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APDS-9008-020中文资料

APDS-9008

Miniature Surface-Mount Ambient Light Photo Sensor Data Sheet

Description

The APDS-9008 is a low cost analog-output ambient light photo sensor in miniature chipLED lead-free surface mount package. It consists of a spectrally suited photo sensor, which provides excellent responsivity that is close to the response of the human eyes, as show in figure 2. The APDS-9008 is ideal for applications in which the mea-surement of ambient light is used to control display back-lighting. Mobile appliances such as the mobile phones and PDAs that draw heavy current from display backlight-ing will benefit from incorporating these photo sensor products in their designs by reducing power consump-tion significantly.

Application Support Information

The Application Engineering Group is available to as-sist you with the application design associated with APDS-9008 ambient light photo sensor module. You can contact them through your local sales representatives for additional details.Features

? Excellent responsivity

- Close responsivity to the human eye

? Miniature ChipLED Leadfree surface-mount package Height – 0.55 mm

Width – 1.60 mm

Depth – 1.50 mm

? Low sensitivity variation across various light sources ? Operating temperature : -40°C to 85°C

? Vcc supply 1.6 to 5.5V

? Lead-free package, RoHS compliance

? Output linearity across wide illumination range

? High output saturation voltage

Applications

? Detection of ambient light to control display backlighting

Mobile devices – Mobile phones, PDAs

Computing devices – Notebooks, Webpads

Consumer devices – TVs, Video Cameras, Digital

Still Camera

? Automatic Residential and Commercial Lighting Management

Electronic Signs and Signals

Ordering Information

Part Number

Packaging Type

Package

Quantity

APDS-9008-020

Tape and Reel

6-pins Chipled package

2500

I/O Pins Configuration Table

Symbol

Description

VCC VCC 2NC No Connect 3NC No Connect 4GND Ground 5

NC No Connect 6

Iout

Out

VCC [1]

LOAD

Typical Application Circuit

Absolute Maximum Ratings

For implementations where case to ambient thermal resistance is ≤ 50 °C /W Parameter

Symbol

Min.

Max.

Units

Storage Temperature T S -4085°C Supply Voltage

V CC

Recommended Operating Conditions

Parameter

Symbol

Min.

Max.

Units

Conditions

Operating Temperature T A -4085°C Supply Voltage

V CC

1.6

5.5

CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD.

Figure 1. Typical application circuit for APDS-9008

Electrical & Optical Specifications (Ta=25°C)

Parameter

Symbol

Min.

Typ.

Max.

Units

Conditions

Supply Current ICC 42μA Vcc =1.8V, Lux = 100 (2)Photo Current (I)I_PH128

4052

μA Vcc =1.8V, Lux = 100 (2)Photo Current (II)I_PH244μA Vcc =1.8V, Lux = 100 (1)Dark Current I_DARK 300nA Vcc =1.8V, Lux = 0

Light Current Ratio I_PH2/I_PH1 1.1Incandescent light / Fluorescent light Rise Time Tr 5ms Rl = 1Kohm, Lux = 100Fall Time Tf 5ms R1 = 1Kohm, Lux=100Settling Time

T set 10ms R1=2.4Kohm,Lux=100Peak sensitivity wavelength λ565nm Propagation delay Td 5ms Rl = 1Kohm, Lux = 100Storage delay Ts 5

ms R1 = 1Kohm, Lux=100

Saturation voltage

Vsat

1.5

R1 = 100Kohm, Lux = 100, Vcc=1.8V

Notes :

1. Illuminance by CIE standard light source (Incandescent lamp)

2. Fluorescence light is used as light source, however, white LED is substituted in a mass production process.

Light Measurement Circuit and Waveforms

Tset

Vcc

Vout

Tset

Temperature in Degrees

R E L A V G -I C C 0.0

0.10.20.30.40.50.60.70.80.91.0-90

-70

-50

-30

-10103050

Angle in Degrees

R e l a t i v e I o u t r e s p o n s e

VCC

0.000.200.400.600.801.001.201.40-40

-20

20406080

100

Temperature in Degrees

R e l a t i v e I o u t

000.0E+0

50.0E-6

100.0E-6150.0E-6200.0E-6250.0E-6300.0E-6350.0E-6400.0E-6450.0E-60

1002003004005006007008009001000

LUX

O u t p u t C u r r e n t [A ]

00.20.40.60.81Wavelength in nm

R e l a t i v e r e s p o n s e

Figure 2. Relative Spectral Response Vs Wavelength Figure 3. Average Iout Vs Lux (Vcc=1.8v, T=25°C, White LED source)

