3.3 V, ±15 kV ESD-Protected, Half- and
Full-Duplex, RS-485/RS-422 Transceivers ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E
Rev. E
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. T rademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, N orwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 https://www.wendangku.net/doc/8b12666867.html, Fax: 781.461.3113 ?2006–2009 Analog Devices, Inc. All rights reserved.
FEATURES
TIA/EIA RS-485/RS-422 compliant
±15 kV ESD protection on RS-485 input/output pins
Data rates
ADM3070E/ADM3071E/ADM3072E: 250 kbps
ADM3073E/ADM3074E/ADM3075E: 500 kbps
ADM3076E/ADM3077E/ADM3078E: 16 Mbps
Half- and full-duplex options
True fail-safe receiver inputs
Up to 256 nodes on the bus
?40°C to +125°C temperature option
Hot-swap input structure on DE and RE pins
Reduced slew rates for low EMI
Low power shutdown current (all except ADM3071E/
ADM3074E/ADM3077E)
Outputs high-Z when disabled or powered off
Common-mode input range: ?7 V to +12 V
Thermal shutdown and short-circuit protection
8-lead and 14-lead narrow SOIC packages APPLICATIONS
Power/energy metering
Industrial control
Lighting systems
Telecommunications
Security systems
Instrumentation
GENERAL DESCRIPTION
The ADM307xE are 3.3 V, low power data transceivers with
±15 kV ESD protection suitable for full- and half-duplex communication on multipoint bus transmission lines. They are designed for balanced data transmission, and they comply with TIA/EIA standards: RS-485 and RS-422.
The devices have a ? unit load receiver input impedance, which allows up to 256 transceivers on a bus. Because only one driver should be enabled at any time, the output of a disabled or powered-down driver is tristated to avoid overloading the bus.
The receiver inputs have a true fail-safe feature, which eliminates the need for external bias resistors and ensures a logic high output level when the inputs are open or shorted. This guar-antees that the receiver outputs are in a known state before communication begins and when communication ceases. FUNCTIONAL BLOCK DIAGRAMS
A
B
Z
Y
GND
6
2
8
5
-
1
Figure 1.
RO
DI
A
B
Z
Y
6
2
8
5
-
2
Figure 2.
GND
6
2
8
5
-
3
Figure 3.
ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E
Rev. E | Page 2 of 20
TABLE OF CONTENTS
Features .............................................................................................. 1 Applications ....................................................................................... 1 General Description ......................................................................... 1 Functional Block Diagrams ............................................................. 1 Revision History ............................................................................... 2 Specifications ..................................................................................... 4 Timing Specifications—ADM 3070E/ADM 3071E/ADM 3072E ....................................... 5 Timing Specifications—ADM 3073E/ADM 3074E/ADM 3075E ....................................... 6 Timing Specifications—ADM 3076E/ADM 3077E/ADM 3078E ....................................... 7 Absolute Maximum Ratings ............................................................ 8 ESD Caution .................................................................................. 8 Pin Configurations and Function Descriptions ........................... 9 Test Circuits and Switching Characteristics .. (10)
Typical Performance Characteristics ........................................... 12 Circuit Description......................................................................... 15 Function Tables ........................................................................... 15 Receiver Fail-Safe ....................................................................... 15 Hot-Swap Capability .................................................................. 16 Line Length vs. Data Rate ......................................................... 16 ±15 kV ESD Protection ............................................................. 16 Human Body Model .................................................................. 16 256 Transceivers on the Bus ...................................................... 16 Reduced EMI and Reflections .................................................. 16 Low Power Shutdown Mode ..................................................... 17 Driver Output Protection .......................................................... 17 Typical Applications ................................................................... 17 Outline Dimensions ....................................................................... 19 Ordering Guide .. (20)
REVISION HISTORY
8/09—Rev. D to Rev. E
Changes to Ordering Guide .......................................................... 20 4/09—Rev. C to Rev. D
Changes to Ordering Guide .......................................................... 20 1/09—Rev. B to Rev. C
Changes to Ordering Guide .......................................................... 20 8/08—Rev. A to Rev. B
Changes to Table 3 ............................................................................ 5 Changes to Figure 36 ...................................................................... 18 Updated Outline Dimensions ....................................................... 19 Changes to Ordering Guide .......................................................... 20 10/06—Rev. 0 to Rev. A
Added ADM3077E and ADM3078E ............................... U niversal Changes to Figure 2 and Figure 3 ................................................... 1 Changes to Figure 5 and Figure 6 ................................................... 9 Changes to Figure 34 and Figure 35 ............................................. 17 Updated Outline Dimensions ....................................................... 19 Changes to Ordering Guide .......................................................... 20 8/06—Revision 0: Initial Version
ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E
Rev. E | Page 3 of 20
The driver outputs of the 250 kbps and 500 kbps devices are slew rate limited to reduce EMI and data errors caused by reflections from improperly terminated buses. Excessive power dissipation caused by bus contention or by output shorting is prevented with a thermal shutdown circuit. The parts are fully specified over the industrial temperature ranges and are available in 8-lead and 14-lead narrow SOIC packages.
