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SRU2009-2R2Y中文资料

*RoHS Directive 2002/95/EC Jan 27 2003 including Annex Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications.

SRU2009-2R2Y中文资料

SRU2009-2R2Y中文资料

SRU2009-2R2Y中文资料

*R o H S C O M P L I A

N T

Product Dimensions

Recommended Layout

Electrical Schematic

Reflow Soldering...230 °C, 50 sec. max.Operating T emperature..-40 °C to +125 °C

(T emperature rise included)

Storage Temperature..-40 °C to +125 °C Resistance to Soldering Heat

................................260 °C for 10 sec.Materials

Core.....................Ferrite DR and RI core Wire.............................Enameled copper Terminal ....................................Ag/Ni/Sn Rated Current

....................Ind. drop 35 % typ. at Isat Temperature Rise

......................40 °C max. at rated Irms Packaging..................1,500 pcs. per reel A

DIMENSIONS:

MM (INCHES)

REF.

*R o H S C O M P L I A N T Inductance 100 KHz

Q Test SRF RDC I rms I sat Bourns Part No.

(μH)

Tol. %

Ref.

Frequency Typ.Max.Max.Typ.(MHz)

(MHz)

(m ?)

(A)

(A)

Marking

SRU2009-1R0Y 1.0±307 7.96200 110

1.45 1.30A SRU2009-2R2Y

2.2±307 7.96120 210 1.100.80C SRU2009-3R3Y

3.3±307 7.96100 3200.800.60E SRU2009-4R4Y

4.4±307 7.9685 4300.680.50F SRU2009-6R8Y 6.8±307 7.9670 6500.520.45G SRU2009-100Y 10±3010 2.5250 10800.400.35H SRU2009-150Y 15±3010 2.5240 13700.300.30I SRU2009-220Y 22±3010 2.5230 26000.220.22J

SRU2009 Series - Shielded SMD Power Inductors

SRU2009-2R2Y中文资料

SRU2009-2R2Y中文资料

SRU2009-2R2Y中文资料

Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications.

03/07

Packaging Specifications

EMBOSSED CAVITY

COVER TAPE

USER DIRECTION OF FEED

DIMENSIONS:

MM (INCHES)