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DS-1723AG-02

500mA Low Dropout Linear Regulator

FEATURES

Low Dropout Voltage of 650mV at 500mA Output Current (3V Output Version).

Guaranteed 500mA Output Current.

Maximum Input Voltage is 8V

Low Ground Current at 65μA.

2% Accuracy Output Voltage of 1.5V/1.8V/

2.0V /2.5V /2.7V/

3.0V/ 3.3V/ 3.5V/ 3.7V/ 3.8V/

5.0V/ 5.2V.

Only needs 4.7μF Output Capacitor for Stability.

Current and Thermal Limiting.

APPLICATIONS

CD-ROM Drivers.

LAN Cards.

Microprocessor.

RAM Module.

Wireless Communication Systems.

Battery Powered Systems. DESCRIPTION

The AIC1723A is a 3-pin low dropout linear

regulator. The superior characteristics of the

AIC1723A include zero base current loss,

very low dropout voltage, and 2% accuracy

output voltage. Typical ground current remains approximately 65μA, for loading

ranging from zero to maximum. Dropout

voltage turns substantially low when output

current is 500mA. Built-in output current

limiting and thermal limiting provide maximal

protection to the AIC1723A against fault

conditions.

The AIC1723A is available with popular SOT-

23, SOT-223, SOT-89 and TO-252 packages.

TYPICAL APPLICATION CIRCUIT

Low Dropout Linear Regulator

Example: AIC1723A-18CETR

1.8V Version, in TO-252 Package & Tape & Reel Packing Type

AIC1723A-18PYTR

1.8V Version, in SOT-223 Lead Free Package & Tape & Reel Packing Type

SOT-23 MARKING

Part No. CU PU Part No. CU PU AIC1723A-15XU BT15 BT15P AIC1723A-33XU BT33 BT33P AIC1723A-18XU BT18 BT18P AIC1723A-35XU BT35 BT35P AIC1723A-20XU BT20 BT20P AIC1723A-37XU BT37 BT37P AIC1723A-25XU BT25 BT25P AIC1723A-38XU BT38 BT38P AIC1723A-27XU BT27 BT27P AIC1723A-50XU BT50 BT50P AIC1723A-30XU BT30 BT30P AIC1723A-52XU BT52 BT52P

SOT-89 MARKING

Part No. CX PX GX Part No. CX PX GX

AIC1723A-15XX AV15 AV15P AV15G AIC1723A-33XX AV33 AV33P AV33G

AIC1723A-18XX AV18 AV18P AV18G AIC1723A-35XX AV35 AV35P AV35G

AIC1723A-20XX AV20 AV20P AV20G AIC1723A-37XX AV37 AV37P AV37G

AIC1723A-25XX AV25 AV25P AV25G AIC1723A-38XX AV38 AV38P AV38G

AIC1723A-27XX AV27 AV27P AV27G AIC1723A-50XX AV50 AV50P AV50G

AIC1723A-30XX AV30 AV30P AV30G AIC1723A-52XX AV52 AV52P AV52G

SOT-223 MARKING

Part No. CY PY GY Part No. CY PY GY

AIC1723A-15XY BU15 BU15P BU15G AIC1723A-33XY BU33 BU33P BU33G

AIC1723A-18XY BU18 BU18P BU18G AIC1723A-35XY BU35 BU35P BU35G

AIC1723A-20XY BU20 BU20P BU20G AIC1723A-37XY BU37 BU37P BU37G

AIC1723A-25XY BU25 BU25P BU25G AIC1723A-38XY BU38 BU38P BU38G

AIC1723A-27XY BU27 BU27P BU27G AIC1723A-50XY BU50 BU50P BU50G

AIC1723A-30XY BU30 BU30P BU30G AIC1723A-52XY BU52 BU52P BU52G

ABSOLUTE MAXIMUM RATINGS

Input Supply Voltage ...................................................…………..…….................. -0.3~8V

Operating Temperature Range …………….....………........…………................-40°C~ 85°C

Junction Temperature ……………………………………………………………………... 125°C

Storage Temperature Range ....................……......................………............. -65°C~150°C

