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AMIS-710251中文资料

1.0 General Description

The AMIS-710251-A6 (PI251MC-A6) is a contact imaging sensor (CIS) module. It is a successor module to its predecessor, AMIS-710222-A6 (PI222MC-A6). This possesses all qualities of its predecessor, except, it has one outstanding feature - it operates from a single 5V supply. Like its predecessor, it is composed of 13 AMIS-720220 (PI3020) sensor chips. The AMIS-720220 is a 200 dots per inch (dpi) solid-state line imaging array, also a product of AMI Semiconductor. This imaging device is fabricated using MOS imaging sensor technology for its high-speed performance and high sensitivity. Like its predecessor, the AMIS-710251-A6 is suitable for scanning A6 size (104mm) documents with 8 dots per millimeter (dpm) resolution. Applications include ticket, check and card scanners, variety of mark readers and other automation equipment.

2.0 Key Features

? Low power-single power supply at 5.0V

? Light source, lens and sensor are integrated into a single module

? 8dpm resolution, 104mm scanning length

? High speed page scan - up to 167μsec/line @ 5MHz pixel rate

? Wide dynamic range

? Analog output

? Yellow-Green LED light source

? Compact size ? 14mm x 19mm x 120mm

? Light weight

3.0 Functional Description

The AMIS-710251-A6 consists of 13 imaging array sensors that are cascaded to provide 832 photo-detectors. Each sensor contains its associated multiplex switches, and a digital shift register that controls its sequential readout. Each sensor also contains a chip-select switch so that each following chip is accessed sequentially as its predecessor chip completes its scan. These chips are mounted on a printed circuit board (PCB) along with clock buffers and video signal amplifier. The only change from its predecessor module is in this amplifier. It has been slightly altered to gain the single supply feature through the application of the new rail-to-rail single volt operational amplifiers. See Figure 1.

The PCB containing the imaging array is encl -to-one graded indexed micro lens array that his pictorial cross section shows the LED bar light source and its illumination path. The light on the document reflects images of the all plastic housing and covered with a glass window. This cover glass not only serves to protect all 4.0 Pin Out Description

osed in a module housing, along with a one focuses the scanned documents' image onto the sensing line of the sensor chips. The document is illuminated with a LED light source which is also mounted in the housing. See Figure 2.

T document. The reflected images focus through the micro lens onto the chips' image sensing line where images are converted to proportional electrical charges. An on board amplifier processes these signal charges into proportional video signal voltages, which are sent out to the output video port.

ll components are housed in a sm A of the critical components within the housing from dust, but, along with micro lens, plays a minor role in the depth-of-focus because it lies in the optical path.

There is one connector located at the end of the module. The outline of the module's housing in Figure 4 illustrates the connector location. With the module window facing down on the flat surface, the viewer looking down on backside of the module and the connector's pins facing viewer, the connector is located on the right-hand end of the module. The connector is a single row of 10-pin with a 1.25mm pin space. It is a JAE 1L-Z-10P-S125T3-E. Its I/O designation is provided in Table 1. The location of Pin 1 is indicated on the module outline.

Table 1: I/O Designation

Pin Number Symbol Names and Functions

1 Vout Analog video output

2 Gnd (0V) Ground

3 Vdd (+5V) Positive power supply

4 NA Not used

5 Gn V) d (0Ground

6 SP Shift register start pulse

7 Gnd (0V) Ground

8 CP Sampling clock pulse

9 GLED Ground for the light source 10 VLED Supply for the light source

5.0 Absolute Maximum Rating

The following is a table of absolute maximum parameters. These parameters should not be used in prolonged operation.

Table 2: Absolute Maximum Rating Parameter Symbols Maximum Rating Units Vdd 7.0 V Idd 50 mA VLED 6.0 V Power supply

ILED 650 mA Input clock pulse (high) Vih Vdd V Input clock pulse (low)

Vil -0.5 V

Table 3: Operating Environment

Parameter

Symbols Maximum Rating

Units

Operating temperature Top 0 to 50 °C Operating humidity Hop 10 to 85 % Storage temperature Tstg -25 to 85 °C Storage humidity

Hstg 5 to 95 %

6.0 Electro-Optical Characteristics (25°C)

Table 4: Electro-Optical Characteristics (25°

C) Parameter

Symbol

Parameter

Units Note Number of photo detectors 832 Elements Pixel-to-pixel spacing 125 μm

Line scanning rate Ti (1)nt 170 μsec

@ 5MHz clock frequency

Clock frequency

(2)

Fclk 5 MHz Bright output voltage

(3)

Video output 1.0 V Specified for

Tint = 170μsec

Bright output non-uniformity

(4)

Up <+/-30 % Adjacent pixel non-uniformity

(5)

Uadj <25 % Dark non-uniformity

(6)

