Features
IPS024G
QUAD FULL Y PROTECTED POWER MOSFET SWITCH
Data Sheet No.PD60204
Product Summary
https://www.wendangku.net/doc/5513987987.html, 1
IPS024G
https://www.wendangku.net/doc/5513987987.html,
Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters are referenced to SOURCE lead. (T Ambient = 25o C unless otherwise specified). PCB mounting uses the standard foot-print with 70 μm copper thickness.
(1) Limited by junction temperature (pulsed current limited also by internal wiring)
Static Electrical Characteristics
Standard footprint 70 μm copper thickness. (T = 25o C unless otherwise specified.)
(2) Operations at higher switching frequencies is possible. See Appl. notes.
IPS024G
4
https://www.wendangku.net/doc/5513987987.html,
Symbol Parameter
Min.
Typ.Max. Units Test Condition s
T sd Over temperature threshold —165—o
C See fig. 1I sd Over current threshold 468 A See fig. 1V reset IN protection reset threshold 1.5 2.33 V
T reset Time to reset protection
210 40 μs V in = 0V, Tj = 25o C EOI_OT
Short circuit energy (see application note)
—
400—
μJ V cc = 14V Protection Characteristics
Lead Assignments
Functional Block Diagram
All values are typical
Ids
Vin Figure 2 - IN rise time & switching time definitions
Figure 4 - Active clamp test circuit
Ids
Vds
Vin
Figure 3 - Active clamp waveforms
IPS024G
https://www.wendangku.net/doc/5513987987.html,
All curves are typical values with standard footprints. Operating in the shaded area is not recommended.
Figure 6 - Normalized Rds(on) (%) Vs Tj (o C)
Figure 5 - Rds ON (m ?) Vs Input Voltage (V)
0501001502002503000
1
2
3
4
5
6
7
8
0%
20%40%60%80%100%120%140%160%180%200%-50-25
255075100125150175
Figure 8 - Turn-OFF Delay Time & Fall Time (us)
Vs Input Voltage (V)
Figure 7 - Turn-ON Delay Time, Rise Time & Time to 130% final Rds (on) (us) Vs Input Voltage (V)
0123456789100
1
2
3
4
5678
01
2
3
4
1
2
3
4
5
6
7
8
0.1
1
10
100
10100100010000
0.1
1
10
100
10
100
1000
10000
Figure 12 - I shutdown (A) Vs Temperature (o C)
Figure 11 - Current Iim. & I shutdown (A)
Vs Vin (V)
12
34
5
6-50-25
0255075100125150
02
4
6
80
1
2
3
4
5
6
7
8
IPS024G
https://www.wendangku.net/doc/5513987987.html,
Figure 15 - Max. Iclamp (A) Vs Inductive Load (mH)
Figure 14 - Ids (A) Vs Protection Resp. Time (s)
Figure 13 - Max.Cont. Ids (A)
Vs Amb. Temperature (o
C) - IPS024G
1
10
100
0123
45-50
50
100
150
200
Figure 16 - Transient Thermal Imped. (o C/W)
Vs Time (s)
0.01
0.1
1
10
1
00
20406080100120140160180200-50-25
25
50
75
100125150
Figure 18 - Rise Time, Fall Time and Treset (μs)
Vs Tj (o C)
0246810121416-50
-25
25
50
75
100125150
Figure 19 -Vin clamp and Vds clamp2 (%) Vs
Tj (o C)
80%
85%90%95%100%105%110%115%120%-50-25
25
50
75100125150
https://www.wendangku.net/doc/5513987987.html,
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245 Tel: (310) 252-7105
Data and specifications subject to change without notice. 10/16/2002