EMIF08-VID01F2;中文规格书,Datasheet资料

Rev 2August 2005

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EMIF08-VID01F2

8 line low capacitance EMI filter

and ESD protection

Main product characteristics

Where EMI filtering in ESD sensitive equipment is required :

■LCD & camera for mobile phones ■Computers and printers ■Communication systems ■

MCU Boards

Description

The EMIF08-VID01F2 is an 8 line highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The flip chip packaging means the package size is equal to the die size.

This filter includes ESD protection circuitry, which prevents damage to the application when it is subjected to ESD surges up to 15kV .

Benefits

■High efficiency EMI filter (-33 dB @ 900 Mhz)■Low line capacitance suitable for high speed

data bus

■Low serial resistance for camera impedance adaptation

■Optimized PCB space consuming: 1.29 mm x 3.92 mm

■Very thin package: 0.65 mm ■Lead free pacakge

■High efficiency in ESD suppression on inputs pins (IEC61000-4-2 level 4).

■High reliability offered by monolithic integration ■

High reducing of parasitic elements through integration & wafer level packaging.

Complies with following standards:

IEC61000-4-2MIL STD 883E - Method 3015-6 Class 3

level 4 input pins 15 kV (air discharge)8 kV (contact discharge level 1 output pins

2 kV (air discharge)2 kV

(contact discharge

Lead free flip chip package

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1 Electrical characteristics (T amb = 25°C)

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1

Electrical characteristics (T amb = 25°C)

Table 1.

Absolute ratings (limiting values)

Symbol Parameter

Value Unit Vpp ESD discharge IEC61000-4-2 air discharge

ESD discharge IEC61000-4-2 contact discharge 158kV KV Tj Maximum junction temperature 125°C T op Operating temperature range -40 to +85°C T stg

Storage temperature range

-55 to +150

°C

Symbol Test conditions

Min Typ Max Unit V BR I R = 1mA 6

8

10V I RM V RM = 3V per line 500nA R I/O I=10mA

80

100120?C line

V R = 3V DC, 1 MHz

16

19

pF

EMIF08-VID01F2

1 Electrical characteristics (T amb = 25°C)

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Figure 4.

ESD response to IEC61000-4-2 (+15kV air discharge) on one input V

in and one output V

out

Figure 5.

ESD response to IEC61000-4-2 (-15kV air discharge) on one input V in and one output V out

Figure 6.

Line capacitance versus applied

Input 10V/d

Output 10V/d

200ns/d 200ns/d

Output 10V/d

Input 10V/d

2 Ordering information scheme

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2 Ordering information scheme

3 Package mechanical data flip chip

Figure 7.Marking

Figure 8.Foot print recommendation

EMIF08-VID01F2

4 Ordering information

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4 Ordering information

5 Revision history

Ordering code Marking Package Weight Base qty Delivery mode EMIF08-VID01F2

GS

Flip Chip

6.8 mg

5000

7” Tape and reel

Date Revision

Changes

13-Jul-20051Initial release.

11-Aug-2005

2

Fonts changed in Figures 7, 8, and 9

5 Revision history EMIF08-VID01F2 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences

of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not

authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.

The ST logo is a registered trademark of STMicroelectronics.

All other names are the property of their respective owners

? 2005 STMicroelectronics - All rights reserved

STMicroelectronics group of companies

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EMIF08-VID01F2