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74LVC573APW-T中文资料

74LVC573A

Octal D-type transparent latch with 5 V tolerant

inputs/outputs; 3-state

Rev. 04.00 — 18 May 2006Product data sheet

1.General description

The 74LVC573A consists of eight D-type transparent latches, featuring separate D-type

inputs for each latch and 3-state true outputs for bus-oriented applications. A Latch

Enable (LE) input and an Output Enable (OE) input are common to all internal latches.

When LE is HIGH, data at the Dn inputs enters the latches. In this condition, the latches

are transparent, that is, a latch output will change each time its corresponding D-input

changes. When LE is LOW, the latches store the information that was present at the

D-inputs one setup time preceding the HIGH-to-LOW transition of LE.

When OE is LOW, the contents of the eight latches are available at the outputs. When OE

is HIGH, the outputs go to the high impedance OFF-state. Operation of the OE input does

not affect the state of the latches.

It is a high-performance, low-power, low-voltage, Si-gate CMOS device, superior to most

advanced CMOS compatible TTL families.

Inputs can be driven from either 3.3V or5V devices. When disabled, up to 5.5 V can be

applied to the outputs. This feature allows the use of these devices as translators in mixed

3.3V or5V applications.

The 74LVC573A is functionally identical to the 74LVC373A, but has a different pin

arrangement.

2.Features

5 V tolerant inputs/outputs, for interfacing with 5V logic

Supply voltage range from 1.2V to3.6V

CMOS low power consumption

Direct interface with TTL levels

High-impedance when V CC = 0 V

Flow-through pin-out architecture

Complies with JEDEC standard JESD8-B/JESD36

ESD protection:

HBM JESD22-A114-C exceeds 2000V

CDM JESD22-C101-C exceeds 1000V

Specified from ?40°C to +85°C and ?40°C to 125°C

3.Ordering information

4.Functional diagram

Table 1:

Ordering information

Type number

Package Temperature range

Name

Description

Version

74LVC573AD

?40 °C to +125 °C SO20plastic small outline package; 20leads; body width 7.5mm SOT163-174LVC573ADB ?40 °C to +125 °C SSOP20plastic shrink small outline package; 20leads; body width 5.3mm

SOT339-174LVC573APW ?40 °C to +125 °C TSSOP20plastic thin shrink small outline package; 20leads; body width 4.4mm

SOT360-1

74LVC573ABQ ?40 °C to +125 °C DHVQFN20

plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 20terminals; body 2.5×4.5×0.85mm

SOT764-1

5.Pinning information

5.1Pinning

5.2Pin description

Table 2:Pin description

Symbol Pin Description

OE1output enable input (active LOW) D0 - D7 2 - 9data input

GND10ground (0 V)

LE11latch enable input (active HIGH) Q7 - Q012 - 19data output

V CC20supply voltage

6.Functional description

[1]

H = HIGH voltage level

h = HIGH voltage level one setup time prior to the HIGH-to-LOW LE transition L = LOW voltage level

l = LOW voltage level one setup time prior to the HIGH-to-LOW LE transition Z = High-impedance OFF-state.

7.Limiting values

[1]The input and output voltage ratings may be exceeded if the input and output current ratings are observed.[2]

For SO20 packages: above 70°C the value of P tot derates linearly with 8mW/K.For (T)SSOP20 packages: above 60°C the value of P tot derates linearly with 5.5mW/K.For DHVQFN20 packages: above 60°C the value of P tot derates linearly with 4.5mW/K.

Table 3:

Functional table [1]

Operating modes Input Internal latch Output

OE LE Dn Qn

Enable and read register (transparent mode)L H L L L L H H H H Latch and read register L L l L L L L h H H Latch register and disable outputs

H L l L Z H

Table 4:Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).Symbol Parameter Conditions Min Max Unit V CC supply voltage ?0.5+6.5V I IK input clamping current V I < 0

-?50mA V I input voltage

[1]

?0.5+6.5V I OK output clamping current V O > V CC or V O < 0-±50mA V O output voltage [1]

?0.5V CC + 0.5V I O output current V O = 0 to V CC

-±50mA I CC supply current -+100mA I GND ground current -?100mA T stg storage temperature ?65

+150°C P tot

total power dissipation

T amb = ?40 °C to +125 °C

[2]

500

8.Recommended operating conditions

9.Static characteristics

Table 5:Recommended operating conditions Symbol Parameter Conditions

Min Typ Max Unit V CC supply voltage 1.2- 3.6V V I input voltage 0- 5.5V V O output voltage output HIGH- or LOW-state 0-V CC V output 3-state 0- 5.5V T amb ambient temperature in free air