Lead Temperature (Soldering. 10sec) …………………………………………………… 260°C

Thermal Resistance Junction to Case SOT-23 Package ...….………..… 130°C/W

...….………..… 12.5°C/W

Package TO-252

...….………..… 30°C/W SOT-89

Package

...….………..… 15°C/W SOT-223

Package Thermal Resistance Junction to Ambient SOT-23 Package ...….………..… 180°C/W

(Assume no Ambient Airflow, no Heatsink) TO-252 Package ...….………..… 100°C/W

...….………..… 160°C/W

Package SOT-89

...….………..… 130°C/W SOT-223

Package Absolute Maximum Rating are those value beyond which the life of a device may be impaired.

TEST CIRCUIT

Refer to the TYPICAL APPLICATION CIRCUIT

ELECTRICAL CHARACTERISTICS (T A=25°C, C IN=1μF, C OUT=4.7μF, unless otherwise specified.) (Note 2)

PARAMETER TEST CONDITIONS MIN.TYP.MAX.UNIT Output Voltage V IN=8V, No Load -2

Line Regulation I L=1mA,

1.8V≤V OUT≤3.2V

3.3V≤V OUT≤5.2V

V IN=4V~8V

V IN=5.5V~8V

Load Regulation (Note 3) I L=0.1~500mA

1.8V≤V OUT≤3.9V

4.0V≤V OUT≤

5.2V

V IN=5V

V IN=7V

Current Limit (Note 4) V IN=7V, V OUT

=0V 500

Dropout Voltage (Note 5) I L=500mA

4.0V≤V OUT≤

5.2V

3.0V≤V OUT≤3.9V

2.5V≤V OUT≤2.9V

2.0V≤V OUT≤2.4V

1.8V≤V OUT≤1.9V

510

650

780

1100

1400

710

850

980

1300

1600

Ground Current I O=0.1mA~I MAX

1.8V≤V OUT≤3.9V

4.0V≤V OUT≤

5.2V

V IN=5~8V

V IN=7~8V

90 μA

Thermal Shutdown

Hysteresis Guaranteed by design 20

Note 1: To avoid output oscillation, aluminum electrolytic output capacitor is recommended and ceramic capacitor is not suggested.

Note 2: Specifications are production tested at T A =25°C. Specifications over the -40°C to 85°C operating temperature range are assured by design, characterization and correlation with Statistical Quality Controls (SQC).

Note 3: Regulation is measured at constant junction temperature, using pulse testing with a low ON time. Note 4: Current limit is measured by pulsing a short time.

Note 5: Dropout voltage is defined as the input to output differential at which the output voltage drops 100mV below the value measured with a 1V differential.

TYPICAL PERFORMANCE CHARACTERISTICS

-40

-20

100

1.60

1.651.701.751.801.851.901.95

2.00

T emperature (°C)

Fig. 1 V OUT vs. T emperature

V O U T (V )

Fig. 2 V OUT vs. Temperature

V O U T (V )

Temperature (°C)

Fig. 3 V OUT vs. Temperature

V O U T (V )

Temperature (

°C)

Fig. 4 V OUT vs. Temperature

V O U T (V )

Temperature (°C)

-40 -20 0 2040 60

56T emperature (°C)

Fig. 5 Ground Current vs. T emperature

Fig. 6 Ground Current vs. Temperature

G r o u n d C u r r e n t (μA )

Temperature (°C)

TYPICAL PERFORMANCE CHARACTERISTICS (Continued)

V IN (V)

Fig. 7 Ground Current vs. V IN

G r o u n d C u r r e n t (u A )

V IN (V)

Fig. 8 Ground Current vs. V IN

Fig. 9 Ground Current vs. V IN

G r o u n d C u r r e n t

(μA )

V IN (V)

102030405060Fig. 10 Ground Current vs. V IN

G r o u n d C u r r e n t (μA )

V IN (V)

0 100 200

300

400

500

I LOAD(mA)

Fig. 11 V DROP vs. I LOAD

V D R O P (m V )

