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高耐温基板材料技术简介

Halogen-free Substrate Materials with Highly Thermal Resistance

F. P. Tseng

(MCL/ITRI)

T g

With the establishment of environmental laws, substrate materials toward the direction of environmentally

friendly halogen-free design and development are an irresistible trend. Electronic systems move

towards light, thin, short, small, multi-functional, high-density, high reliability, low cost and good electrical characteristics for high power applications. The volume of electronic products is smaller and the computing

speed is faster, so the heat density becomes higher. Reliability and pot life of an IC device will be decreased by high temperature because heat generated by the system can’t be properly exhausted. Furthermore, the bending of substrate may result in device cracking or damage if the temperature exceeds

its T g. Therefore, the development of thermal-resistant and thermal-conductive substrate will prevent such problems. Organic materials for high thermal resistance substrates will be introduced in this article.

/Key Words

(Thermal Resistance) (Substrate Materials) (Heat Dissipating)

(BMI) (Halogen-free/Phosphorus-free)

(Through-Silicon Via; TSV) 3D IC SiP 3D IC IC

2012/07

DVD / IC 60

(T g) T g Z (Through Hole Reliability) Z (Z-axis Expansion) (Decomposition)

(Printed Circuit Board; PCB) IC (IC Substrate) (Flexible-Printed Circuit Board) IC COB FCOB DCA I/O IC BT (Bismaleimide Triazine Resin) BT 311 BT PCB (Polyimide) (Liquid Crystal Polymer; LCP)

PCB TMA T g 180°C T g T g 210°C Biphenyl Naphthalene (Dicyclopentadiene; DCPD) BT (Cyanate Ester; CE) T g Benzoxazine Poly(p-vinylphenol)

DSC 205°C PCB UL-94

2. IC

BT IC 1982 BT B (Bismaleimide) and T (Triazine) BT T g (255~330°C) (D k) (D f) BT Imide T g 170~210°C BT T g 250°C

Company

Mitsubishi

Gas’s

CCL-HL-832

Hitachi’s

MCL-

E-679F

Panasonic’s

R-1755V

HiperV

Toshiba’s

TLC-

W-556M

Sumitomo’s

ELC-4781

Risho’s

CS-3667

NanYa’s

NP-200R

ITEQ’s

IT-180TC

Uniplus’s

Tg 200

Isola’s

G200

T g (°C) 180

(TMA)173~183

(TMA)

173

(TMA)

160~170

(TMA)

175

(TMA)

215

(TMA)

190 ± 5

(DSC)

180

(TMA)

200

(DSC)

185

(DSC)

α (ppm/°C) 5534~354451503750~705540~60–D k (1 MHz) 4.5 4.6~4.8 4.4 4.8~5.0 4.6 4.3 4.4~4.6 4.6 4.6 4.1 D f (1 MHz) 0.00680.013~0.0150.0160.010~0.0170.0170.0190.0150.0190.0160.013

–––1~5 × 1014 2 × 1014 1 × 1014 4 × 1015 5 × 101210141014

–––1~5 × 1015 2 × 1015 5 × 1015 1 × 10167 × 101210141013

Flexural Strength

(kg/mm2)

24~26

(GPa)

2,500

(kN/cm2)

440~540

(MPa)

540

(N/mm2)

600

(N/mm2)

>70,000

(psi)

–

>69,000

(psi)

87,000

(psi)

UL-94 V0V0V0V0V0V0V0V0V0V0

Peel Strength (1/2 oz)

1.5

(kN/m)

1.0~1.4

(kN/m)

1.2

(kN/m)

0.9

(kN/m)

8~12 (1oz)

(lb/in)

>5.0

(lb/in)

Water Absorption

0.3%

(85°C/85 RH)

0.55~0.65%

(PCT 5h)

0.27%

(PCT 1.5h)

0.4%

(PCT 2h)

0.06%

(D-24/23)

0.1%

(D-24/23)

0.10%

(D-24/23)

0.20%

(PCT1h)

0.18%

(D-24/23)

0.14%

(D-24/23)

σs (?) σv (?-cm)

0.97 (kg/cm) 1.2~1.4 (kN/m)