?40-+125°C ?t/?V

input transition rise

and fall rate

V CC = 1.65 V to 2.7 V 0-20ns/V V CC = 2.7 V to 3.6 V 0

-10

ns/V

Table 6:Static characteristics

At recommended operating conditions voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Typ [1]Max Unit T amb =?40 °C to +85°C V IH

HIGH-level input voltage

V CC = 1.2 V

1.08--V V CC = 1.65 V to 1.95 V 0.65 × V CC -

-V V CC = 2.3 V to 2.7 V 1.7--V V CC = 2.7 V to 3.6 V

2.0--V V IL

LOW-level input voltage

V CC = 1.2 V

--0.12V V CC = 1.65 V to 1.95 V --0.35 × V CC V

V CC = 2.3 V to 2.7 V --0.7V V CC = 2.7 V to 3.6 V

--0.8V V OH

HIGH-level output voltage

V I =V IH or V IL

I O =?100μA; V CC = 1.65 V to 3.6 V V CC ?0.2V CC -V I O =?4mA; V CC = 1.65 V V CC ?0.45-

-V I O =?8mA; V CC = 2.3 V V CC ?0.5--V I O =?12mA; V CC = 2.7 V V CC ?0.5--V I O =?18mA; V CC = 3.0 V V CC ?0.6--V I O =?24mA; V CC = 3.0 V

V CC ?0.8--V V OL

LOW-level output voltage

V I =V IH or V IL

I O =100μA; V CC = 1.65 V to 3.6 V --0.20V I O =4mA; V CC = 1.65 V --0.45V I O =8mA; V CC = 2.3 V --0.6V I O =12mA; V CC = 2.7 V --0.4V I O =24mA; V CC = 3.0 V

--0.55V I I input leakage current V CC = 3.6 V; V I =5.5V or GND [2]

-±0.1±5μA I OZ OFF-state output current V CC =3.6V;V I =V IH or V IL ; V O =5.5V or GND

-0.1±10μA I OFF

power off leakage supply

V CC =0.0V;V I or V O =5.5V

0.1

±10

μA

[1]All typical values are measured at V CC = 3.3 V (unless stated otherwise) and T amb =25°C.

[2]

The specified overdrive current at the data input forces the data input to the opposite logic input state.

I CC supply current

V CC = 3.6 V; V I =V CC or GND; I O =0-0.110μA ?I CC additional supply current per input pin V CC = 2.7 V to 3.6 V; V I =V CC ?0.6V; I O =0

-5500μA C I input capacitance V CC =0 V to 3.6V; V I = GND to V CC - 5.0-pF T amb =?40 °C to +125°C

V IH

HIGH-level input voltage

V CC = 1.2 V

1.08--V V CC = 1.65 V to 1.95 V 0.65 × V CC -

-V V CC = 2.3 V to 2.7 V 1.7--V V CC = 2.7 V to 3.6 V

2.0--V V IL

LOW-level input voltage

V CC = 1.2 V

--0.12V V CC = 1.65 V to 1.95 V --0.35 × V CC V

V CC = 2.3 V to 2.7 V --0.7V V CC = 2.7 V to 3.6 V

--0.8V V OH

HIGH-level output voltage

V I =V IH or V IL

I O =?100μA; V CC = 1.65 V to 3.6 V V CC ?0.3--V I O =?4mA; V CC = 1.65 V V CC ?0.6

-V I O =?8mA; V CC = 2.3 V V CC ?0.65--V I O =?12mA; V CC = 2.7 V V CC ?0.65--V I O =?18mA; V CC = 3.0 V V CC ?0.75--V I O =?24mA; V CC = 3.0 V

V CC ?1--V V OL

LOW-level output voltage

V I =V IH or V IL

I O =100μA; V CC = 1.65 V to 3.6 V --0.3V I O =4mA; V CC = 1.65 V --0.65V I O =8mA; V CC = 2.3 V --0.8V I O =12mA; V CC = 2.7 V --0.6V I O =24mA; V CC = 3.0 V

--0.8V I I input leakage current V CC = 3.6 V; V I =5.5V or GND --±20μA I CC supply current

V CC = 3.6 V; V I =V CC or GND; I O =0--40μA ?I CC

additional supply current per input pin

V CC = 2.7 V to 3.6 V; V I =V CC ?0.6V; I O =0

5000

μA

Table 6:Static characteristics …continued

At recommended operating conditions voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions

Min Typ [1]Max Unit

10.Dynamic characteristics

Table 7:Dynamic characteristics

Voltages are referenced to GND (ground=0V). For test circuit see Figure11.

