HSML-A100-Q7PJ1中文资料
Description
This family of SMT LEDs is packaged in the industry standard PLCC-2 package. These SMT LEDs have high reliability performance and are designed to work under a wide range of environmental conditions. This high reliability feature makes them ideally suited to be used under harsh interior automotive as well as interior signs application conditions.
To facilitate easy pick & place assembly, the LEDs are packed in EIA-compliant tape and reel. Every reel will be shipped in single intensity and color bin, except red color, to provide close uniformity.
These LEDs are compatible with IR solder reflow process. Due to the high reliability feature of these products, they can also be mounted using through-the-wave soldering process.
The super wide viewing angle at 120? makes these LEDs ideally suited for panel, push button, or general backlighting in automotive interior, office equipment, industrial equipment, and home appliances. The flat top emitting surface makes it easy for these LEDs to mate with light pipes. With the built-in reflector pushing up the intensity of the light output, these LEDs are also suitable to be used as LED pixels in interior elec-tronic signs.
Features
? Industry standard PLCC-2 package ? High reliability LED package
? High brightness using AlInGaP and InGaN dice tech-nologies ? Available in full selection of colors ? Super wide viewing angle at 120?
? Available in 8 mm carrier tape on 7 inch reel (2000 pieces)? Compatible with both IR and TTW soldering process
Applications
? Interior automotive
– Instrument panel backlighting – Central console backlighting – Cabin backlighting ? Electronic signs and signals – Interior full color sign – Variable message sign
? Office automation, home appliances, industrial equipment
– Front panel backlighting – Push button backlighting – Display backlighting
HSMx-A10x-xxxxx PLCC-2
Surface Mount LED Indicator
Data Sheet
CAUTION: HSMN,M,K and E-A10x-xxxxx LEDs are Class 2 ESD sensitive. Please observe appropriate precau-
tions during handling and processing. Refer to Avago Application Note AN-1142 for additional details.
Package Dimensions
(ANODE MARKING FOR AlGaAs DEVICES)
TOP MOUNT
REVERSE MOUNT
NOTE: ALL DIMENSIONS IN MILLIMETERS.
Device Selection Guide
Red
Part Number Min. Iv (mcd) Typ. Iv (mcd) Max. Iv (mcd) Test Current (mA) Dice Technology HSMS-A100-J00J1 4.0 15.0 - 20 GaP HSMS-A100-L00J1 10.0 15.0 - 20 GaP HSMS-A100-H70J2 .0 - 8.0 10 GaP HSMS-A100-J80J2 5.0 - 15.5 10 GaP HSMH-A100-L00J1 10.0 15.0 - 20 AlGaAs HSMH-A100-N00J1 25.0 50.0 - 20 AlGaAs HSMH-A100-L70J2 12.5 - 2.0 10 AlGaAs HSMH-A100-M80J2 20.0 - 62.0 10 AlGaAs HSMH-A100-P 0J1 40.0 - 100.0 20 AlGaAs HSMC-A100-J00J1 4.0 100.0 - 20 AlInGaP HSMC-A100-Q00J1 6 .0 100.0 - 20 AlInGaP HSMC-A100-R00J1 100.0 140.0 - 20 AlInGaP HSMC-A101-S00J1 160.0 220.0 - 20 AlInGaP HSMZ-A100-T00J1 250.0 50.0 - 20 AlInGaP HSMC-A100-P 0J1 40.0 - 100.0 20 AlInGaP HSMC-A101-R80J1 125.0 - 95.0 20 AlInGaP HSMZ-A100-S80J1 200.0 - 620.0 20 AlInGaP