CCL

2012/07

BT IC 1.5~2 BT BT IC PC BT 311 BT IC BT

T g (PI) PI PI LCP LCP PI 1/10 3.0 PI 3.5 LCP Type I Type II Type III LCP PI LCP PI

AI UL-94 V0 T g TMA 250°C

1. Panasonic

Panasonic 2009 - CEM-3 ECOOL R-1787 CEM-3 2 1 W/m·K ECOOL R-1787 Panasonic CCL 2011 6 JPCA SHOW CCL 1.5 W/m·K LED (Thermal Simulation) ECOOL R-1787 FR-4 35°C ALIVH FR-4 9.3%

(Hitachi Chemical) 2009

Boundary Condition

ECOOL ECOOL Thermal Exchange at 8 W/m 1/4 Model

ECOOL LED

PCB PCB LED (RCC) 5~10 W/m·K - CCL 2011 JPCA SHOW 1.0 W/m·K MCL-E-510G

FR-4 CCL 10°C

(RISHO KOGYO) LED PCB 2006 CS-3965H FR-4 LED LED

2012/07

0%20%40%0%-2%-4%-6%-8%-10%

FR4

R: -3.0%

R: -9.3%

T – T 0————T 0 – T R

(%)R = × 100R (%)T 0

(FR4) (°C)

T (°C)T R (°C)

Panasonic (2011)

FR4

(0.4 W/m·K)(1.3~1.5 W/m·K)

2009 LED CCL CS-3975 - CCL (CS-3965H) LED CCL 180°C 400°C CS-3965H 200°C 70h 150°C 1,000h LED

CS-3975 (70h) (200°C) 8% CS-3975 LED LED CCL LED

RISHO KOGYO (2011)

CCL (MCPCB) LED LED 3~4 2009 AC CC Al AC Cu CC 2011 JPCA SHOW AC MCPCB 3.1 W/m·K

2011 JPCA SHOW Mitsubishi Gas Chemical BT

2.0 W/m·K FR-4 CCL 15~20°C Chip-LED BT 150°C 4h 84% Sumitomo Bakelite CEM-3 0.9 W/m·K LED FR-4 CCL 10°C MCPCB (Al Base) 2.5 W/m·K LED FR-4CCL 23°C

2012/07

/ T g 230°C TMA UL-94 V0 Hot Disk? 1.3~1.5 W/m·K

BT TMA T g 180°C 200°C 2011 JPCA Show 0.7~2.0 W/m·K

T g 230°C 1.3~1.5 W/m·K

1.Kuo-Chan Chiou, Lu-Shih Liao and Tzong-Ming Lee,"Film Type Dielectric Materials with High Thermal Conductivity", Taiwan Printed Circuit Association Forum 2006.

2. , "LED ", 231 2006.

3. , " ", 2007 JPCA

Item

Unit Properties Conditions TMA TMA PCT/30 min UL 94-V Hot Disk ?

23020~250.35V01.3~1.5

°C ppm/°C %–W/m·K

Glass Transition Temperature Thermal Expansion Water Absorption Flammability Thermal Conductivity

RG: 1

? : 1.00

SC: NORM

09/12/2514:02:05(200.0)(-10.0)

RG: 1

? : 1.00

SC: NORM

09/12/2515:18:08(200.0)50.047.044.041.038.035.032.029.026.050.047.044.041.038.035.032.029.026.0(-10.0)

40°C

50°C

SUMITOMO BAKELITE (2011)

ELC-4970SC/ELC-4970GS

FR-4

LED FR-4

, July 13, 2007.4. , " ", 2007 JPCA , July 13, 2007.5.Hajime Kimura, Akihiro Matsumoto, Hidemitsu Sugito,Kiichi Hasegawa, Keiko Ohtsuka, Akinori Fukuda,"New Thermosetting Resin from Poly( p-vinylphenol)Based Benzoxazine and Epoxy Resin", Journal of Applied Polymer Science, vol.79, p.555, 2001.6. , " LED ", 281 , P.90-98, 2010.7.2011 JPCA Show, June 1~June3, 2011.

8. , " ", PCB , July 15, 2011.

9. IEK, " BT ", Q2 , P.57-62, 2012.