Table 1. Selection Table
Part No. Half/Full
Duplex Data Rate (Mbps) Slew Rate Limited Driver/Receiver Enable Low Power Shutdown Nodes on Bus ±15 kV ESD on Bus Pins Pin Count ADM3070E Full 0.25 Yes Yes Yes 256 Yes 14 ADM3071E Full 0.25 Yes No No 256 Yes 8 ADM3072E Half 0.25 Yes Yes Yes 256 Yes 8 ADM3073E Full 0.5 Yes Yes Yes 256 Yes 14 ADM3074E Full 0.5 Yes No No 256 Yes 8 ADM3075E Half 0.5 Yes Yes Yes 256 Yes 8 ADM3076E Full 16 No Yes Yes 256 Yes 14 ADM3077E Full 16 No No No 256 Yes 8 ADM3078E Half
16
No
Yes Yes 256 Yes 8
ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E
SPECIFICATIONS
V CC = 3.3 V ± 10%, T A = T MIN to T MAX, unless otherwise noted.
1 Δ|V OD| and Δ|V OC| are the changes in V OD and V OC, respectively, when the DI input changes state.
Rev. E | Page 4 of 20
ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E
Rev. E | Page 5 of 20
TIMING SPECIFICATIONS—ADM3070E/ADM3071E/ADM3072E
V CC = 3.3 V ± 10%, T A = T MIN to T MAX , unless otherwise noted. Table 3.
Parameter Symbol Min Typ Max Unit Test Conditions/Comments DRIVER Maximum Data Rate 250 kbps Propagation Delay, Low-to-High Level t DPLH 250 1500 ns C L = 50 pF, R L = 54 Ω (see Figure 8 and Figure 9) Propagation Delay, High-to-Low Level t DPHL 250 1500 ns C L = 50 pF, R L = 54 Ω (see Figure 8 and Figure 9) Rise Time/Fall Time t DR /t DF 350 1600 ns C L = 50 pF, R L = 54 Ω (see Figure 8 and Figure 9) |t DPLH ? t DPHL | Differential Driver Output Skew t DSKEW 200 ns C L = 50 pF, R L = 54 Ω (see Figure 8 and Figure 9)1 Enable to Output High t DZH 2500 ns See Figure 10 Enable to Output Low t DZL 2500 ns See Figure 11 Disable Time from Low t DLZ 100 ns See Figure 11 Disable Time from High t DHZ 100 ns See Figure 10 Enable Time from Shutdown to High t DZH(SHDN) 5500 ns See Figure 10 Enable Time from Shutdown to Low t DZL(SHDN) 5500 ns See Figure 11 RECEIVER Maximum Data Rate 250 kbps Propagation Delay, Low-to-High Level t RPLH 200 ns C L = 15 pF (see Figure 12 and Figure 13) Propagation Delay, High-to-Low Level t RPHL 200 ns C L = 15 pF (see Figure 12 and Figure 13) |t RPLH ? t RPHL | Output Skew t RSKEW 30 ns C L = 15 pF (see Figure 12 and Figure 13) Enable to Output High t RZH 50 ns See Figure 14 Enable to Output Low t RZL 50 ns See Figure 14 Disable Time from Low t RLZ 50 ns See Figure 14 Disable Time from High t RHZ 50 ns See Figure 14 Enable Time from Shutdown to High t RZH(SHDN) 4000 ns See Figure 14 Enable Time from Shutdown to Low t RZL(SHDN) 4000 ns See Figure 14 TIME TO SHUTDOWN t SHDN 50 200 600 ns
1
V CC = 3.3 V.
ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E
Rev. E | Page 6 of 20
TIMING SPECIFICATIONS—ADM3073E/ADM3074E/ADM3075E
V CC = 3.3 V ± 10%, T A = T MIN to T MAX , unless otherwise noted. Table 4.
Parameter Symbol Min Typ Max Unit Test Conditions/Comments DRIVER Maximum Data Rate 500 kbps Propagation Delay, Low-to-High Level t DPLH 180 800 ns C L = 50 pF, R L = 54 Ω (see Figure 8 and Figure 9) Propagation Delay, High-to-Low Level t DPHL 180 800 ns C L = 50 pF, R L = 54 Ω (see Figure 8 and Figure 9) Rise Time/Fall Time t DR /t DF 200 800 ns C L = 50 pF, R L = 54 Ω (see Figure 8 and Figure 9) |t DPLH ? t DPHL | Differential Driver Output Skew t DSKEW 100 ns C L = 50 pF, R L = 54 Ω (see Figure 8 and Figure 9) Enable to Output High t DZH 2500 ns See Figure 10 Enable to Output Low t DZL 2500 ns See Figure 11 Disable Time from Low t DLZ 100 ns See Figure 11 Disable Time from High t DHZ 100 ns See Figure 10 Enable Time from Shutdown to High t DZH(SHDN) 4500 ns See Figure 10 Enable Time from Shutdown to Low t DZL(SHDN) 4500 ns See Figure 11 RECEIVER Maximum Data Rate 500 kbps Propagation Delay, Low-to-High Level t RPLH 200 ns C L = 15 pF (see Figure 12 and Figure 13) Propagation Delay, High-to-Low Level t RPHL 200 ns C L = 15 pF (see Figure 12 and Figure 13) |t RPLH ? t RPHL | Output Skew t RSKEW 30 ns C L = 15 pF (see Figure 12 and Figure 13) Enable to Output High t RZH 50 ns See Figure 14 Enable to Output Low t RZL 50 ns See Figure 14 Disable Time from Low t RLZ 50 ns See Figure 14 Disable Time from High t RHZ 50 ns See Figure 14 Enable Time from Shutdown to High t RZH(SHDN) 4000 ns See Figure 14 Enable Time from Shutdown to Low t RZL(SHDN) 4000 ns See Figure 14 TIME TO SHUTDOWN t SHDN 50 200 600 ns
ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E
Rev. E | Page 7 of 20
TIMING SPECIFICATIONS—ADM3076E/ADM3077E/ADM3078E
V CC = 3.3 V ± 10%, T A = T MIN to T MAX , unless otherwise noted. Table 5.
Parameter Symbol Min Typ Max Unit Test Conditions/Comments DRIVER Maximum Data Rate 16 Mbps Propagation Delay, Low-to-High Level t DPLH 50 ns C L = 50 pF, R L = 54 Ω (see Figure 8 and Figure 9) Propagation Delay, High-to-Low Level t DPHL 50 ns C L = 50 pF, R L = 54 Ω (see Figure 8 and Figure 9) Rise Time/Fall Time t DR /t DF 15 ns C L = 50 pF, R L = 54 Ω (see Figure 8 and Figure 9) |t DPLH ? t DPHL | Differential Driver Output Skew t DSKEW 8 ns C L = 50 pF, R L = 54 Ω (see Figure 8 and Figure 9) Enable to Output High t DZH 150 ns See Figure 10 Enable to Output Low t DZL 150 ns See Figure 11 Disable Time from Low t DLZ 100 ns See Figure 11 Disable Time from High t DHZ 100 ns See Figure 10 Enable Time from Shutdown to High t DZH(SHDN) 1250 1800 ns See Figure 10 Enable Time from Shutdown to Low t DZL(SHDN) 1250 1800 ns See Figure 11 RECEIVER Maximum Data Rate 16 Mbps Propagation Delay, Low-to-High Level t RPLH 40 75 ns C L = 15 pF (see Figure 12 and Figure 13) Propagation Delay, High-to-Low Level t RPHL 40 75 ns C L = 15 pF (see Figure 12 and Figure 13) |t RPLH ? t RPHL | Output Skew t RSKEW 8 ns C L = 15 pF (see Figure 12 and Figure 13) Enable to Output High t RZH 50 ns See Figure 14 Enable to Output Low t RZL 50 ns See Figure 14 Disable Time from Low t RLZ 50 ns See Figure 14 Disable Time from High t RHZ 50 ns See Figure 14 Enable Time from Shutdown to High t RZH(SHDN) 1800 ns See Figure 14 Enable Time from Shutdown to Low t RZL(SHDN) 1800 ns See Figure 14 TIME TO SHUTDOWN t SHDN 50 200 600 ns
ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E
Rev. E | Page 8 of 20
ABSOLUTE MAXIMUM RATINGS
T A = 25°C, unless otherwise noted.
