? 2000 IXYS All rights reserved
Symbol Test Conditions Maximum Ratings
V CES T J = 25°C to 150°C
900V
V CGR T
J = 25°C to 150°C; R
GE = 1 M W 900V V GES Continuous ±20V V GEM Transient ±30V I C25T C = 25°C 51A I C110T C = 110°C 28A I CM
T C = 25°C, 1 ms
120
A SSOA V GE = 15 V, T VJ = 125°C, R G = 10 W I CM = 56A (RBSOA)Clamped inductive load, L = 100 m H @ 0.8 V CES
P C T C = 25°C
200
W T J -55 ... +150
°C T JM 150
°C T stg
-55 ... +150
°C Maximum lead temperature for soldering 300
°C
1.6 mm (0.062 in.) from case for 10 s M d Mounting torque (M3)
1.13/10Nm/lb.in.
Weight
TO-247 AD 6g TO-247 SMD
4
g
Symbol Test Conditions
Characteristic Values
(T J = 25°C, unless otherwise specified)
min.typ.max.
BV CES I C = 250 m A, V GE = 0 V 900V V GE(th)I C
= 250 m A, V CE = V GE
2.5
5V I CES V CE = V CES T J = 25°C 500m A V GE = 0 V
T J = 150°C
5mA I GES V CE = 0 V, V GE = ±20 V ±100nA V CE(sat)
I C
= I C110, V GE = 15 V
2.2
2.7
V
98634B (10/00)
C (TAB)
G = Gate, C = Collector,E = Emitter,TAB = Collector
TO-247 AD (IXGH)
Features l
International standard packages JEDEC TO-268 surface
mountable and JEDEC TO-247 AD l
High current handling capability l
Latest generation HDMOS TM process l
MOS Gate turn-on -drive simplicity
Applications l
AC motor speed control l
DC servo and robot drives l
DC choppers l
Uninterruptible power supplies (UPS)l
Switched-mode and resonant-mode power supplies
Advantages l
Space savings (two devices in one package)l
High power density l
Suitable for surface mounting l
Switching speed for high frequency applications l
Easy to mount with 1 screw,TO-247(isolated mounting screw hole)
HiPerFAST TM IGBT
TO-268 (D3)(IXGT)
(TAB)
G
E
V CES =900V I C25
=
51A V CE(SAT)= 2.7V t fi(typ)
=130ns
IXGH 28N90B IXGT 28N90B Preliminary data sheet