文档库 最新最全的文档下载
当前位置:文档库 › BAS21HT1G高压开关二极管原厂DCY品牌推荐

BAS21HT1G高压开关二极管原厂DCY品牌推荐

BAS21HT1G高压开关二极管原厂DCY品牌推荐
BAS21HT1G高压开关二极管原厂DCY品牌推荐

BAS21HT1G JS

HIGH VOL T AGE

SWITCHING DIODE

CASE 477, STYLE 1

SOD– 323

ANODE

1

CA THODE

MAXIMUM RATINGS

Rating

Symbol Value Unit Continuous Reverse Voltage V R 250Vdc Peak Forward Current

I F 200mAdc Peak Forward Surge Current

I FM(surge)

625

mAdc

THERMAL C HARACTERISTICS

Characteristic

Symbol Max Unit Total Device Dissipation FR–5 Board,*P D

200mW T A = 25°C

Derate above 25°C

1.57mW/°C Thermal Resistance Junction to Ambient R θJA 635°C/W Junction and Storage T J , T stg

–55 to+150

°C

Temperature Range *FR–5 Minimum Pad

ELECTRICAL CHARACTERISTICS (T A = 25°C unless otherwise noted)

Characteristic

Symbol Min

Max

Unit OFF CHARACTERISTICS

Reverse Voltage Leakage Current I R

μAdc

(V R (V R = 200 Vdc, T J = 150°C)–

100Reverse Breakdown Voltage V (BR)250

Vdc (I BR = 100 μAdc)Forward Voltage V F

mV

(I F = 100 mAdc)–1000(I F = 200 mAdc)–

1250Diode Capacitance C D – 5.0pF (V R = 0, f = 1.0 MHz)Reverse Recovery Time t rr

50

ns

(I F = I R = 30 mAdc, R L = 100 ?)

Device

Marking

Shipping 3000/Tape&Reel

We declare that the material of product compliance with RoHS requirements.

0.1 = 200 Vdc)

–ORDERING INFORMATION

?

S- Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101Qualified and PPAP Capable.

?BAS21HT1G

BAS21HT1G

Notes: 1. A 2.0 k ? variable resistor adjusted for a Forward Current (I F ) of 30 mA.2. Input pulse is adjusted so I R(peak) is equal to 30 mA.3. t p ? t rr

V R

r

t

10%

90%

I I OUTPUT PULSE (I F = I R = 30 mA; measured

at i R(REC) = 3.0 mA)

INPUT SIGNAL

Figure 1. Recovery Time Equivalent Test Circuit

Figure 2. Forward Voltage Figure 3. Reverse Leakage

FORWARD CURRENT (mA)70

R E V E R S E C U R R E N T ( A )

REVERSE VOLTAGE (V)

0601

20040060080010001200F O R W A R D V O L T A G E (m V )

μ

SOD-323

H E NOTES:

1.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 198

2.

2.CONTROLLING DIMENSION: MILLIMETERS.

3.LEAD THICKNESS SPECIFIED PER L/F DRAWING WITH SOLDER PLATING.

4.DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.

5.DIMENSION L IS MEASURED FROM END OF RADIUS.

NOTE 3

DIM MIN NOM MAX MILLIMETERS

A 0.800.90 1.00A10.000.050.10A30.15 REF b 0.250.320.4C 0.0890.120.177D 1.60

1.70

1.80E 1.15 1.25 1.350.08

2.30 2.50 2.70

L 0.0310.0350.0400.000

0.0020.0040.006 REF

0.0100.0120.0160.0030.0050.0070.0620.0660.0700.0450.0490.0530.003

0.0900.0980.105MIN NOM MAX INCHES

SOLDERING FOOTPRINT*

BAS21HT1G

相关文档