Red Orange
Part Number Min. Iv (mcd) Typ. Iv (mcd) Max. Iv (mcd) Test Current (mA) Dice Technology HSMJ-A100-Q00J1 6 .0 100.0 - 20 AlInGaP HSMJ-A101-S00J1 160.0 200.0 - 20 AlInGaP HSMV-A100-T00J1 250.0 50.0 - 20 AlInGaP HSMJ-A100-Q 0J1 6 .0 - 155.0 20 AlInGaP HSMJ-A100-R40J1 100.0 - 15.0 20 AlInGaP HSMJ-A101-R80J1 125.0 - 95.0 20 AlInGaP HSMV-A100-S80J1 200.0 - 620.0 20 AlInGaP
Orange
Part Number Min. Iv (mcd) Typ. Iv (mcd) Max. Iv (mcd) Test Current (mA) Dice Technology HSMD-A100-J00J1 4.0 15.0 - 20 GaP HSMD-A100-L00J1 10.0 15.0 - 20 GaP HSMD-A100-J7PJ2 5.0 - 12.5 10 GaP HSMD-A100-K4PJ2 6. - 20.0 10 GaP
HSML-A100-Q00J1 6 .0 100.0 - 20 AlInGaP HSML-A101-S00J1 160.0 220.0 - 20 AlInGaP HSML-A100-Q7PJ1 80.0 - 200.0 20 AlInGaP HSML-A100-R7PJ1 125.0 - 15.0 20 AlInGaP HSML-A101-R8WJ1 125.0 - 95.0 20 AlInGaP
Device Selection Guide, continued
Yellow/Amber
Part Number Min. Iv (mcd) Typ. Iv (mcd) Max. Iv (mcd) Test Current (mA) Dice Technology HSMY-A100-J00J1 4.0 12.0 - 20 GaP HSMY-A100-L00J1 10.0 12.0 - 20 GaP HSMY-A100-J 5J2 4.0 - 10.0 10 GaP HSMY-A100-K45J2 6. - 20.0 10 GaP HSMA-A100-Q00J1 6 .0 100.0 - 20 AlInGaP HSMA-A101-S00J1 160.0 220.0 - 20 AlInGaP HSMU-A100-S00J1 160.0 20.0 - 20 AlInGaP HSMA-A100-Q 5J1 6 .0 - 155.0 20 AlInGaP HSMA-A100-R45J1 100.0 - 15.0 20 AlInGaP HSMA-A101-R8WJ1 125.0 - 95.0 20 AlInGaP HSMU-A100-S4WJ1 160.0 - 500.0 20 AlInGaP
Yellow Green
Part Number Min. Iv (mcd) Typ. Iv (mcd) Max. Iv (mcd) Test Current (mA) Dice Technology HSMG-A100-J02J1 4.0 18.0 - 20 GaP HSMG-A100-K72J2 8.0 - 20.0 10 GaP HSME-A100-M02J1 16.0 70.0 - 20 AlInGaP HSME-A100-N82J1 0.0 - 100.0 20 AlInGaP
Emerald Green
Part Number Min. Iv (mcd) Typ. Iv (mcd) Max. Iv (mcd) Test Current (mA) Dice Technology HSMG-A100-H01J1 2.5 8.0 - 20 GaP HSMG-A100-G 1J2 1.6 - 4.0 10 GaP HSMG-A100-H41J2 2.5 - 8.0 10 GaP HSME-A100-L01J1 10.0 40.0 - 20 AlInGaP HSME-A100-M PJ1 16.0 - 40.0 20 AlInGaP
Green
Part Number Min. Iv (mcd) Typ. Iv (mcd) Max. Iv (mcd) Test Current (mA) Dice Technology HSMM-A101-R00J1 100.0 200.0 - 20 InGaN HSMM-A100-S00J1 160.0 50.0 - 20 InGaN HSMM-A101-Q7PJ1 80.0 - 200.0 20 InGaN HSMM-A101-R7PJ1 125.0 - 15.0 20 InGaN HSMM-A101-R8PJ1 125.0 - 95.0 20 InGaN HSMM-A100-S8PJ1 200.0 - 620.0 20 InGaN
Device Selection Guide, continued
Cyan
Part Number Min. Iv (mcd) Typ. Iv (mcd) Max. Iv (mcd) Test Current (mA) Dice Technology HSMK-A101-R00J1 100.0 170.0 - 20 InGaN
HSMK-A100-S00J1 160.0 280.0 - 20 InGaN
HSMK-A100-S8WJ1 200.0 - 620.0 20 InGaN