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E
Rev. E | Page 9 of 20
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
NC
RO RE DE V CC
NC A B DI Z GND Y GND NC
NC = NO CONNECT
06285-004
V CC RO DI GND
06285-005
RO RE DE DI CC 06285-006
Figure 4. ADM3070E/ADM3073E/ADM3076E
Pin Configuration
Figure 5. ADM3071E/ADM3074E/ADM3077E
Pin Configuration Figure 6. ADM3072E/ADM3075E/ADM3078E
Pin Configuration
ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E
Rev. E | Page 10 of 20
TEST CIRCUITS AND SWITCHING CHARACTERISTICS
06285-007
Figure 7. Driver DC Test Load
06285-008
Figure 8. Driver Timing Test Circuit V CC
0V
DI Z
Y
+V O
–V O
V DIFF t DSKEW = |t DPLH –t DPHL |
0V
06285-009
Figure 9. Driver Propagation Delays OUT
DE
OUT
V CC
0V
V OH
0V
06285-010
Figure 10. Driver Enable and Disable Times (t DHZ , t DZH , t DZH(SHDN)) OUT
V CC
DE
OUT
V CC
V CC 0V
06285-011
Figure 11. Driver Enable and Disable Times (t DZL , t DLZ , t DZL(SHDN))
06285-012
Figure 12. Receiver Propagation Delay Test Circuit
NOTES
1. THE RISE TIME AND FALL TIME OF INPUT A AND INPUT B < 4ns.
A
B
RO
06285-013
Figure 13. Receiver Propagation Delays
ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E
Rev. E | Page 11 of 20
)/2
3V
0V
V CC
V OL
3V
0V
V CC
V OL
3V
0V
V OH
0V
3V
0V
V OH 0V
CC
S1 CLOSED S2 OPEN S1 OPEN S2 CLOSED S1 CLOSED S2 OPEN S1 OPEN S2 CLOSED RE
RO
RE
RO
RE
RO
06285-014
Figure 14. Receiver Enable and Disable Times
ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E
Rev. E | Page 12 of 20
TYPICAL PERFORMANCE CHARACTERISTICS
06285-020
1.20.5–40
TEMPERATURE (°C)S U P P L Y C U R R E N T (m A )
–102050
801.11.00.90.80.70.611006285-023
3.30
3.00
–50
125
TEMPERATURE (°C)
O U T P U T H I G H V O L T A G E (V )
3.25
3.20
3.15
3.10
3.05
–250255075100Figure 15. Supply Current vs. Temperature
Figure 18. Receiver Output High Voltage vs. Temperature
06285-021
03OUTPUT HIGH VOLTAGE (V).506285-024
0.70–50
125
TEMPERATURE (°C)
O U T P U T L O W V O L T A G E (V )
0.6
0.50.40.30.2
0.1–2502550751000.5 1.0 1.5 2.0
2.5
3.0–180
O U T P U T C U R R E N T (m A )
–16
–14
–12–10–8–6–4–2
Figure 16. Output Current vs. Receiver Output High Voltage
Figure 19. Receiver Output Low Voltage vs. Temperature
06285-022
25
003OUTPUT LOW VOLTAGE (V)O U T P U T C U R R E N T (m A )
.506285-025
1000
03DIFFERENTIAL OUTPUT VOLTAGE (V)
O U T P U T C U R R E N T (m A )
0.5 1.0 1.5 2.0
2.5
3.02015
10
5
.5
0.5 1.0 1.5 2.0 2.5
3.090
80
70605040302010
Figure 17. Output Current vs. Receiver Output Low Voltage Figure 20. Driver Output Current vs. Differential Output Voltage
ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E
Rev. E | Page 13 of 20
06285-026
2.6
1.6–50
125
TEMPERATURE (°C)D I F F E R E N T I A L O U T P U T V O L T A G E (V )
–250255075100
2.5
2.4
2.32.22.12.01.91.81.7
Figure 21. Driver Differential Output Voltage vs. Temperature
06285-027
OUTPUT HIGH VOLTAGE (V)
O U T P U T C U R R E N T (m A
)
020406080100120
Figure 22. Output Current vs. Driver Output High Voltage
06285-028
OUTPUT LOW VOLTAGE (V)
O U T P U T C U R R E N T (m A
)
20
40
60
80
100
120
