EHP-5393-UT31C-P01中文资料
EHP-5393/UT31C-P01 Features
?Popular 10mm package.
?Typical color temperature 6500K
?View angle:25° .
?High light flux output
?Soldering methods: Dip soldering.
?Grouping parameter: total luminous flux, color coordinates.
?Optical efficiency: 30 lm/W
?Thermal resistance (junction to lead): 13K/W
?The product itself will remain within RoHS compliant
version.
?ESD-withstand voltage: up to 4KV
Descriptions
?The series is specially designed for applications
requiring higher brightness.
?EHP-5393 is a revolution, energy efficient and ultra
compact new light source, combining the lifetime and
reliability advantages of Light Emitting Diodes with
the brightness of conventional lighting.
Applications
?Flash
?Sunshine light.
?Advertising Signs.
?Back lighting.
Device Selection Guide
Chip
LED Part No.
Lens Color
Material Emitted Color
EHP-5393/UT31C-P01 InGaN White Water Clear
EHP-5393/UT31C-P01 Package Dimensions
EHP-5393/UT31C-P01 Absolute Maximum Rating (T a=25℃)
Notes: Soldering time≦5 seconds.
Electro-Optical Characteristics (T a=25℃)
Parameter Symbol Min. Typ. Max. Unit Condition Luminous Flux Flux 33 --- 52 lm
Viewing Angle 2θ1/2--- 25 --- deg
Forward Voltage V F 3.0 3.5 4.0 V
I F=350mA
Reverse Current I R--- --- 10 μA V R=5V Zener Reverse Voltage Vz 5.2 --- --- V Iz=5mA Color Temperature CCT 4500 6500 10000 K I F=350mA
x --- 0.29 --- ---
Chromaticity
Coordinates
y --- 0.28 --- --- I F=350mA
Parameter Symbol Absolute Maximum Rating Unit Forward Current I F350 mA Junction to heat-sink thermal
resistance
R th13 K/W Operating Temperature T opr-40 ~ +85 ℃Storage Temperature T stg-40 ~ +100 ℃Electrostatic Discharge ESD 4K V Soldering Temperature T sol260 ℃Power Dissipation P d 1.4 W Reverse Voltage V R 5 V Zener Reverse Current Iz 100 mA
EHP-5393/UT31C-P01
Rank Combination (I F=350mA)
Rank J3 J4 J5 K1 Luminous Flux 33~39 39~45 45~52 52~60
*Measurement Uncertainty of Luminous Intensity: ±15% Unit:mcd
Forward Voltage Combination (V at 350mA)
Rank 1 2 3 4 5 Forward Voltage 3.0~3.2 3.2~3.4 3.4~3.6 3.6~3.8 3.8~4.0
*Measurement Uncertainty of Forward Voltage: ±0.1V Unit:V
EHP-5393/UT31C-P01
Color Combination ( at 350mA)
Y6-1
Y9-1
X Y X Y 0.283 0.284 0.29 0.27 0.274 0.301 0.283 0.284 0.281 0.309 0.289 0.291 0.289 0.291 0.295 0.276 Reference CCT: 9000~10000K
Y6-2
Y9-2
X Y X Y 0.289 0.291 0.295 0.276 0.281 0.309 0.289 0.291 0.29 0.318 0.297 0.3 0.297 0.3 0.302 0.283 Reference CCT: 8000~9000K
X4 X5 X6
X7
X Y X Y X Y X Y 0.301 0.342 0.305 0.322 0.308 0.311 0.308 0.311 0.314 0.355 0.303 0.333 0.305 0.322 0.317 0.32 0.315 0.344 0.315 0.344 0.316 0.333 0.319 0.3 0.303 0.333
0.316 0.333 0.317 0.32
0.311
0.293
Reference CCT: 6300~7000K
Y6-3
Y9-3
X Y X Y 0.308 0.311 0.311 0.293 0.297 0.3 0.302 0.283 0.29 0.318 0.297 0.3 0.303 0.333 0.308 0.311 Reference CCT: 7000~8000K
EHP-5393/UT31C-P01
V4 V5 V6 V7 X Y X Y X Y X Y
0.329 0.357 0.329 0.345 0.329 0.331 0.329 0.331
0.329 0.369 0.329 0.357 0.329 0.345 0.344 0.344
0.348 0.385 0.347 0.372 0.346 0.359 0.343 0.331
0.347 0.372 0.346 0.359 0.344 0.344 0.329 0.32
Reference CCT: 5000~5650K
U4 U5 U6
X Y X Y X Y
0.364 0.383 0.364 0.383 0.362 0.372
0.367 0.4 0.362 0.372 0.36 0.357
0.348 0.385 0.346 0.359 0.344 0.344
0.347 0.372 0.347 0.372 0.346 0.359
Reference CCT: 4500~5000K
CIE Chromaticity Diagram
EHP-5393/UT31C-P01 Typical Electro-Optical Characteristics Curves
EHP-5393/UT31C-P01
Packing Specification Anti-electrostatic bag
EHP-5393/UT31C-P01 Notes
1.Lead Forming
During lead formation, the leads should be bent at a point at least 3mm from the base of the epoxy bulb.