Symbol Parameter Conditions Min Typ[1]Max Unit T amb=?40°C to+85 °C

t PHL, t PLH HIGH to LOW, LOW to HIGH propagation delay

Dn to Qn see Figure7

V CC= 1.2 V-16.0-ns

V CC= 1.65V to 1.95 V 1.97.814.8ns

V CC= 2.3V to 2.7 V 1.3 4.17.7ns

V CC= 2.7V 2.0 4.17.2ns

V CC= 3.0V to3.6V 1.6 3.4 6.2ns LE to Qn see Figure8

V CC= 1.2 V-16.0-ns

V CC= 1.65V to 1.95 V 1.97.714.6ns

V CC= 2.3V to 2.7 V 1.3 4.17.5ns

V CC= 2.7V 1.7 3.77.0ns

V CC= 3.0V to3.6V 1.6 3.4 6.3ns

t PZH, t PZL OFF-state to HIGH, OFF-state to

LOW propagation delay OE to Qn see Figure9

V CC= 1.2 V-18.0-ns V CC = 1.65 V to 1.95 V 1.57.516ns V CC = 2.3 V to 2.7 V 1.2 4.28.8ns V CC = 2.7 V 2.1 4.27.5ns V CC = 3.0 V to 3.6 V 1.5 3.47.0ns

t PHZ, t PLZ HIGH to OFF-state,

LOW to OFF-state propagation

delay OE to Qn see Figure9

V CC= 1.2 V-8.0-ns V CC = 1.65 V to 1.95 V0.4 3.38.1ns V CC = 2.3 V to 2.7 V0.3 1.8 4.6ns V CC = 2.7 V 1.8 3.0 5.2ns V CC = 3.0 V to 3.6 V 1.5 2.5 4.9ns

t W pulse width, LE HIGH see Figure8

V CC = 1.65 V to 1.95 V8.0--ns

V CC = 2.3 V to 2.7 V 4.0--ns

V CC = 2.7 V 3.2--ns

V CC = 3.0 V to 3.6 V 3.2 1.6-ns t su setup time, nD to nCP see Figure10

V CC = 1.65 V to 1.95 V 5.0--ns

V CC = 2.3 V to 2.7 V 3.7--ns

V CC = 2.7 V 1.7--ns

V CC = 3.0 V to 3.6 V 1.7--ns

t h

hold time, Dn to LE

see Figure 10

V CC = 1.65 V to 1.95 V 3.0--ns V CC = 2.3 V to 2.7 V 1.9--ns V CC = 2.7 V 1.5--ns V CC = 3.0 V to 3.6 V

1.4--ns t sk(0)output skew time

V CC = 3.0 V to 3.6 V

[2]

1.0

T amb =?40°C to +125 °C

t PHL , t PLH

HIGH to LOW, LOW to HIGH propagation delay Dn to Qn

see Figure 7V CC = 1.2 V

---ns V CC = 1.65V to 1.95 V 1.9-18.5ns V CC = 2.3V to 2.7 V 1.3-10.0ns V CC = 2.7V 2.0-9.5ns V CC = 3.0V to 3.6V

1.6

-8.0

LE to Qn

see Figure 8V CC = 1.2 V

---ns V CC = 1.65V to 1.95 V 1.9-18.5ns V CC = 2.3V to 2.7 V 1.3-9.5ns V CC = 2.7V 1.7-9.0ns V CC = 3.0V to 3.6V

1.6

-8.0

t PZH , t PZL

OFF-state to HIGH, OFF-state to LOW propagation delay OE to Qn

see Figure 9V CC = 1.2 V

---ns V CC = 1.65 V to 1.95 V 1.5-20ns V CC = 2.3 V to 2.7 V 1.2-11ns V CC = 2.7 V 2.1-9.5ns V CC = 3.0 V to 3.6 V

1.5

-9.0

t PHZ , t PLZ

HIGH to OFF-state,

LOW to OFF-state propagation delay OE to Qn

see Figure 9V CC = 1.2 V

---ns V CC = 1.65 V to 1.95 V 0.4-10.5ns V CC = 2.3 V to 2.7 V 0.3- 6.0ns V CC = 2.7 V 1.8- 6.5ns V CC = 3.0 V to 3.6 V

1.5

- 6.5

t W

pulse width, LE HIGH

see Figure 8

V CC = 1.65 V to 1.95 V 8.0--ns V CC = 2.3 V to 2.7 V 4.0--ns V CC = 2.7 V 3.2--ns V CC = 3.0 V to 3.6 V

3.2

--ns

Table 7:Dynamic characteristics …continued

Voltages are referenced to GND (ground =0V). For test circuit see Figure 11.Symbol Parameter Conditions Min Typ [1]Max Unit

[1]Typical values are measured at T amb =25°C and V CC = 1.8 V, 2.5 V, 2.7 V, and 3.3 V respectively.

[2]Skew between any two outputs of the same package switching in the same direction. This parameter is guaranteed by design.[3]

C P

D is used to determine the dynamic power dissipation (P D in μW).P D =C PD ×V CC 2×f i ×N +Σ(C L ×V CC 2×f o )where:f i = input frequency in MHz,f o =output frequency in MHz,C L =output load capacitance in pF,V CC =supply voltage in V,N =number of inputs,

Σ(C L ×V CC 2×f o )=sum of the outputs.