Figure 23. Output Current vs. Driver Output Low Voltage
06285-0290.90–50
125
TEMPERATURE (°C)
S H U T D O W N C U R R E N T (μA )
–250255075
1000.8
0.70.60.50.40.30.20.1
Figure 24. Shutdown Current vs. Temperature
06285-030
TEMPERATURE (°C)
P R O P A G A T I O N D E L A Y (n s )
200
400
600
800
1000
1200
Figure 25. ADM3070E/ADM3071E/ADM3072E Driver Propagation Delay vs. Temperature (250 kbps)
06285-031TEMPERATURE (°C)
P R O P A G A T I O N D E L A Y (n s )
100200300400500600
700
Figure 26. ADM3073E/ADM3074E/ADM3075E Driver Propagation Delay vs. Temperature (500 kbps)
ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E
Rev. E | Page 14 of 20
06285-036
CH3 2.0V 8ns/pt MATH1 2.01V 400ns
M400s 125MS/s A CH2 1.24V
06285-032
35
0–50
125
TEMPERATURE (°C)
P R O P A G A T I O N D E L A Y (n s )
30
252015105–250255075100t DPLH
t DPHL
Figure 30. ADM3073E/ADM3074E/ADM3075E Driver
Propagation Delay (500 kbps)
Figure 27. ADM3076E/ADM3077E/ADM3078E Driver Propagation Delay vs. Temperature (16 Mbps)
06285-037
CH3 2.0V IT 400ps/pt MATH1 1.0V 20ns
M20ns 1.25GS/s A CH3 1.64V
?
06285-033
700–50
125
TEMPERATURE (°C)
P R O P A G A T I O N D E
L A Y (n s )
60
5040302010–250255075100
Figure 31. ADM3076E/ADM3077E/ADM3078E Driver
Propagation Delay (16 Mbps)
Figure 28. Receiver Propagation Delay vs. Temperature
06285-035
CH3 2.0V 4ns/pt MATH1 2.01V 200ns
M200ns 250MS/s A CH2 1.24V
?
06285-034
CH3 2.0V 20ns/pt MATH1 2.01V 1.0μs
M1.0μs 50MS/s A CH2 1.24V
Figure 32. Receiver Propagation Delay
Figure 29. ADM3070E/ADM3071E/ADM3072E Driver
Propagation Delay (250 kbps)
ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E
Rev. E | Page 15 of 20
CIRCUIT DESCRIPTION
The ADM307xE series are high speed transceivers for RS-485 and RS-422 communications. Each device contains one driver and one receiver. All devices feature fail-safe circuitry, which guarantees a logic high receiver output when the receiver inputs are open or shorted or when they are connected to a terminated transmission line with all drivers disabled (see the Receiver Fail-Safe section). The ADM307xE also feature a hot-swap capability, allowing line insertion without erroneous data transfer (see the Hot-Swap Capability section). The ADM3070E/ADM3071E/ ADM3072E feature reduced slew rate drivers that minimize EMI and reduce reflections caused by improperly terminated cables, allowing for error-free data transmission at rates up to 250 kbps.
The ADM3073E/ADM3074E/ADM3075E also offer slew rate limits, allowing transmit speeds up to 500 kbps. The ADM3076E/ ADM3077E/ADM3078E driver slew rates are not limited, making possible transmit speeds of up to 16 Mbps. The ADM3072E/ ADM3075E/ADM3078E are half-duplex transceivers; the ADM3070E/ADM3071E/ADM3073E/ADM3074E/ADM3076E/ ADM3077E are each full-duplex transceivers. All devices operate from a single 3.3 V supply. Drivers are output short-circuit current limited, and thermal shutdown circuitry protects drivers against excessive power dissipation. When activated, the thermal shutdown circuitry places the driver outputs into a high impedance state.