Ud <50 mV Dark output voltage

Vd 27525

(7)

MTF >40 % See Note 7 for

MTF & DOF

Definition:

1. Ti

2. F nt: line scanning rate or integration time. Tint is determined by the interval of two SP. clk: main clock frequency applied to into the module. It is also equal to the pixel frequency. th g] x 100%; where Upmax is determined by the highest

m the largest of the two values |Upmax| or |Upmin|. 100 [%]. Depth of focus, DOF, range is defined with the MTF

0.4mm from the glass surface, and is > 40 percent with its peaks at approximately mid-point, 0.2mm. 8. 3. Vpavg = ∑ Vp(n)/832; where Vp(n) is the n pixel voltage value

4. Up is defined as follows: Upmax= [(Vpmax - Vpavg) / Vpavg] x 100% and Upmin= [(Vpavg - Vpmin) / Vpav n th video pixel, Vp(n), and Vpmin is determined by minimum pixel, Vp(n), then Up is selected fro

5. Upadj is between two adjacent pixel's non-uniformity and defined as follows.

Upadj = MAX[ | (Vp(n) - Vp(n+l) | / Vp(n)] x 100% Ud = Vdmax – Vdmin

6. Vdmin is the minimum output in the dark. Vdmax: maximum output voltage in the light.

7. MTF = [(Vmax - Vmin) / (Vmax + Vmin)] x MTF is measured at glass surface to approximately Vmax: maximum output voltage at 50lp/inch (At 1/2 of the optical Nyquest frequency) Vmin: minimum output voltage at 50lp/inch lp / inch: line pair per inch

Table 5: Recommended Operating Conditions (25°C)

Item Symbol Min. Mean Max. Units

Power supply

Vdd 4.5 5.0 5.5 V

VLED 4.5 5.0 5.5 V

Idd 30 35 40 ma

ILED 200 360 480 ma Input voltage at digital high Vih Vdd-1.0 Vdd-0.5 Vdd V

Input voltage at digital low Vil 0 0.6 V

Clock frequency(1)Fclk 5.0 5.5MHz

Clock pulse high duty cycle(2) 25 % Clock pulse high duration(3)50 ns

Integration time(3)Tint 0.167 5.0 ms Operating temperature Top 25 50 °C

Notes:

1. The module will operate at 5.5MHz, but its performances cannot be guaranteed.

2. Clock duty cycle is defined as the ratio of the high level duration divided by the duration of the clock period.

3. Tint (min.) is the lowest line integration time available at 5.0MHz clock rate.

7.0 Switching Characteristics (25°C)

The switching characteristics for the I/O clocks are shown in Figure 3. Its corresponding timing symbol definitions are given in Table 6. Table 6: Symbol Definition for the Above Timing Diagram

Item Symbol Min. Typ. Max. Units

Clock cycle time to 0.2 4.0 μs

Clock pulse width tw 50 ns

Clock duty cycle 25 75 %

Prohibit crossing time of SP tprh 15 ns

Data setup time tds 20 ns

Data hold time tdh 20 ns

Signal delay time tdl 50 ns

Signal settling time tsh 120 ns

8.0 AMIS-710251-A6 Module and its Mechanical Dimensions

The sketch of this module is to provide a pictorial of the module size and structure. A detailed drawing is available upon request.

9.0 Company or Product Inquiries

For more information about AMI Semiconductor, our technology and our product, visit our Web site at: https://www.wendangku.net/doc/8a7212340.html, North America

Tel: +1.208.233.4690

Fax: +1.208.234.6795

Europe

Tel: +32 (0) 55.33.22.11

Fax: +32 (0) 55.31.81.12

Production Technical Data - The information contained in this document applies to a product in production. AMI Semiconductor and its subsidiaries (“AMIS”) have made every effort to ensure that the information is accurate and reliable. However, the characteristics and specifications of the product are subject to change without notice and the information is provided “AS IS” without warranty of any kind (express or implied). Customers are advised to obtain the latest version of relevant information to verify that data being relied on is the most current and complete. AMIS reserves the right to discontinue production and change specifications and prices at any time and without notice. Products sold by AMIS are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. AMIS makes no other warranty, express or implied, and disclaims the warranties of noninfringement, merchantability, or fitness for a particular purpose. AMI Semiconductor's products are intended for use in ordinary commercial applications. These products are not designed, authorized, or warranted to be suitable for use in life-support systems or other critical applications where malfunction may cause personal injury. Inclusion of AMIS products in such applications is understood to be fully at the customer’s risk. Applications requiring extended temperature range, operation in unusual environmental conditions, or high reliability, such as military or medical life-support, are specifically not recommended without additional processing by AMIS for such applications. Copyright ? 2006 AMI Semiconductor, Inc.

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