ULN2003ADRG4中文资料
PACKAGING INFORMATION
Orderable
Device Status (1)Package Type Package Drawing
Pins Package Qty Eco Plan (2)
Lead/Ball Finish
MSL Peak Temp (3)ULN2001AD OBSOLETE SOIC D 16TBD Call TI Call TI ULN2001ADR OBSOLETE SOIC D 16TBD Call TI Call TI ULN2001AN OBSOLETE PDIP N 16TBD Call TI Call TI ULN2002AD OBSOLETE SOIC D 16TBD Call TI Call TI
ULN2002AN ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type ULN2002ANE4ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type ULN2003AD ACTIVE SOIC D 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM ULN2003ADE4ACTIVE SOIC D 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM ULN2003ADG4ACTIVE SOIC D 1640
Green (RoHS &no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM ULN2003ADR ACTIVE SOIC D 162500Green (RoHS &
no Sb/Br)CU NIPDAU Level-1-260C-UNLIM ULN2003ADRE4ACTIVE SOIC D 162500Green (RoHS &
no Sb/Br)CU NIPDAU Level-1-260C-UNLIM ULN2003ADRG4ACTIVE SOIC D 162500Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM ULN2003AJ OBSOLETE CDIP J 16TBD Call TI Call TI
ULN2003AN ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type ULN2003ANE4ACTIVE PDIP N 1625Pb-Free (RoHS)
CU NIPDAU N /A for Pkg Type ULN2003ANSR ACTIVE SO NS 162000Green (RoHS &
no Sb/Br)CU NIPDAU Level-1-260C-UNLIM ULN2003ANSRE4ACTIVE SO NS 162000Green (RoHS &
no Sb/Br)CU NIPDAU Level-1-260C-UNLIM ULN2003ANSRG4ACTIVE SO NS 162000Green (RoHS &
no Sb/Br)CU NIPDAU Level-1-260C-UNLIM ULN2003APW ACTIVE TSSOP PW 1690Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM ULN2003APWE4ACTIVE TSSOP PW 1690Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM ULN2003APWG4ACTIVE TSSOP PW 1690
Green (RoHS &no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM ULN2003APWR ACTIVE TSSOP PW 162000Green (RoHS &
no Sb/Br)CU NIPDAU Level-1-260C-UNLIM ULN2003APWRE4ACTIVE TSSOP PW 162000Green (RoHS &
no Sb/Br)CU NIPDAU Level-1-260C-UNLIM ULN2003APWRG4ACTIVE TSSOP PW 162000Green (RoHS &
no Sb/Br)CU NIPDAU Level-1-260C-UNLIM ULN2004AD ACTIVE SOIC D 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM ULN2004ADE4ACTIVE SOIC D 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM ULN2004ADG4
ACTIVE
SOIC
D
16
40
Green (RoHS &no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
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Orderable Device Status (1)Package Type Package Drawing
Pins Package Qty Eco Plan (2)
Lead/Ball Finish MSL Peak Temp (3)ULN2004ADR ACTIVE SOIC D 162500Green (RoHS &
no Sb/Br)CU NIPDAU Level-1-260C-UNLIM ULN2004ADRE4ACTIVE SOIC D 162500Green (RoHS &
no Sb/Br)CU NIPDAU Level-1-260C-UNLIM ULN2004ADRG4ACTIVE SOIC D 162500Green (RoHS &
no Sb/Br)CU NIPDAU Level-1-260C-UNLIM ULN2004AN ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type ULN2004ANE4ACTIVE PDIP N 1625
Pb-Free (RoHS)
CU NIPDAU N /A for Pkg Type ULN2004ANSR ACTIVE SO NS 162000Green (RoHS &
no Sb/Br)CU NIPDAU Level-1-260C-UNLIM ULN2004ANSRG4ACTIVE SO NS 162000Green (RoHS &
no Sb/Br)CU NIPDAU Level-1-260C-UNLIM ULQ2003AD NRND SOIC D 1640Pb-Free (RoHS)CU NIPDAU Level-2-250C-1YEAR/Level-1-235C-UNLIM ULQ2003ADG4ACTIVE SOIC D 1640Green (RoHS &no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM ULQ2003ADR NRND SOIC D 162500
Pb-Free (RoHS)
CU NIPDAU Level-2-250C-1YEAR/Level-1-235C-UNLIM ULQ2003ADRG4ACTIVE SOIC
D 162500Green (RoHS &
no Sb/Br)CU NIPDAU Level-1-260C-UNLIM ULQ2003AN ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type ULQ2004AD NRND SOIC D 1640Pb-Free (RoHS)CU NIPDAU Level-2-250C-1YEAR/Level-1-235C-UNLIM ULQ2004ADG4ACTIVE SOIC D 1640Green (RoHS &no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM ULQ2004ADR NRND SOIC D 162500
Pb-Free (RoHS)
CU NIPDAU Level-2-250C-1YEAR/Level-1-235C-UNLIM ULQ2004ADRG4ACTIVE SOIC D 162500Green (RoHS &
no Sb/Br)CU NIPDAU Level-1-260C-UNLIM ULQ2004AN
ACTIVE
PDIP
N
16
25
Pb-Free (RoHS)
CU NIPDAU
N /A for Pkg Type
(1)
The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.
LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.
NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.
PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.
(2)
Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check https://www.wendangku.net/doc/955033442.html,/productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.
Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)
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(3)
MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual
basis.
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TAPE AND REEL BOX
INFORMATION
Device
Package Pins Site
Reel Diameter (mm)Reel Width (mm)A0(mm)B0(mm)K0(mm)
P1(mm)W (mm)Pin1Quadrant ULN2003ADR D 16SITE 2733016 6.510.3 2.1816Q1ULN2003ADR D 16SITE 4133016 6.510.3 2.1816Q1ULN2003ANSR NS 16SITE 41330168.210.5 2.51216Q1ULN2003APWR PW 16SITE 41330127.0 5.6 1.6812Q1ULN2004ADR D 16SITE 2733016 6.510.3 2.1816Q1ULN2004ADR D 16SITE 4133016 6.510.3 2.1816Q1ULN2004ANSR
NS
16
SITE 41
330
16
8.2
10.5
2.5
12
16
Q1
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22-Sep-2007
Device
Package
Pins Site Length (mm)
Width (mm)Height (mm)
ULN2003ADR D 16SITE 27342.9336.60.0ULN2003ADR D 16SITE 41346.0346.00.0ULN2003ANSR NS 16SITE 41346.0346.00.0ULN2003APWR PW 16SITE 41346.0346.00.0ULN2004ADR D 16SITE 27342.9336.60.0ULN2004ADR D 16SITE 41346.0346.00.0ULN2004ANSR
NS
16
SITE 41
346.0
346.0
0.0
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