FUNCTION TABLES
ADM3070E/ADM3073E/ADM3076E
1
X = don't care.
2
High-Z = high impedance.
1 X = don't care. 2
High-Z = high impedance. ADM3071E/ADM3074E/ADM3077E
Table 10. Transmitting Truth Table
Transmitting Input Transmitting Outputs DI Y Z 1 1 0 0 0 1
Table 11. Receiving Truth Table
Receiving Input
Receiving Output
A ?
B RO ≥ ?50 mV 1 ≤ ?200 mV 0
Open/shorted 1
ADM3072E/ADM3075E/ADM3078E
1 X = don't care.
2
High-Z = high impedance.
1 X = don't care.
2
High-Z = high impedance.
RECEIVER FAIL-SAFE
The ADM307xE family guarantees a logic high receiver output when the receiver inputs are shorted, open, or connected to a terminated transmission line with all drivers disabled. This is done by setting the receiver input threshold between ?50 mV and ?200 mV . If the differential receiver input voltage (A ? B)
is greater than or equal to ?50 mV , RO is logic high. If A ? B
is less than or equal to ?200 mV , RO is logic low. In the case
of a terminated bus with all transmitters disabled, the receiver
differential input voltage is pulled to 0 V by the termination. With the receiver thresholds of the ADM307xE family, this results in a logic high with a 50 mV minimum noise margin.
ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E
Rev. E | Page 16 of 20
HOT-SWAP CAPABILITY
(ALL EXCEPT ADM3071E/ADM3074E/ADM3077E)
Hot-Swap Inputs
When a circuit board is inserted into a hot (or powered) back-plane, differential disturbances to the data bus can lead to data errors. During this period, processor logic output drivers are high impedance and are unable to drive the DE and RE inputs of the RS-485 transceivers to a defined logic level. Leakage currents up to ±10 μA from the high impedance state of the processor logic drivers can cause standard CMOS enable inputs of a tran-sceiver to drift to an incorrect logic level. Additionally, parasitic circuit board capacitance can cause coupling of V CC or GND to the enable inputs. Without the hot-swap capability, these factors can improperly enable the driver or receiver of the transceiver. When V CC rises, an internal pull-down circuit holds DE low and RE high. After the initial power-up sequence, the pull-down circuit becomes transparent, resetting the hot-swap tolerable input.
LINE LENGTH vs. DATA RATE
The RS-485/RS-422 standard covers line lengths up to 4000 feet. For line lengths greater than 4000 feet, Figure 37 illustrates an example line repeater.
±15 kV ESD PROTECTION
Two coupling methods are used for ESD testing: contact discharge and air-gap discharge. Contact discharge calls for a direct connection to the unit being tested. Air-gap discharge uses a higher test voltage but does not make direct contact with the test unit. With air-gap discharge, the discharge gun is moved toward the unit under test, developing an arc across the air gap, thus the term air-gap discharge. This method is influenced by humidity, temperature, barometric pressure, distance, and rate of closure of the discharge gun. The contact discharge method, while less realistic, is more repeatable and is gaining acceptance and preference over the air-gap method.
Although very little energy is contained within an ESD pulse, the extremely fast rise time, coupled with high voltages, can cause failures in unprotected semiconductors. Catastrophic destruc-tion can occur immediately as a result of arcing or heating. Even if catastrophic failure does not occur immediately, the device can suffer from parametric degradation that can result in degraded performance. The cumulative effects of continuous exposure can eventually lead to complete failure.
Input/output lines are particularly vulnerable to ESD damage. Simply touching or connecting an input/output cable can result in a static discharge that damages or completely destroys the interface product connected to the input/output port. It is extremely important, therefore, to have high levels of ESD protection on the input/output lines.
The ESD discharge can induce latch-up in the device under test, so it is important that ESD testing on the input/output pins be
carried out while device power is applied. This type of testing is more representative of a real-world input/output discharge, which occurs when equipment is operating normally. The transmitter outputs and receiver inputs of the ADM307xE family are characterized for protection to a ±15 kV limit using the human body model.
HUMAN BODY MODEL
Figure 33 shows the human body model and the current waveform it generates when discharged into low impedance. This model consists of a 100 pF capacitor charged to the ESD voltage of interest, which is then discharged into the test device through a 1.5 kΩ resistor.