Fig. 12 V DROP vs. I LOAD

V D R O P (m V )

I LOAD (mA)

TYPICAL PERFORMANCE CHARACTERISTICS (Continued)

0Fig. 13 V DROP vs. I LOAD

V D R O P (m V )

I LOAD (mA)

100150200250300350400450Fig. 14 V DROP vs. I LOAD

V D R O P (m V )

I LOAD (mA)

Fig. 15 Current Limit vs. Temperature

C u r r e n t L i m

i t (m A )

Temperature (°C)

BLOCK DIAGRAM

GND

VOUT

VIN

PIN DESCRIPTIONS

VOUT PIN - Output pin.

GND PIN - Power GND.

VIN PIN - Power Supply Input.

APPLICATION INFORMATION

INPUT-OUTPUT CAPACITORS

Linear regulators require input and output capacitors to maintain stability. Input capacitor at 1μF with 4.7uF aluminum electrolytic output capacitor is recommended.

POWER DISSIPATION

The AIC1723A obtains thermal-limiting circuitry, which is designed to protect the device against overload condition. For continuous load condition, maximum rating of junction temperature must not be exceeded. It is important to pay more attention in thermal resistance. It includes junction to case, junction

to ambient. The maximum power dissipation of AIC1723A depends on the thermal resistance of its case and circuit board, the temperature difference between the die junction and ambient air, and the rate of airflow. The rate of temperature rise is greatly affected by the mounting pad configuration on the PCB, the board material, and the ambient temperature. When the IC mounting with good thermal conductivity is used, the junction temperature will be low even when large power dissipation applies.

The power dissipation across the device is

P = I OUT (V IN-V OUT).

The maximum power dissipation is:

max

-J

MAX

Rθ

)

Where T J-max is the maximum allowable junction temperature (125°C), and T A is the ambient temperature suitable in application.

As a general rule, the lower temperature is, the better reliability of the device is. So the PCB mounting pad should provide maximum thermal conductivity to maintain low device temperature. GND pin performs a dual function for providing an electrical connection to ground and channeling heat away. Therefore, connecting the GND pin to ground with a large pad or ground plane would increase the power dissipation and reduce the device temperature.

PHYSICAL DIMENSIONS (unit: mm)

SOT-23

0°

0.900.30

1.50

2.602.800.080.300.05e

L e1c

E1D b A2A10.95 BSC 8°0.601.90 BSC

0.60 REF

1.301.70

3.003.000.220.500.150.95MIN.S

Y M B O L

A 1.45MAX.SOT-23MILLIMETERS

VIEW B

SEE VIEW B

Note:

1.Refer to JEDEC MO-178.

2.Dimension D and E1 do not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side.

3.Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.

TO-252

MILLIMETERS TO-252-3L MAX.2.38A S Y M B O L

MIN.2.190.135.460.610.896.226.73

0.892.67 REF 0.51 BSC

10.411.782.031.022.28 BSC

b b3

E D c H

L L1

L2L4

L3e 0.004.950.460.465.336.35

9.401.40

0.89 --0.640°

8°θ

SEE VIEW B

WITH PLATING

SEATING PLANE

SECTION A-A

GAUGE PLANE

Note:

1.Refer to JEDEC TO-252AA and AB.

2.Dimension D and E do not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side.

3.Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.

SOT-89

Note:

1.Refer to JEDEC TO-243AA.

2.Controlling dimension is millimeter, converted inch dimensions

are not necessarily exact.

SOT-223

Note:

Information provided by AIC is believed to be accurate and reliable. However, we cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in an AIC product; nor for any infringement of patents or other rights of third parties that may result from its use. We reserve the right to change the circuitry and specifications without notice.

Life Support Policy: AIC does not authorize any AIC product for use in life support devices and/or systems. Life support devices or systems are devices or systems which, (I) are intended for surgical implant into the body or (ii) support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user.

SEATING PLANE

GAUGE PLANE Note:

1.Refer to JEDEC TO-261AA.

2.Dimension D and E1 are determined at the outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs, and interlead flash, but including any mismatch between the top and bottom of the plastic body.

3.Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.