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CSPEMI400G中文资料

SIM Card EMI Filter Array with ESD Protection

Features

?Three channels of EMI filtering, each with ESD protection

?Two additional channels of ESD-only protection ?±10kV ESD protection (IEC 61000-4-2, contact discharge)

?±25kV ESD protection (HBM)

?Greater than 30dB of attenuation at 1GHz ?10-bump, 1.960mm x 1.330mm footprint Chip Scale Package (CSP)

Lead-free version available

Applications

?SIM Card slot in mobile handsets

?I/O port protection for mobile handsets, notebook computers, PDAs, etc.

EMI filtering for data ports in cell phones, PDAs or notebook computers

Product Description

CAMD's CSPEMI400 is an EMI filter array with ESD protection, which integrates three pi filters (C-R-C) and two additional channels of ESD protection. The CSPEMI400 has component values of 20pF-47Ω-20pF, and 20pF-100Ω-20pF. The parts include ava-lanche-type ESD diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic dis-charge (ESD). The ESD diodes connected to the filter ports safely dissipate ESD strikes of ±10kV, exceeding the maximum requirement of the IEC 61000-4-2 inter-national standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM)ESD, the pins are protected for contact discharges at greater than ±25kV.

The ESD diodes on pins A4 and C4 ports are designed and characterized to safely dissipate ESD strikes of ±10kV, well beyond the maximum requirement of the IEC 61000-4-2 international standard.

This device is particularly well suited for portable elec-tronics (e.g. mobile handsets, PDAs, notebook com-puters) because of its small package format and easy-to-use pin assignments. In particular, the CSPEMI400is ideal for EMI filtering and protecting data lines from ESD for the SIM card slot in mobile handsets. The CSPEMI400 is available in a space-saving, low-profile Chip Scale Package with optional lead-free fin-ishing.

Electrical Schematic

R 1

B2,B4

GND

R 2

C C2

R 1

R 1=100ΩR 2=47Ω

Ordering Information

Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.

Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.

PIN DESCRIPTIONS

TYPE PIN DESCRIPTION

EMI Filter A1EMI Filter with ESD Protection for RST Signal C1EMI Filter with ESD Protection for RST Signal EMI Filter A2EMI Filter with ESD Protection for CLK Signal C2EMI Filter with ESD Protection for CLK Signal Device Ground B1Device Ground B2Device Ground

EMI Filter A3DAT EMI Filter with ESD Protection C3DAT EMI Filter with ESD Protection ESD Channel A4ESD Proection Channel - V CC Supply ESD Channel

ESD Proection Channel

PART NUMBERING INFORMATION

Bumps Package Standard Finish

Lead-free Finish 2

Ordering Part Number 1Part Marking

CSP

CSPEMI400

CSPEMI400G

Specifications

Note 1:T A =25°C unless otherwise specified.

Note 2:ESD applied to input and output pins with respect to GND, one at a time.

Note 3:Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1,

then clamping voltage is measured at Pin C1.

Note 4:Unused pins are left open

Note 5:The parameters are guaranteed by design.

ABSOLUTE MAXIMUM RATINGS

PARAMETER

RATING UNITS Storage Temperature Range -65 to +150

°C DC Power per Resistor 100mW DC Package Power Rating

300

STANDARD OPERATING CONDITIONS

PARAMETER

RATING UNITS Operating Temperature Range

-40 to +85

°C

ELECTRICAL OPERATING CHARACTERISTICS 1

SYMBOL

PARAMETER CONDITIONS

MIN TYP MAX UNITS R 1Resistance of R 180100120ΩR 2Resistance of R 2384756ΩC Capacitance V IN = 2.5VDC, 1MHz, 30mV ac 16

2024

pF V STANDOFF

Stand-off Voltage I = 10μA 6.0

V I LEAK Diode Leakage Current V BIAS = 3.3V 300nA V SIG

Signal Voltage

Positive Clamp Negative Clamp

I LOAD = 10mA I LOAD = -10mA 5.6-1.5

6.8-0.8

9.0-0.4V V

V ESD

In-system ESD Withstand Voltage

a) Human Body Model, MIL-STD-883, Method 3015

b) Contact Discharge per IEC 61000-4-2 Notes 2,4 and 5

±25±10

kV kV

V CL

Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV

Positive Transients Negative Transients Notes 2,3,4 and 5

+12-7

V V f C1Cut-off frequency

Z SOURCE = 50Ω, Z LOAD = 50ΩR = 100Ω, C = 20pF 77MHz f C2

Cut-off frequency

Z SOURCE = 50Ω, Z LOAD = 50Ω

R = 47Ω, C = 20pF

MHz

Performance Information

Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)

