SS12-SS110-SMB

l SS12

SS13SS14SS15

SS16SS18SS110Major Ratings and Characteristics

Features

? Low profile package

? Ideal for automated placement ? Ultrafast reverse recovery time ? Low power losses, high efficiency ? Low forward voltage drop ? High surge capability ? High temperature soldering ?

260?/10 seconds at terminals

?

Component in accordance to

RoHS 2002/95/1 and WEEE 2002/96/EC

Mechanical Date

?

Case: JEDEC DO-214AA molded plastic body over passivated chip ?

Terminals: Solder plated, solderable per J-STD-002B and JESD22-B102D ?

Polarity: Laser band denotes cathode end

Maximum Ratings & Thermal Characteristics & Electrical Characteristics

(T A = 25 °C unless otherwise noted)

Symbol SK12

SK13SK14SK15SK16SK18SK110UNIT V RRM 203040506080100V V RMS 14212835425670V V DC 20

30

40

5060

80

100

V I F(AV)A I FSM A

V F 0.50V I R mA R ?JL ?/ W T J , T STG

?

Operating junction and storage temperature range

– 65 to +125

Maximum DC reverse current T A = 25 ?at Rated DC blocking voltage T A = 100?0.55Thermal resistance from junction to Lead

30Peak forward surge current 8.3 ms single half sine-wave superimposed on rated load

40

Maximum instantaneous forward voltage at 1.0A 0.550.700.85Maximum RMS voltage Maximum DC blocking voltage

Maximum average forward rectified current 1T j max.125°C Maximum repetitive peak reverse voltage I FSM 40 A V F 0.50V,0.55 V , 0.70 V, 0.85V I F(AV) 1.0 A V RRM 20 V to 100 V

Characteristic Curves (T

=25 ? unless otherwise noted)

A