I
06285-015
Figure 33. Human Body Model and Current Waveform
256 TRANSCEIVERS ON THE BUS
The standard RS-485 receiver input impedance is 12 kΩ (1 unit load), and the standard driver can drive up to 32 unit loads. The ADM307xE family of transceivers has a ? unit load receiver input impedance (96 kΩ), allowing up to 256 transceivers to be connected in parallel on one communication line. Any combi-nation of these devices and other RS-485 transceivers with a total of 32 unit loads or fewer can be connected to the line.
REDUCED EMI AND REFLECTIONS
The ADM3070E/ADM3071E/ADM3072E feature reduced slew rate drivers that minimize EMI and reduce reflections caused by improperly terminated cables, allowing for error- free data transmission at rates up to 250 kbps. The ADM3073E/ ADM3074E/ADM3075E offer higher driver output slew rate limits, allowing for transmit speeds of up to 500 kbps.
ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E
Rev. E | Page 17 of 20
LOW POWER SHUTDOWN MODE
(ALL EXCEPT ADM3071E/ADM3074E/ADM3077E)
Low power shutdown mode is initiated by bringing both RE high and DE low. In shutdown mode, the device draws less than 1 μA of supply current. RE and DE can be driven simulta-neously, but the parts are guaranteed not to enter shutdown if RE is high and DE is low for fewer than 50 ns. If the inputs are in this state for 600 ns or more, the parts are guaranteed to enter shutdown. Enable times t ZH and t ZL assume that the part was not originally in a low power shutdown state (see the section). Enable times (t ZH(SHDN) and t ZL(SHDN)) assume that the part was originally shut down. It takes drivers and receivers longer to become enabled from low power shutdown mode (t ZH(SHDN), t ZL(SHDN)) than from driver/ receiver disable mode (t ZH , t ZL ).
Test Circuits and Switching Characteristics DRIVER OUTPUT PROTECTION
The ADM307xE family features two methods to prevent excessive output current and power dissipation caused by faults or by bus contention. Current limit protection on the output stage provides immediate protection against short circuits over the whole common-mode voltage range (see Figure 22 and Figure 23). In addition, a thermal shutdown circuit forces the driver outputs into a high impedance state if the die temperature rises excessively.
TYPICAL APPLICATIONS
The ADM3072E/ADM3075E/ADM3078E transceivers are designed for bidirectional data communications on multipoint bus transmission lines. Figure 34 shows a typical network
applications circuit. The ADM3071E/ADM3074E/ADM3077E transceivers are designed for point-to-point transmission lines (see Figure 35). The ADM3070E/ADM3073E/ADM3076E transceivers are designed for full-duplex RS-485 networks (see Figure 36).
To minimize reflections, terminate the line at both ends with a termination resistor (the value of the termination resistor should be equal to the characteristic impedance of the cable used) and keep stub lengths off the main line as short as possible.