Figure 1. A1-C1 EMI Filter Performance

Figure 2. A2-C2 EMI Filter Performance

Performance Information (cont’d)

Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)

Figure 3. A3-C3 EMI Filter Performance

Figure 4. Typical Diode Capacitance vs. Input Voltage (normalized to 2.5VDC)

Application Information

The CSPEMI400 provides a bidirectional filter and protec-tor for all the signals and the power line on the SIM (sub-scriber identity module) card connector. SIM cards are found in all GSM cellular phones and in some other hand-held devices or card readers. The ESD diodes protect the controller against possible ESD strikes that may occur when the connector pins are exposed during direct con-tact, or during insertion of the SIM card into the card slot. The EMI filter suppresses all high-frequency noise, pre-venting the unwanted EMI signals from both entering and exiting the main board. The signals that interface with the SIM card are the Reset, the Clock and the bidirectional data I/O, as shown in Figure5.

Figure 5. Typical Application Diagram for the SIM Card Interface

For best filter and ESD performance, both GND bumps (B1, B2) of the CSPEMI400 should be directly con-nected to the Ground plane. A small capacitor of about 1μF is required next to the V CC pin of the SIM connec-tor in order to improve stability of the SIM card supply rail.For information on the assembly of the CSPEMI400 to the PCB (printed circuit board), please refer to the Chip Scale Package (CSP) Application Note AP217, or con-tact factory at 800-325-4966 for technical support.

Application Information (cont’d)

Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices.

Figure 6. Recommended Non-Solder Mask Defined Pad Illustration

Figure 7. Eutectic (SnPb) Solder

Ball Reflow Profile

Figure 8. Lead-free (SnAgCu) Solder

Ball Reflow Profile

PRINTED CIRCUIT BOARD RECOMMENDATIONS

PARAMETER VALUE Pad Size on PCB 0.275mm Round

Pad Definition Non-Solder Mask defined pads

Solder Mask Opening 0.325mm Round Solder Stencil Thickness

0.125 - 0.150mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls)0.330mm Round Solder Flux Ratio 50/50 by volume

Solder Paste Type No Clean

Pad Protective Finish

OSP (Entek Cu Plus 106A)

Tolerance — Edge To Corner Ball +50μm Solder Ball Side Coplanarity

+20μm Maximum Dwell Time Above Liquidous

60 seconds Maximum Soldering Temperature for Eutectic Devices using Eutectic Solder Paste 240°C Maximum Soldering Temperature for Lead-free Devices using Lead-free Solder Paste

260°C

Solder Mask Opening

0.325mm DIA.

Non-Solder Mask Defined Pad

0.275mm DIA.

Solder Stencil Opening

0.330mm DIA.

CSP Mechanical Specifications

The CSPEMI400 is supplied in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on CSP, see the California Micro Devices CSP Package Information document.

Package Dimensions for CSPEMI400

Chip Scale Package

CSP Tape and Reel Specifications

Figure 9. Tape and Reel Mechanical Data

PACKAGE DIMENSIONS

Package Custom CSP

Bumps 10

Dim Millimeters Inches Min Nom Max

Min Nom

Max

A1 1.915 1.960 2.0050.07540.07720.0789A2 1.285 1.330 1.3750.05060.05240.0541B10.4950.5000.5050.01950.01970.0199B20.2450.2500.2550.00960.00980.0100B30.4300.4350.4400.01690.01710.0173B40.4300.4350.4400.01690.01710.0173C10.1800.2300.2800.00710.00910.0110C20.1800.2300.2800.0071

0.091

0.0110

D10.5620.6060.6500.02210.02390.0256D2

0.356

0.381

0.4060.01400.01500.0160

# per tape and

reel

3500 pieces

Controlling dimension: millimeters

Mechanical Package Diagrams

B C 1

A1B3

DIMENSIONS IN MILLIMETERS

D1D2

BOTTOM VIEW

SIDE VIEW

B2B43

0.30 DIA.

63/37 Sn/Pb (Eutectic) or

SOLDER BUMPS

96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)PART NUMBER CHIP SIZE (mm)POCKET SIZE (mm)

B 0 X A 0 X K 0TAPE WIDTH

REEL DIAMETER QTY PER REEL P 0P 1CSPEMI400

1.96 X 1.33 X 0.606

2.08 X 1.45 X 0.71

8mm

178mm (7")

3500

4mm

Top For tape feeder reference Cover Tape

P 1

only including draft.Concentric around B.

K o

Embossment

User direction of feed

±0.2 mm

P o

Center lines of cavity

10 Pitches cumulative tolerance on tape A o

B o