11.AC waveforms

t su

setup time, nD to nCP

see Figure 10

V CC = 1.65 V to 1.95 V 5.0--ns V CC = 2.3 V to 2.7 V 3.7--ns V CC = 2.7 V 1.7--ns V CC = 3.0 V to 3.6 V

1.7--ns t h

hold time, Dn to LE

see Figure 10

V CC = 1.65 V to 1.95 V 3.0--ns V CC = 2.3 V to 2.7 V 1.9--ns V CC = 2.7 V 1.5--ns V CC = 3.0 V to 3.6 V

1.4

--ns t sk(o)

output skew time

V CC = 3.0 V to 3.6 V

[2]

1.0

T amb = 25 °C C PD

power dissipation capacitance per latch.

V I = GND to V CC

[3]

V CC = 1.65 V to 1.95 V -7-pF V CC = 2.3 V to 2.7 V -10-pF V CC = 3.0 V to 3.6 V

Table 7:Dynamic characteristics …continued

Voltages are referenced to GND (ground =0V). For test circuit see Figure 11.Symbol Parameter

Conditions Min Typ [1]Max Unit

Table 8:Test data

Supply voltage Input Load V EXT

V I t r, t f C L R L t PLH, t PHL t PLZ, t PZL t PHZ, t PZH

1.65V to1.95V V CC≤ 2 ns30pF 1 k?open 2 × V CC GND

2.3V to2.7V V CC≤ 2 ns30pF500?open 2 × V CC GND

2.7V 2.7V≤ 2.5ns50pF500?open6V GND

12.Package outline

SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1

SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm SOT339-1

TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1

SOT764-1DHVQFN20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;

20 terminals; body 2.5 x 4.5 x 0.85 mm

13.Abbreviations

14.Revision history

Table 9.Abbreviations

Acronym Description

CDM Charged Device Model

CMOS Complementary Metal Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model TTL

Transistor Transistor Logic

Table 10.

Revision history

Document ID Release date Data sheet status Change notice Supersedes 74LVC573A_4

Product data sheet

-74LVC573A_3

Modifications:

?The format of this data sheet is redesigned to comply with the current presentation and information standard of Philips Semiconductors.

Table 4, Table 5, Table 6, Table 7 and Table 8: values added for lower voltage ranges.

74LVC573A_3 (939775011938)20031003Product specification -74LVC573A_274LVC573A_2 (939775010494)20030526Product specification -74LVC573A_174LVC573A_1 (939775004513)

19980729

Product specification

15.Legal information

15.1Data sheet status

[1]Please consult the most recently issued document before initiating or completing a design. [2]The term ‘short data sheet’ is explained in section “Definitions”.

[3]

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL https://www.wendangku.net/doc/6113236152.html,.

15.2Definitions

Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. Philips Semiconductors does not give any representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local Philips Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.

15.3Disclaimers

General — Information in this document is believed to be accurate and

reliable. However, Philips Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information.

Right to make changes — Philips Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.

Suitability for use — Philips Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or

malfunction of a Philips Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental

damage. Philips Semiconductors accepts no liability for inclusion and/or use of Philips Semiconductors products in such equipment or applications and therefore such inclusion and/or use is for the customer’s own risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.

Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and and

operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability.

Terms and conditions of sale — Philips Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at https://www.wendangku.net/doc/6113236152.html,/profile/terms , including those

pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by Philips

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15.4Trademarks

Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.

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For additional information, please visit: https://www.wendangku.net/doc/6113236152.html,

For sales office addresses, send an email to: sales.addresses@https://www.wendangku.net/doc/6113236152.html,

Document status [1][2]Product status [3]Definition

Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet

Production

This document contains the product specification.

17.Contents

1General description. . . . . . . . . . . . . . . . . . . . . . 1

2Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

3Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2

5Pinning information. . . . . . . . . . . . . . . . . . . . . . 4

5.1Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

5.2Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4

6Functional description . . . . . . . . . . . . . . . . . . . 5

7Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5

8Recommended operating conditions. . . . . . . . 6

9Static characteristics. . . . . . . . . . . . . . . . . . . . . 6

10Dynamic characteristics. . . . . . . . . . . . . . . . . . 8

11AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . 10

12Package outline. . . . . . . . . . . . . . . . . . . . . . . . 13

13Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 17

14Revision history. . . . . . . . . . . . . . . . . . . . . . . . 17

15Legal information. . . . . . . . . . . . . . . . . . . . . . . 18

15.1Data sheet status . . . . . . . . . . . . . . . . . . . . . . 18

15.2Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

15.3Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 18

15.4Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 18

16Contact information. . . . . . . . . . . . . . . . . . . . . 18

17Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.