06285-016
NOTES
1. MAXIMUM NUMBER OF NODES: 256.
2. R T IS EQUAL TO THE CHARACTERISTIC IMPEDANCE OF THE CABLE USED.
Figure 34. ADM3072E/ADM3075E/ADM3078E Typical Half-Duplex RS-485 Network
RO
DI
06285-017
Figure 35. ADM3071E/ADM3074E/ADM3077E Full-Duplex Point-to-Point Applications
ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E
Rev. E | Page 18 of 20
NOTES
1. MAXIMUM NUMBER OF NODES: 256.
2. R T IS EQUAL TO THE CHARACTERISTIC IMPEDANCE OF THE CABLE USED.
RO
DI
DE SLAVE
MASTER
06285-019
RE
Figure 36. ADM3070E/ADM3073E/ADM3076E Full-Duplex RS-485 Network
DATA IN
DATA OUT
NOTES
1. R T IS EQUAL TO THE CHARACTERISTIC IMPEDANCE OF THE CABLE USED.
06285-018
Figure 37. Line Repeater for ADM3070E/ADM3073E/ADM3076E
ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E
Rev. E | Page 19 of 20
OUTLINE DIMENSIONS
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES)ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
COMPLIANT TO JEDEC STANDARDS MS-012-AA
012407-A
0.17 (0.0067)
0.40 (0.0157)
PLANE
0.25 (0.0098)0.10 (0.0040)COPLANARITY
0.10
Figure 38. 8-Lead Standard Small Outline Package [SOIC_N]
Narrow Body
(R-8)
Dimensions shown in millimeters and (inches)
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES)ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
COMPLIANT TO JEDEC STANDARDS MS-012-AB
060606-A
BSC
0.31 (0.0122)
Figure 39. 14-Lead Standard Small Outline Package [SOIC_N]
Narrow Body (R-14)
Dimensions shown in millimeters and (inches)
ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E
Rev. E | Page 20 of 20
ORDERING GUIDE
Model
Temperature
Range Package Description Package
Option Ordering Quantity ADM3070EARZ 1
?40°C to +85°C 14-Lead Standard Small Outline Package (SOIC_N) R-14
ADM3070EARZ-REEL71 ?40°C to +85°C 14-Lead Standard Small Outline Package (SOIC_N) R-14 1,000 ADM3070EYRZ 1
?40°C to +125°C 14-Lead Standard Small Outline Package (SOIC_N) R-14
ADM3070EYRZ-REEL71 ?40°C to +125°C 14-Lead Standard Small Outline Package (SOIC_N) R-14 1,000 ADM3071EARZ 1
?40°C to +85°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
ADM3071EARZ-REEL71 ?40°C to +85°C 8-Lead Standard Small Outline Package (SOIC_N) R-8 1,000 ADM3071EYRZ 1
?40°C to +125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
ADM3071EYRZ-REEL71 ?40°C to +125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8 1,000 ADM3072EARZ 1
?40°C to +85°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
ADM3072EARZ-REEL71 ?40°C to +85°C 8-Lead Standard Small Outline Package (SOIC_N) R-8 1,000 ADM3072EYRZ 1
?40°C to +125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
ADM3072EYRZ-REEL71 ?40°C to +125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8 1,000 ADM3073EARZ 1
?40°C to +85°C 14-Lead Standard Small Outline Package (SOIC_N) R-14
ADM3073EARZ-REEL71 ?40°C to +85°C 14-Lead Standard Small Outline Package (SOIC_N) R-14 1,000 ADM3073EYRZ 1
?40°C to +125°C 14-Lead Standard Small Outline Package (SOIC_N) R-14
ADM3073EYRZ-REEL71 ?40°C to +125°C 14-Lead Standard Small Outline Package (SOIC_N) R-14 1,000 ADM3074EARZ 1
?40°C to +85°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
ADM3074EARZ-REEL71 ?40°C to +85°C 8-Lead Standard Small Outline Package (SOIC_N) R-8 1,000 ADM3074EYRZ 1
?40°C to +125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
ADM3074EYRZ-REEL71 ?40°C to +125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8 1,000 ADM3075EARZ 1
?40°C to +85°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
ADM3075EARZ-REEL71 ?40°C to +85°C 8-Lead Standard Small Outline Package (SOIC_N) R-8 1,000 ADM3075EWYRZ 1 ?40°C to +125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
ADM3075EWYRZ-RL71 ?40°C to +125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8 1,000 ADM3075EYRZ 1
?40°C to +125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
ADM3075EYRZ-REEL71 ?40°C to +125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8 1,000 ADM3076EARZ 1
?40°C to +85°C 14-Lead Standard Small Outline Package (SOIC_N) R-14
ADM3076EARZ-REEL71 ?40°C to +85°C 14-Lead Standard Small Outline Package (SOIC_N) R-14 1,000 ADM3076EYRZ 1
?40°C to +125°C 14-Lead Standard Small Outline Package (SOIC_N) R-14
ADM3076EYRZ-REEL71 ?40°C to +125°C 14-Lead Standard Small Outline Package (SOIC_N) R-14 1,000 ADM3077EARZ 1
?40°C to +85°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
ADM3077EARZ-REEL71 ?40°C to +85°C 8-Lead Standard Small Outline Package (SOIC_N) R-8 1,000 ADM3077EYRZ 1
?40°C to +125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
ADM3077EYRZ-REEL71 ?40°C to +125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8 1,000 ADM3078EARZ 1
?40°C to +85°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
ADM3078EARZ-REEL71 ?40°C to +85°C 8-Lead Standard Small Outline Package (SOIC_N) R-8 1,000 ADM3078EYRZ 1
?40°C to +125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
ADM3078EYRZ-REEL71
?40°C to +125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8 1,000
1
Z = RoHS Compliant Part.
?2006–2009 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D06285-0-8/09(E)