Lead forming should be done before soldering.
Avoid stressing the LED package during leads forming. The stress to the base may damage the LED’s characteristics or it may break the LEDs.
Cut the LED leadframes at room temperature. Cutting the leadframes at high temperatures may cause failure of the LEDs.
When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead position of the LED. If the LEDs are mounted with stress at the leads, it causes deterioration of the epoxy resin and this will degrade the LEDs.
2.Storage
The LEDs should be stored at 30°C or less and 70%RH or less after being shipped from Everlight and the storage life limits are 3 months. If the LEDs are stored for 3 months or more, they can be stored for a year in a sealed container with a nitrogen atmosphere and moisture absorbent material.
Please avoid rapid transitions in ambient temperature, especially, in high humidity environments where condensation can occur.
3.Soldering
Careful attention should be paid during soldering. When soldering, leave more then 3mm from solder joint to epoxy bulb, and soldering beyond the base of the tie bar is recommended.
Recommended soldering conditions:
EHP-5393/UT31C-P01 Avoiding applying any stress to the lead frame while the LEDs are at high temperature particularly when soldering.
Dip and hand soldering should not be done more than one time
After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or vibration until the LEDs return to room temperature.
A rapid-rate process is not recommended for cooling the LEDs down from the peak
temperature.
Although the recommended soldering conditions are specified in the above table, dip or handsoldering at the lowest possible temperature is desirable for the LEDs.
Wave soldering parameter must be set and maintain according to recommended temperature and dwell time in the solder wave.
4.Cleaning
When necessary, cleaning should occur only with isopropyl alcohol at room temperature for a duration of no more than one minute. Dry at room temperature before use.
Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the
assembled condition. Ultrasonic cleaning shall be pre-qualified to ensure this will not
cause damage to the LED
5.Circuit Protection
Below the zener reference voltage Vz, all the current flows through LED and as the voltage rises to Vz, the zener diode “breakdown." If the voltage tries to rise above Vz current flows through the zener branch to keep the voltage at exactly Vz.
When the LED is connected using serial circuit, if either piece of LED is no light up but current can’t flow through causing others to light down. In new design, the LED is parallel with zener diode. if either piece of LED is no light up but current can flow through causing others to light up.
6.Heat Management
Heat management of LEDs must be taken into consideration during the design stage of LED application. The current should be de-rated appropriately by referring to the de-rating curve found in each product specification.
The temperature surrounding the LED in the application should be controlled. Please refer to the data sheet de-rating curve.
If the emitter is operated, consider using metal heat sink with the lowest possible thermal resistance. For the thermal performance using a flat heat sink, allow an exposed surface area of about 25mm2 at least.
7.ESD (Electrostatic Discharge)
Electrostatic discharge (ESD) or surge current (EOS) can damage LEDs.
An ESD wrist strap, ESD shoe strap or antistatic gloves must be worn whenever handling LEDs.
All devices, equipment and machinery must be properly grounded.
Use ion blower to neutralize the static charge which might have built up on surface of the LEDs plastic le ns as a result of friction between LEDs during storage and handing.
EHP-5393/UT31C-P01
8.Other
Above specification may be changed without notice. EVERLIGHT will reserve authority on material change for above specification.
When using this product, please observe the absolute maximum ratings and the instructions for using outlined in these specification sheets. EVERLIGHT assumes no
responsibility for any damage resulting from use of the product which does not comply
with the absolute maximum ratings and the instructions included in these specification
sheets.
These specification sheets include materials protected under copyright of EVERLIGHT corporation. Please don’t reproduce or cause anyone to reproduce them without
EVERLIGHT’s consent.
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