HSMK-A101-Q WJ1 6 .0 - 155.0 20 InGaN
HSMK-A101-R4WJ1 100.0 - 15.0 20 InGaN
Blue
Part Number Min. Iv (mcd) Typ. Iv (mcd) Max. Iv (mcd) Test Current (mA) Dice Technology HSMB-A100-J00J1 4.0 15.0 - 20 GaN
HSMB-A100-J70J2 5.0 - 12.5 10 GaN
HSMB-A100-K80J2 8.0 - 25.0 10 GaN
HSMN-A101-N00J1 25.0 50.0 - 20 InGaN
HSMN-A100-P00J1 40.0 70.0 - 20 InGaN
HSMN-A101-N7YJ1 0.0 - 80.0 20 InGaN
HSMN-A100-P8YJ1 50.0 - 155.0 20 InGaN
Note:
1. The luminous intensity, I v, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not be aligned with this axis.
Part Numbering System
HSM x1 - A x2 x x4 -x5x6 x7 x8x9
Packaging Option
Color Bin Selection
Intensity Bin Select
Device Specific Configuration
Package Type
LED Chip Color
Absolute Maximum Ratings (T A = 25°C)
Parameters HSMS/D/Y/G HSMH HSMC/J/L/A HSME HSMZ/V/U HSMM/K/B/N DC Forward Current[1] 0 mA 0 mA 0 mA[ ,4]20 mA[4] 0 mA[ ,4] 0 mA Peak Forward Current[2]100 mA 100 mA 100 mA 100 mA 100 mA 100 mA Power Dissipation 6 mW 60 mW 6 mW 48 mW 72 mW 114 mW Reverse Voltage 5 V
Junction Temperature 110°C
Operating Temperature –55°C to +100°C
Storage Temperature –55°C to +100°C
Notes:
1. Derate linearly as shown in Figure 4.
2. Duty factor = 10%, Frequency = 1 kHz.
. Drive current between 10 mA and 0 mA is recommended for best long term performance.
4. Operation at current below 5 mA is not recommended.
Electrical Characteristics (T A = 25?C) Forward Voltage Reverse Voltage Reverse Voltage Thermal
V F (Volts) @ I F = 20 mA V R @ 100 μA V R @ 10 μA Resistance Part Number Typ. Max. Min. Min. R θJP (°C/W)HSMS/D/Y/G 2.2 2.6 5 — 180HSMH 1.9 2.6 5 — 180HSMC/J/L/A/E 1.9 2.4 5 — 280HSMZ/V/U 2.2 2.6 5 — 280HSMB .9 4. — 5 280HSMM/K/N .4
4.05
—
5
280
Optical Characteristics (T A = 25?C)
Viewing
Luminous Peak
Dominant Angle Luminous Intensity/ Wavelength Wavelength [1] 2 θ1/2[2] Efficacy ηv [3] Total Flux
Dice
λPEAK (nm) λD (nm) (Degrees) (lm/W) I v (mcd)/Φv (mlm) Color Part Number Technology Typ. Typ. Typ. Typ. Typ.Red HSMS-A100 GaP 6 5 626 120 120 0.45 HSMH-A100 AlGaAs 645 6 7 120 6 0.45 HSMC-A10x AlInGaP 6 5 626 120 150 0.45 HSMZ-A100 AlInGaP 6 9 6 0 120 155 0.45Red HSMJ-A10x AlInGaP 621 615 120 240 0.45Orange
HSMV-A100 AlInGaP 62 617 120 26 0.45Orange HSMD-A100 GaP 600 602 120 80 0.45 HSML-A10x AlInGaP 609 605 120 20 0.45Amber HSMY-A100 GaP 58 585 120 520 0.45 HSMA-A10x AlInGaP 592 590 120 480 0.45 HSMU-A100 AlInGaP 594 592 120 500 0.45Yellow HSMG-A100 GaP 565 569 120 590 0.45Green HSME-A100 AlInGaP 575 570 120 560 0.45Emerald HSMG-A100 GaP 558 560 120 650 0.45Green
HSME-A100 AlInGaP 566 560 120 610 0.45Green HSMM-A10x InGaN 52 525 120 500 0.45Cyan HSMK-A10x InGaN 502 505 120 00 0.45Blue HSMB-A100 GaN 428 462 120 65 0.45
HSMN-A10x
InGaN
468
470
120
75
0.45
Notes:
1. The dominant wavelength, λD , is derived from the CIE Chromaticity Diagram and represents the color of the device.
2. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
. Radiant intensity, I e in watts/steradian, may be calculated from the equation I e = I v /ηv , where I v is the luminous intensity in candelas and ηv is the luminous efficacy in lumens/watt.
Figure 1. Relative intensity vs. wavelength.
Figure 2. Forward current vs. forward voltage.
Figure 3. Relative intensity vs. forward current.
Figure 4. Maximum forward current vs. ambient temperature. Derated based on T J MAX = 110?C, RθJA
= 500?C/W.Figure 5. Dominant wavelength vs. forward
current – InGaN devices.
FORWARD VOLTAGE – V
103035 F O R W A R D C U R R E N T – m A
520
1525Figure 4b. Maximum Forward Current Vs. Solder Point Temperature. Derated based on T J MAX = 110°C, RθJP
= 180°C/W or 280°C/W.
101520253035TEMPERATURE (°C)
C U R R E N T - m
A
51015202530
35
TEMPERATURE (°C)
C U R R E N T - m A
CURRENT – mA
460
480540 D O M I N A N T W A V E L E N G T H – n m
HSMx-A100 fig 5
500470510490520530
Figure 8a. Recommended SnPb reflow soldering profile.
Figure 7. Radiation Pattern.
D E L T A V F (N O R M A L I Z E D A T 25°C )
-0.3TEMPERATURE – °C
0.50.40.20.10-0.2-0.10.3Figure 6. Forward voltage shift vs. temperature.Figure 8b. Recommended Pb-free reflow soldering profile.
(Acc. to J-STD-020C)
TIME
T E M P E R A T U R E
T E M P E R A T U R E – °C
Note: For detail information on reflow soldering of Avago surface
Figure 11. Tape leader and trailer dimensions.
Figure 12. Tape dimensions.
Figure 13. Reel dimensions.
Figure 14. Reeling orientation.
Intensity Bin Select (X5X6) Individual reel will contain parts from one half bin only.
X5Min I v Bin
X6
0 Full Distribution
half bins starting from X51
4 4 half bins starting from X51
5 5 half bins starting from X51
7 half bins starting from X52
8 4 half bins starting from X52
9 5 half bins starting from X52 Intensity Bin Limits
Bin ID Min. (mcd) Max. (mcd) G1 1.80 2.24
G2 2.24 2.80
H1 2.80 .55
H2 .55 4.50
J1 4.50 5.60
J2 5.60 7.20
K1 7.20 9.00
K2 9.00 11.20
L1 11.20 14.00
L2 14.00 18.00
M1 18.00 22.40
M2 22.40 28.50
N1 28.50 5.50
N2 5.50 45.00
P1 45.00 56.00
P2 56.00 71.50
Q1 71.50 90.00
Q2 90.00 112.50 R1 112.50 140.00 R2 140.00 180.00 S1 180.00 224.00 S2 224.00 285.00 T1 285.00 55.00 T2 55.00 450.00 U1 450.00 560.00 U2 560.00 715.00 V1 715.00 900.00 V2 900.00 1125.00 Tolerance of each bin limit = ± 12%.Color Bin Select (X7)
Individual reel will contain parts
from one full bin only.
