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BB189,115;BB189,315;中文规格书,Datasheet资料

1.Product pro?le

1.1General description

The BB189 is a planar technology variable capacitance diode in a SOD523 ultra small leadless plastic SMD package.The excellent matching performance is achieved by gliding matching and a Direct Matching Assembly (DMA) procedure.

1.2Features

I Excellent linearity

I Excellent matching to 1.8 % DMA I Ultra small plastic SMD package

I C d(25V): 2.05pF; C d(2V) to C d(25V) ratio: 6.3 min.I

Low series resistance

1.3Applications

I Voltage Controlled Oscillators (VCO)

I Electronic tuning in UHF television tuners

2.Pinning information

[1]The marking bar indicates the cathode.

3.Ordering information

BB189

UHF variable capacitance diode

Rev. 01 — 8 June 2009

Product data sheet

Table 1.Pinning

Pin Description Simpli?ed outline Graphic symbol

1cathode [1]

anode

1sym008

Table 2.

Ordering information

Type number

Package Name

Description

Version BB189

SC-79

plastic surface-mounted package; 2 leads

SOD523

4.Marking

5.Limiting values

6.Characteristics

Table 3.Marking codes

Type number

Marking code BB189

Table 4.Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).Symbol Parameter Conditions

Min Max Unit V R reverse voltage -32V I F forward current -20mA T stg storage temperature ?55+150°C T j

junction temperature

?55

+125

°C

Table 5.Characteristics

T j =25°C unless otherwise speci?ed Symbol Parameter Conditions Min

Typ

Max

Unit

I R

reverse current

see Figure 2V R =30V

--10nA V R =30V; T j =85°C

--200nA r s diode series resistance f =470MHz at C d =9pF -0.6

0.7

C d

diode capacitance

f =1MHz; see Figure 1 and Figure 3V R =2V 14.15-15.75pF V R =25V

1.89-

2.18pF

C d(2V)/C d(25V)diode capacitance ratio (2V to 25V) f = 1 MHz

6.3--?C d /C d

diode capacitance matching

V R =2V to 25V;in sequence of 10 diodes (gliding)

-- 1.8

Fig 1.

Diode capacitance as a function of reverse voltage; typical values

T j =0°C to 85°C.

Fig 2.

Reverse current as a function of junction temperature; maximum values

Fig 3.

Temperature coef?cient of diode capacitance as a function of reverse voltage; typical values

001aak204

30C d (pF)

0V R (V)

10?1

102

1001aak205

102

10103I R (nA)1

T j (°C)

0100

406020V R (V)

10?1

102

1001aak206

10?3

10?4

10?2TC Cd (K ?1)10?5

7.Package outline

8.Abbreviations

9.Revision history

Fig 4.Package outline SOD523 (SC-79)

REFERENCES

OUTLINE VERSION EUROPEAN PROJECTION

ISSUE DATE IEC

JEDEC

JEITA SOD523

SC-79

02-12-1306-03-16

Plastic surface-mounted package; 2 leads

SOD523

00.5 1 mm

scale

D 1

H E

b p

v M A

UNIT

b p

c D E v mm

A H E DIMENSIONS (mm are the original dimensions)Note

1. The marking bar indicates the cathode.

(1)

0.340.26

0.170.11

0.1

0.850.75

1.251.15

0.650.58

1.651.55

Table 6.Abbreviations

Acronym Description

SMD Surface Mounted Device UHF

Ultra High Frequency

Table 7.Revision history

Document ID

Release date Data sheet status Change notice Supersedes BB189_1

20090608

Product data sheet

10.Legal information

10.1Data sheet status

[1]Please consult the most recently issued document before initiating or completing a design.[2]The term ‘short data sheet’ is explained in section “De?nitions”.

[3]

The product status of device(s)described in this document may have changed since this document was published and may differ in case of multiple devices.The latest product status information is available on the Internet at URL https://www.wendangku.net/doc/7314888786.html, .

10.2De?nitions

Draft —The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modi?cations or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of use of such information.

Short data sheet —A short data sheet is an extract from a full data sheet with the same product type number(s)and title.A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales of?ce. In case of any inconsistency or con?ict with the short data sheet, the full data sheet shall prevail.

10.3Disclaimers

General —Information in this document is believed to be accurate and

reliable.However,NXP Semiconductors does not give any representations or warranties,expressed or implied,as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information.

Right to make changes —NXP Semiconductors reserves the right to make changes to information published in this document, including without

limitation speci?cations and product descriptions, at any time and without notice.This document supersedes and replaces all information supplied prior to the publication hereof.

Suitability for use —NXP Semiconductors products are not designed,authorized or warranted to be suitable for use in medical, military, aircraft,space or life support equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.

Applications —Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation.

Limiting values —Stress above one or more limiting values (as de?ned in the Absolute Maximum Ratings System of IEC 60134)may cause permanent damage to the device.Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the

Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability.

Terms and conditions of sale —NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale,as published at https://www.wendangku.net/doc/7314888786.html,/pro?le/terms , including those pertaining to warranty,intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or con?ict between information in this document and such terms and conditions, the latter will prevail.

No offer to sell or license —Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant,conveyance or implication of any license under any copyrights,patents or other industrial or intellectual property rights.

Export control —This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.

10.4Trademarks

Notice:All referenced brands,product names,service names and trademarks are the property of their respective owners.

11.Contact information

For more information, please visit:https://www.wendangku.net/doc/7314888786.html,

For sales of?ce addresses, please send an email to:salesaddresses@https://www.wendangku.net/doc/7314888786.html,

Document status [1][2]Product status [3]De?nition

Objective [short] data sheet Development This document contains data from the objective speci?cation for product development.Preliminary [short] data sheet Quali?cation This document contains data from the preliminary speci?cation.Product [short] data sheet

Production

This document contains the product speci?cation.

12.Contents

1Product pro?le. . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1General description. . . . . . . . . . . . . . . . . . . . . . 1

1.2Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.3Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

2Pinning information. . . . . . . . . . . . . . . . . . . . . . 1

3Ordering information. . . . . . . . . . . . . . . . . . . . . 1

4Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

5Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2

6Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 2

7Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 4

8Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . . 4

9Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 4

10Legal information. . . . . . . . . . . . . . . . . . . . . . . . 5

10.1Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 5

10.2De?nitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

10.3Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

10.4T rademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

11Contact information. . . . . . . . . . . . . . . . . . . . . . 5

12Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

For more information, please visit: https://www.wendangku.net/doc/7314888786.html,

For sales office addresses, please send an email to: salesaddresses@https://www.wendangku.net/doc/7314888786.html,

Date of release: 8 June 2009

分销商库存信息:

NXP

BB189,115BB189,315