75757-1301中文资料

Breakaway Header 75757

SPECIFICATIONS

■ H igh-temperature thermoplastic housing assures lead-free processing compatibility

■ U nshrouded design offers ?exibility in customer application ■ D esigned to be compatible with Molex MX150 connectors which accommodate wire-to-board applications ■ C ompatible with USCAR 1.50mm (.059”) blade speci?cations in industry compatible format ■ U nique breakaway design provides ability to break between rows and circuits ■ 20-circuit master sticks provide distributor-friendly, value-added opportunities Features and Bene?ts

Flexible design permits customers to standardize PCB layouts and reduce inventory carrying costs

MX150 dual-row, unshrouded headers are designed to mate with Molex MX150 connectors and are compatible with USCAR standard connectors. The unshrouded headers allow customers to standardize printed circuit board (PCB) designs by incorporating the shroud into an external shell, permitting rapid-design revisions while reducing work in process.

The unique breakaway design allows the customer to meet the increasing demands for design ?exibility. These low-pro?le vertical headers are available in both single and dual-row con?gurations. A wide range of circuit sizes, plating options and pin lengths are available.The MX150 unshrouded breakaway headers are appropriate for both power and signal applications with current ratings up to 16 amperes per circuit.

These parts are the ?rst in the series to be released. Additional parts in dual-row, as well as single-row versions will be available by June, 2006.Reference Information Packaging: Tubes UL File No.: Pending CSA File No.: Pending Mates With: MX150 Connectors Dual-Row (Series 33472)Designed In: Millimeters

Electrical Voltage: 500V DC Current: 16.0A Contact Resistance: 20 milliohm max.Dielectric Withstanding Voltage: 1500V Insulation Resistance: 20 Megohms min.Mechanical Contact Retention to Housing: 0.7Kg min.Mating Force: 6.5N (1.46 lbf) per contact max.Unmating Force: 5N (1.12 lbf) per contact max.Durability: Tin (Sn) — 25 cycles Gold (Au) — 50 cycles Physical Housing: LCP Contact: Copper (Cu) Alloy Plating: Contact Area — Tin (Sn) or Gold (Au) Solder Tail Area — Tin (Sn) Underplating — Nickel (Ni)PCB Thickness: 1.57mm (0.062”), 2.36mm (.093”) or 3.18mm (.125”)Orientation: Vertical Operating Temperature: -40 to +125°C

Flammability: UL 94V-0MX150 Breakaway Header

Americas Headquarters Lisle, Illinois 60532 U.S.A.1-800-78MOLEX amerinfo@https://www.wendangku.net/doc/7a341359.html,

Far East North Headquarters Yamato, Kanagawa, Japan 81-462-65-2324feninfo@https://www.wendangku.net/doc/7a341359.html, Far East South Headquarters Jurong, Singapore 65-6-268-6868fesinfo@https://www.wendangku.net/doc/7a341359.html, European Headquarters Munich, Germany 49-89-413092-0eurinfo@https://www.wendangku.net/doc/7a341359.html, Corporate Headquarters 2222 Wellington Ct.Lisle, IL 60532 U.S.A.630-969-4550 Fax:630-969-1352Visit our website at https://www.wendangku.net/doc/7a341359.html,/product/mx150ubh.html Order No. USA-342 Printed in USA/JI/2006.03 ?2006, Molex Breakaway Header 75757ORDERING INFORMATION

■ O utdoor applications - Telecommunications devices - Lighting - Audio

■ A utomotive related markets - Automotive suppliers (tier 1 or tier 2) - Trucking industry - Specialty vehicle manufactures - A utomotive aftermarket and specialty equipment manufacturers

■ R ecreational Markets - Outdoor power equipment - Recreational vehicles - Snowmobiles - Motorcycles - ATV’s

■ I ndoor sealed applications - Appliances - Restaurant equipment makers - Utility equipment manufacturers

Circuits

3.05mm (.120”) PC Tail

4.75mm (.187”) PC Tail Overall Tin (Sn)15μ” Select Gold (Au)30μ” Select Gold (Au)Overall Tin (Sn)15μ” Select Gold (Au)30μ” Select Gold (Au)

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