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HEXFRED ?
Ultrafast Soft Recovery Diode, 2 x 15 A
HFA30PA60C
Vishay High Power Products
FEATURES
?Ultrafast recovery ?Ultrasoft recovery ?Very low I RRM ?Very low Q rr
?Specified at operating conditions
?
Designed and qualified for industrial level
BENEFITS
?Reduced RFI and EMI
?Reduced power loss in diode and switching transistor ?Higher frequency operation ?Reduced snubbing ?
Reduced parts count
DESCRIPTION
HFA30PA60C is a state of the art center tap ultrafast recovery diode. Employing the latest in epitaxial construction and advanced processing techniques it features a superb combination of characteristics which result in performance which is unsurpassed by any rectifier previously available.With basic ratings of 600 V and 15 A per leg continuous current, the HFA30PA60C is especially well suited for use as the companion diode for IGBTs and MOSFETs. In addition to ultrafast recovery time, the HEXFRED ? product line features extremely low values of peak recovery current (I RRM ) and does not exhibit any tendency to “snap-off” during the t b portion of recovery. The HEXFRED features combine to offer designers a rectifier with lower noise and significantly lower switching losses in both the diode and the switching transistor. These HEXFRED advantages can help to significantly reduce snubbing, component count and heatsink sizes. The HEXFRED HFA30PA60C is ideally suited for applications in power supplies and power conversion systems (such as inverters), motor drives, and many other similar applications where high speed, high efficiency is needed.
PRODUCT SUMMARY
V R
600 V V F at 15 A at 25 °C
1.7 V I F(AV) 2 x 15 A t rr (typical)19 ns T J (maximum)150 °C Q rr (typical)80 nC dI (rec)M /dt (typical)160 A/μs I RRM (typical)
4.0 A
TO-247AC
ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Cathode to anode voltage
V R 600V
Maximum continuous forward current per leg I F T C = 100 °C
15A per device
30Single pulse forward current I FSM 150Maximum repetitive forward current I FRM 60Maximum power dissipation
P D T C = 25 °C 74W T C = 100 °C 29Operating junction and storage temperature range
T J , T Stg
- 55 to + 150
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Document Number: 93089
HFA30PA60C
Vishay High Power Products
HEXFRED ?
Ultrafast Soft Recovery Diode, 2 x 15 A
ELECTRICAL SPECIFICATIONS PER LEG (T J = 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MA X . UNITS
Cathode to anode breakdown voltage V BR
I R = 100 μA 600--V
Maximum forward voltage
V FM
I F = 15 A
See fig. 1
- 1.3
1.7
I F = 30 A
- 1.5 2.0
I F = 15 A, T J = 125 °C
- 1.2 1.6
Maximum reverse leakage current I RM V R = V R rated
See fig. 2- 1.010μA T J = 125 °C, V R = 0.8 x V R rated -4001000Junction capacitance C T V R = 200 V
See fig. 3-2550pF Series inductance
L S
Measured lead to lead 5 mm from package body
-12
-nH
DYNAMIC RECOVERY CHARACTERISTICS PER LEG (T J = 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MA X
. UNITS
Reverse recovery time
See fig. 5, 10t rr I F = 1.0 A, dI F /dt = 200 A/μs, V R = 30 V -19-ns
t rr1T J = 25 °C I F = 15 A
dI F /dt = 200 A/μs V R = 200 V
-4260t rr2T J = 125 °C -70120Peak recovery current See fig. 6
I RRM1T J = 25 °C - 4.0 6.0A I RRM2T J = 125 °C - 6.510Reverse recovery charge See fig. 7
Q rr1T J = 25 °C -80180nC Q rr2T J = 125 °C -220600Peak rate of fall of
recovery current during t b See fig. 8
dI (rec)M /dt1T J = 25 °C -250
-A/μs dI (rec)M /dt2
T J = 125 °C
-160-
THERMAL - MECHANICAL SPECIFICATIONS PER LEG
PARAMETER SYMBOL TEST CONDITIONS
MIN. TYP. MA X
. UNITS Lead temperature T lead
0.063” from case (1.6 mm) for 10 s
--300°C
Junction to case,
single leg conduction R thJC
-- 1.7
K/W
Junction to case, both legs conducting --0.85
Thermal resistance, junction to ambient R thJA Typical socket mount
--40Thermal resistance, case to heatsink R thCS
Mounting surface, flat, smooth and greased
-0.25-Weight
- 6.0-g -0.21-oz.Mounting torque 6.0
(5.0)
-12(10)
kgf · cm (lbf · in)
Marking device
Case style TO-247AC (JEDEC)
HFA30PA60C
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Document Number: 93089
For technical questions, contact: diodes-tech@https://www.wendangku.net/doc/5c10376116.html,
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HFA30PA60C
HEXFRED ?Ultrafast Soft Recovery Diode, 2 x 15 A
Vishay High Power Products
Fig. 1 - Maximum Forward Voltage Drop vs. Instantaneous
Forward Current (Per Leg)
Fig. 2 - Typical Reverse Current vs.
Reverse Voltage (Per Leg)
Fig. 3 - Typical Junction Capacitance vs.
Reverse Voltage (Per Leg)
Fig. 4 - Maximum Thermal Impedance Z thJC Characteristics (Per Leg)
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HFA30PA60C
Vishay High Power Products HEXFRED?
Ultrafast Soft Recovery Diode, 2 x 15 A
Fig. 5 - Typical Reverse Recovery Time vs. dI F/dt
(Per Leg)
Fig. 6 - Typical Recovery Current vs. dI F/dt (Per Leg)Fig. 7 - Typical Stored Charge vs. dI F/dt (Per Leg) Fig. 8 - Typical dI(rec)M/dt vs. dI F/dt (Per Leg)
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https://www.wendangku.net/doc/5c10376116.html, For technical questions, contact: diodes-tech@https://www.wendangku.net/doc/5c10376116.html, Document Number: 93089
Document Number: 93089For technical questions, contact: diodes-tech@https://www.wendangku.net/doc/5c10376116.html,
https://www.wendangku.net/doc/5c10376116.html,
HFA30PA60C
HEXFRED ?Ultrafast Soft Recovery Diode, 2 x 15 A
Vishay High Power Products
Fig. 9 - Reverse Recovery Parameter Test Circuit
Fig. 10 - Reverse Recovery Waveform and Definitions
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Vishay High Power Products HEXFRED?
Ultrafast Soft Recovery Diode, 2 x 15 A
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Vishay
All product specifications and data are subject to change without notice.
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