Figure 4. Relative Iout Vs Temp (Vcc=1.8v, 100 Lux)

Figure 5. Relative Iout Vs Vcc (T=25°C, 100 Lux)

Figure 6. Relative Iout Vs Angle ( Vcc=1.8V, T=25°C)

Figure 7. Relative Average Icc Vs Temp ( Vcc=1.8V, T=25°C, 100 Lux)

0.0

0.40.81.21.62.0LUX

V o u t (V )

0.00E+00

2.00E-07

4.00E-076.00E-078.00E-071.00E-061.20E-061.40E-06-40

-200

20406080100

Temp in Degrees

I D a r k 0.500.600.700.800.901.001.101.201.8

2.3

2.8

3.3 3.8

4.3

4.8

5.3

VCC

R e l I C C

Figure 8. Relative average Icc Vs Vcc (T=25°C, 100 Lux)Figure 9. Dark Current Vs Temp (Vcc=1.8V)

Figure 10. General Luminance Vs Typical Output Voltage (Vcc=1.8V, T=25°C, Light Source = White LED)

APDS-9008 Package Outline

APDS-9008 Tape and Reel Dimension

Moisture Proof Packaging

All APDS-9008 options are shipped in moisture proof package. Once opened, moisture absorption begins. This part is compliant to JEDEC Level 3.

Baking Conditions:

Package Temperature Time

In Reel60°C48 hours

In Bulk100°C 6 hours

* Baking should only be done once.Recommended Storage Conditions:

Storage Temperature100°C to 300°C

Relative Humidity below 60% RH

Time from unsealing to soldering:

After removal from the bag, the parts should be soldered within 168 hours if stored at the recommended storage conditions. If times longer than 168 hours are needed, the parts must be stored in a dry box.

t-TIME (SECONDS)

80120150180200230255T - T E M P E R A T U R E (°C )217P1HEAT UP

SOLDER PASTE DRY

P3SOLDER REFLOW

P4COOL DOWN

Recommended Reflow Profile

The reflow profile is a straight-line representation of a nominal temperature profile for a convective reflow sol-der process. The temperature profile is divided into four process zones, each with different ?T/?time temperature change rates or duration. The ?T/?time rates or duration are detailed in the above table. The temperatures are measured at the component to printed circuit board con-nections.

Process zone P1, the PC board and component pins are

heated to a temperature of 150°C to activate the flux in the solder paste. The temperature ramp up rate, R1, is lim-ited to 3°C per second to allow for even heating of both the PC board and component pins.

Process zone P2 should be of sufficient time duration (100

to 180 seconds) to dry the solder paste. The temperature is raised to a level just below the liquidus point of the sol-der.

Process zone P3 is the solder reflow zone. In zone P3, the

temperature is quickly raised above the liquidus point of

solder to 260°C (500°F) for optimum results. The dwell time above the liquidus point of solder should be between 60 and 120 seconds. This is to assure proper coalescing of the solder paste into liquid solder and the formation of good solder connections. Beyond the recommended dwell time the intermetallic growth within the solder connections becomes excessive, resulting in the formation of weak and unreliable connections. The temperature is then rap-idly reduced to a point below the solidus temperature of the solder to allow the solder within the connections to freeze solid.

Process zone P4 is the cool down after solder freeze. The

cool down rate, R5, from the liquidus point of the solder to 25°C (77°F) should not exceed 6°C per second maxi-mum. This limitation is necessary to allow the PC board and component pins to change dimensions evenly, put-ting minimal stresses on the component.

It is recommended to perform reflow soldering no more than twice.

Process Zone

Symbol

Maximum ?T/?time or Duration

Heat Up P1, R125°C to 150°C 3°C/s Solder Paste Dry P2, R2150°C to 200°C 100s to 180s Solder Reflow P3, R3P3, R4200°C to 260°C 260°C to 200°C 3°C/s -6°C/s Cool Down P4, R5

200°C to 25°C -6°C/s Time maintained above liquidus point , 217°C > 217°C 60s to 120s Peak Temperature

260°C -Time within 5°C of actual Peak Temperature >255°C 20s to 40s Time 25°C to Peak Temperature

25°C to 260°C

8mins

Appendix A. SMT Assembly Application Note 1.0 Solder Pad, Mask and Metal Stencil Aperture

Figure A1. Stencil and PCBA

1.1 Recommended Land Pattern Figure A

2. Recommended Land Pattern Metal Stencil For Solder Paste

Mask Land Pattern

PCBA

1.2 Recommended Metal Solder Stencil Aperture

It is recommended that a 0.11 mm (0.004 inches) thick

stencil be used for solder paste printing. Aperture open-

ing for shield pad is 0.4mm x 0.4mm and 0.2mm x 0.4mm

(as per land pattern). This is to ensure adequate printed

solder paste volume and no shorting.