X7
0 Full Distribution
Z A and B only
Y B and C only
W C and D only
V D and E only
U E and F only
T F and G only
S G and H only
Q A, B, and C only
P B, C, and D only
N C, D, and E only
M D, E, and F only
L E, F, and G only
K F, G, and H only
1 A, B, C, and D only
2 E, F, G, and H only
B, C, D, and E only
4 C, D, E, and F only
5 A, B, C, D, and E only
6 B, C, D, E, and F only
Color Bin Limits
Blue Min. (nm) Max. (nm)
A 460.0 465.0
B 465.0 470.0
C 470.0 475.0
D 475.0 480.0
Green Min. (nm) Max. (nm)
A 515.0 520.0
B 520.0 525.0
C 525.0 5 0.0
D 5 0.0 5 5.0
Cyan Min. (nm) Max. (nm)
A 490.0 495.0
B 495.0 500.0
C 500.0 505.0
D 505.0 510.0
Color Bin Limits
Emerald
Green Min. (nm) Max. (nm)
A 552.5 555.5
B 555.5 558.5
C 558.5 561.5
D 561.5 564.5
Orange Min. (nm) Max. (nm)
A 597.0 600.0
B 600.0 60 .0
C 60 .0 606.0
D 606.0 609.0
E 609.0 612.0
Red Orange Min. (nm) Max. (nm)
A 611.0 616.0
B 616.0 620.0
Red Min. (nm) Max. (nm)
Full Distribution
Tolerance of each bin limit = ± 1 nm.
Amber Min. (nm) Max. (nm)
A 582.0 584.5
B 584.5 587.0
C 587.0 589.5
D 589.5 592.0
E 592.0 594.5
F 594.5 597.0
Yellow
Green Min. (nm) Max. (nm)
E 564.5 567.5
F 567.5 570.5
G 570.5 57 .5
H 57 .5 576.5
Packaging Option (X 8X 9)Option Test Current Package Type Reel Size J1 20 mA Top Mount 7 inch J4 20 mA Top Mount 1 inch H1 20 mA Reverse Mount 7 inch H4 20 mA Reverse Mount 1 inch J2 10 mA Top Mount 7 inch J5 10 mA Top Mount 1 inch H2 10 mA Reverse Mount 7 inch H5 10 mA Reverse Mount
1 inch
For product information and a complete list of distributors, please go to our website: https://www.wendangku.net/doc/8d1795440.html, Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.Data subject to change. Copyright ? 2007 Avago Technologies Limited. All rights reserved. Obsoletes AV01-0040EN AV02-0198EN - May 30, 2007
Moisture Sensitivity
This product is qualified as Moisture Sensitive Level 2a per Jedec J-STD-020. Precautions when handling this moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN5 05 Handling of Moisture Sensitive Surface Mount Devices for details.
A. Storage before use
- Unopen moisture barrier bag (MBB) can be stored at <40°C/90%RH for 12 months. If the actual shelf life has exceeded 12 months and the HIC indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating.- It is not recommended to open the MBB prior to assembly (e.g. for IQC).
B. Control after opening the MBB
- The humidity indicator card (HIC) shall be read im-mediately upon opening of MBB.- The LEDs must be kept at < 0°C / 60%RH at all time and all high temperature related process including soldering, curing or rework need to be completed within 672 hours.
C. Control for unfinished reel
- For any unuse LEDs, they need to be stored in sealed MBB with desiccant or desiccator at <5%RH.
D. Control of assembled boards
- If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB need to be stored in sealed MBB with desiccant or desic-cator at <5%RH to ensure no LEDs have exceeded their floor life of 672 hours.
E. Baking is required if:
- “10%” or “15%” HIC indicator turns pink.
- The LEDs are exposed to condition of > 0°C / 60% RH at any time.- The LEDs floor life exceeded 672 hours.
Recommended baking condition: 60±5°C for 20 hours.