [3]

V CCA , V CCD and V CCP are connected together. V SSA , V SSP1, V SSP2 and V SSD are connected together.

[4] REC , PLAY , FT , FWD , ERASE , VOL and RESET must be at V CCD .

[5]

Balanced input signal applied between MIC+ and MIC- as shown in the applications example. Single-ended MIC+ or MIC- input is recommended no more than 150 mV p-p.

ISD1700 SERIES

Publication Release Date: January 23, 2007 - 15 - Revision 1.3-S2

9.2 AC P ARAMETERS

CHARACTERISTIC SYMBOL MIN TYP [1] MAX UNITS CONDITIONS

Sampling Frequency [2] F S 4 12 kHz [2] [4]

Duration [3]

T Dur Refer to duration table

sec [3]

Rising Time T r 100 nsec Falling Time

T f 100 nsec

Debounce Time T Deb 192/F S msec [4]

Ramp Up Time T RU 128/F S msec Ramp Down Time T RD 128/F S msec

Initial Scan Time after power is applied

T Sc1 DRN/8/F S msec DRN = device row# [4]

Initial Scan Time from PD state

T Sc2 DRN/16/F S

msec After a PB operation

is run [4]

End Recording Time T ER 32/F S msec [4]

LED High Time

T LH 0.5K/F S msec [4]

LED Flash Time for SE1 T LS1 3.5K/F S sec SE1 not recorded [5]

LED Flash Time for SE2 T LS2 7.5K/F S sec SE2 not recorded [5]

LED Flash Time for SE3 T LS3 11.5K/F S sec SE3 not recorded [5]

LED Flash Time for SE4 T LS4 15.5K/F S sec SE4 not recorded [5]

SE1 Recorded Duration T SE1 4K/F S sec [4] [5]

SE2 Recorded Duration T SE2 4K/F S sec [4] [5]

SE3 Recorded Duration T SE3 4K/F S sec [4] [5]

SE4 Recorded Duration T SE4 4K/F S sec [4] [5]

Erase Time

T E 10MRN/F S sec MRN=message row #

[4]

Global Erase Wait Time T GE1 20K/F S sec [4] [5]

Global Erase Time T GE2 34/F S sec

RESET Pulse

T Reset 1 μsec All Fs [4]

Settle Time

T Set1 128/F S msec [4]

Settle Time after Reset T Set2 64/F S msec [4]

LED Error Time

T LErr 27.5K/F S msec [4] [5]

LED Cycle frequency

T Cyc 1 4 Hz Pending upon F S

Notes:

[1]

Typical values: V CC = 4.5 V, F S = 8 kHz and @ T A = 25°C, unless otherwise stated.

[2]

Characterization data shows that sampling frequency resolution is ±5 percent across temperature and voltage ranges. [3]

Characterization data shows that duration resolution is ±5 percent across temperature and voltage ranges. [4]

Vcc=2.4 V~5.5V [5]

K = 1024

ISD1700 SERIES

10 TYPICAL APPLICATION CIRCUITS

The following typical applications examples on ISD1700 Series are for references only. They make no representation or warranty that such applications shall be suitable for the use specified. Each design

has to be optimized in its own system for the best performance on voice quality, current consumption, functionalities and etc.

The below notes apply to the following applications examples:

*These capacitors may be needed in order to optimize for the best voice quality, which is also dependent upon the layout of the PCB. Depending on system requirements, they can be 10 μF, 4.7 μF or other values.

Please refer to the applications notes or consult Winbond for layout advice.

** It is important to have a separate path for each ground and power back to the related terminals to minimize the noise. Also, the power supplies should be decoupled as close to the device as possible.

Example #1: Recording using microphone input via push-button controls

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ISD1700 SERIES Example #2: Recording using AnaIn input via push-button controls

Publication Release Date: January 23, 2007

- 17 - Revision 1.3-S2

ISD1700 SERIES Example #3: Connecting the SPI Interface to a microcontroller

10.1 G OOD A UDIO D ESIGN P RACTICES

To ensure the highest quality of voice reproduction, it is important to follow good audio design

practices in layout and power supply decoupling. See recommendations from below links or other Application Notes in our websites.

Design Considerations for ISD1700 Family

AN-CC1002 Design Considerations for ISD1700 Family.pdf

Good Audio Design Practices

https://www.wendangku.net/doc/589370055.html,/products/isd_products/chipcorder/applicationinfo/apin11.pdf

Single-Chip Board Layout Diagrams

https://www.wendangku.net/doc/589370055.html,/products/isd_products/chipcorder/applicationinfo/apin12.pdf

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ISD1700 SERIES

Publication Release Date: January 23, 2007 - 19 - Revision 1.3-S2

11 PACKAGING

11.1 28-L EAD 8X 13.4MM P LASTIC T HIN S MALL O UTLINE P ACKAGE (TSOP) T YPE 1 - IQC

b

ISD1700 SERIES

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11.2 28-L EAD 300-M IL P LASTIC S MALL O UTLINE I NTEGRATED C IRCUIT (SOIC)

2827262524232221201918171615

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A

D

E

F B

G

C

H

Plastic Small Outline Integrated Circuit (SOIC) Dimensions