Figure A3. Solder Stencil Aperture

1.3 Adjacent Land Keepout and Solder Mask Areas

Adjacent land keep-out is the maximum space occupied

by the unit relative to the land pattern. There should be no

other SMD components within this area.

The minimum solder resist strip width required to avoid

solder bridging adjacent pads is 0.2 mm.

Note: Wet/Liquid Photo-Imageable solder resist/mask is

recommended.

Figure A4. Adjacent Land Keepout and Solder Mask Areas

0.2 MIN.

Top View

Light Receving Area

Table 1 and Figure B3 below show the recommended dimensions of the window. These dimension values are based on a window thickness of 1.0mm with a refractive index 1.585.

Figure B3. Recommended Window Dimensions

WD: Working Distance between window front panel & APDS-9008D1: Window Diameter T:

Thickness

L: Length of Light Pipe D2: Light Pipe Diameter

Z: Distance between window rear panel and

APDS-9008

Table 1. Recommended dimension for optical window

All dimensions are in mm

WD (T+L+Z)

Flat Window (L=0.0)Flat window with Light Pipe (D2=1.5; Z =0.5)Z

1.50.5

2.25--2.0 1.0

3.25--2.5 1.5

4.25--3.0

2.0

5.00

2.5

1.5

The window should be placed directly on top of the photo sensor to achieve better performance and if a flat window with a light pipe is used, dimension D2 should be 1.5mm to optimize the performance of APDS-9008.

Flat

Appendix B. Optical Window Design for APDS-9008

1.0 Optical Window Dimensions

To ensure that the performance of the APDS-9008 will not be affected by improper window design, there are some constraints on the dimensions and design of the window. There is a constraint on the minimum size of the window, which is placed in front of the photo light sensor, so that it will not affect the angular response of the APDS-9008. This minimum dimension that is recommended will en-sure at least a ±35° light reception cone.

If a smaller window is required, a light pipe or light guide can be used. A light pipe or light guide is a cylindrical piece of transparent plastic, which makes use of total in-ternal reflection to focus the light.

The thickness of the window should be kept as minimum as possible because there is a loss of power in every optical window of about 8% due to reflection (4% on each side) and an additional loss of energy in the plastic material.Figure B1 and B2 illustrate the two types of window that we have recommended which could either be a flat win-dow or a flat window with light pipe.

Figure B1. Window Size Determination for Flat Window

Figure B2. Window Design of Flat Window with Light Guide

2.1 Optical Window Material

The material of the window is recommended to be poly-carbonate. The surface finish of the plastic should be smooth, without any texture.

The recommended plastic material for use as a window is available from Bayer AG and Bayer Antwerp N. V. (Europe), Bayer Corp.(USA) and Bayer Polymers Co., Ltd. (Thailand), as shown in Table 2.

Table 2. Recommended Plastic Materials

Material number Visible light

transmission Refractive index

Makrolon LQ264787% 1.587

Makrolon LQ314787% 1.587

Makrolon LQ318785% 1.587

Appendix C . General Application Guide for APDS-9008 The APDS-9008 is a low cost analog-output ambient light photo sensor whose spectral response closely emulates the human eyes. APDS-9008 consists of a photo sen-sor that is able to produce a high gain photo current to a sufficient level that can be converted to voltage with a standard value of external resistor. APDS-9008 can easily be integrated into systems that use ADC input which is available for sampling of the external source, as shown in figure C1 below.

The amount of converted voltage, Vout, is mainly depen-dant proportionally on the photo current which generated by the brightness of the light shone on the photo sensor and the load resistor used, RL. Increasing the brightness of the light or/and the load resistor will increase the output voltage.

Brightness is measured as “LUX” unit, which describes how intense a light source that our eyes perceive. LUX meter is the equipment for “LUX” measurement. Light sources with the same LUX level appear at the same brightness to the human eyes.

Figure C1: Configuration of APDS-9008

Selection of the load resistor RL will determine the amount of current-to-voltage conversion in the circuit.

Light source e.g. fluorescent light consists of ac noise fre-quency of about 100Hz. A capacitor of 10uF, which act as a low-pass filter, is recommended to add in parallel with the load resistor to reduce the ripples.

For product information and a complete list of distributors, please go to our web site: https://www.wendangku.net/doc/925263593.html, Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright ? 2005-2008 Avago Technologies Limited. All rights reserved.