当前位置：文档库 › AMMP-6130-TR2G中文资料

AMMP-6130-TR2G中文资料

AMMP-6130

30 GHz Power Amplifier with Frequency Multiplier (x2)in SMT Package

Data Sheet

Description

Avago Technologies AMMP-6130 is a high gain,narrowband doubler and output power amplifier designed for DBS applications and other commercial communication systems. The MMIC takes an input 15GHz signal and passes it through a harmonic frequency multiplier (x2) and then three stages of power amplification. Integrated matching structures filter and match input/output to 50 ?. It has integrated input and output DC blocking capacitors and bias structures to all stages. The MMIC is fabricated using PHEMT technology. The backside of this package part is both RF and DC ground. This helps simply the assembly process and reduces assembly related performance variations and costs. The surface mount package allows elimination of “chip & wire” assembly for lower cost.This MMIC is a cost effective alternative to hybrid (discrete-FET) amplifiers that require complex tuning and assembly process.

Surface Mount Package, 5.0 x 5.0 x 1.25 mm Pin Connections (Top View)

Features

?5x5 mm Surface Mount Package ?Integrated DC Block and Choke ?50 ? Input and Output Match ?Single Positive Supply Pin ?

No Negative Gate Bias

Specifications (Vd=4.5V, Idd=200mA)

?Frequency Range 15GHz in, 30GHz out ?Output Power: 21 dBm

?Harmonic Suppression: 60dBc ?Single Positive Supply

DC Requirements: 4.5V, 200mA

Applications

?Microwave Radio systems

?Satellite VSAT, DBS Up/Down Link ?Broadband Wireless Access)

Pin Function 1 2V d 3

4RF Out 5 6

8RF In

GND

BASE

Absolute Maximum Ratings (1)

AMMP-6130 RF Specifications (4,5)

TA= 25°C, Vdd = 4.5 V, Idd = 200mA, Zo=50 ?, Pin=5dBm

Typical Distribution of Conversion Gain and Output Power based on 1000 parts

Notes.

4.Small/Large -signal data measured in a fully de-embedded test fixture form TA = 25°C.

5.All tested parameters guaranteed with measurement accuracy +/-1dB/dBm/dBc.

Notes.

1.Operation in excess of any of these conditions may result in permanent damage to this device. The absolute maximum ratings for Vdd, Idd and Pin were determined at an ambient temperature of 25°C unless noted otherwise.

DC Specifications/ Physical Properties (2)

2.Ambient operational temperature TA=25°C unless noted

3.Channel-to-backside Thermal Resistance (Tchannel = 34°C) as measured using infrared microscopy. Thermal Resistance at backside temp. (Tb) = 25°C calculated from measured data.

Conversion Gain at 30GHz

StDev = 0.46

Output Power at 30GHz

StDev = 0.39

Sym Parameters/Condition Unit Max Vdd Drain to Ground Voltage V 5Idd Drain Current

mA 300Pin RF CW Input Power Max dBm 15Tch Max channel temperature C +150Tstg

Storage temperature

C -65 +150Tmax Maximum Assembly Temp

260 for 20s

Sym Parameter and Test Condition Unit Min Typ

Max Idd

Drain Supply Current under any RF power drive and temp.(V d =4.5 V)

200

250

Vd Drain Supply Voltage V 3.5 4.55

θjc

Thermal Resistance (3)

C/W

Symbol Parameters and Test Conditions Frequency

Units Minimum

Maximum

Typical Freq Operational Frequency GHz 30Gain Conversion Gain (4,5)30dB 1418.516Pout Output Power (5)

30dBm 19

23.5

21FS Fundamental Suppression 30dBc 603H Sup

3rd Harmonic Suppression

dBc

468101214161820

Input Frequency [GHz]

C .G .[d B ]

30354045

5560652H -1H [d B m ]

Output Frequency [GHz]

2H [d B m ]

1214161820

24Frequency [GHz]

2H [d B m ]

51015202529

29.5

3030.5

Frequency [GHz]

H [d B m ]

-50

-45-40-35-30-25-20-15-10-51H [d B m ], 3H [d B m ]

04812162024-6

-4

-2

Pin [dBm]

2H [d B m ]

-30

-25-20-15-10-5013

Frequency [GHz]

R e t u r n L o s s [d B ]

1214161820222429

29.5

30.5

Frequency [GHz]

2H [d B m ]

AMMP-6130 Typical Performance

(TA = 25°C, Vdd=4.5V, Idd=200 mA, Zin = Zout = 50?, Pin=3dBm unless otherwise stated)

Figure 1. Conversion Gain & Fundamental Sup vs. Input Freq

Figure 2. Output Power vs. Output Frequency vs. Input Power

Figure 3. Output Power vs. Output Frequency @ 4 bias levels Figure 4. Fundamental, 2H & 3H Output Power vs. Output Freq

Figure 5. Output Power vs. Input Power vs. Input Freq

Figure 6. Input and Output Return Loss vs. Freq

Figure 7. Output Power vs. Output Freq @ Temp = 25C, -40C &85C

Typical Scattering Parameters [1]

(TA = 25°C, Vdd =4.5 V, IDD = 200 mA, Zin = Zout = 50 ?)

Freq S11S21S12S22

GHz dB Mag Phase dB Mag Phase dB Mag Phase dB Mag Phase 1-2.1660.77973.909-80.0000.00032.383-76.4780.00096.570-0.4250.952-101.410 2-2.5310.747-33.368-55.1390.002131.860-64.4370.00114.797-1.7650.816159.979 3-3.4970.669-148.095-47.1310.004 4.147-60.9150.001-81.506-3.2700.68661.101 4-4.8890.57081.765-35.8900.016-149.666-61.9380.001-167.459-6.8910.452-23.500 5-4.7470.579-58.704-39.6590.01014.517-76.4780.000-43.361-5.2590.546-102.375 6-4.1580.620177.213-42.4990.008-90.973-60.0000.001179.115-5.9230.506170.014 7-3.8510.64265.073-40.4910.009125.799-52.2170.00290.638-6.6410.46679.202 8-3.4900.669-47.052-38.2020.012 6.552-50.9030.003-0.484-7.8510.405-19.043 9-2.8580.720-152.082-36.4490.015127.728-51.2130.003-66.346-8.1010.394-114.956 10-2.4050.758115.491-39.4530.011-65.533-50.7520.003-143.716-7.2300.435158.758 11-2.4550.75430.433-36.9240.014-163.279-51.0570.003143.963-6.8480.45578.557 12-3.1510.696-60.545-31.9200.025107.046-51.7010.00370.767-7.7640.409-2.902 13-4.3220.608-169.451-25.7390.052 3.617-53.3510.002-5.502-9.8630.321-100.642 14-4.8340.57373.490-21.1800.087-117.593-56.7730.001-76.081-9.7300.326143.433 15-8.5320.471-34.070-18.5480.118110.391-58.4160.001-115.604-7.3550.42947.561 16-17.0840.140178.992-17.5660.132 6.543-55.1390.002176.951-6.5390.471-30.885 17-4.4910.596-53.423-17.6350.131-135.344-54.8950.002114.486-7.8030.407-107.509 18-3.0440.704-155.503-23.2930.068136.100-55.9180.00253.047-10.6640.293152.353 19-3.3660.679102.797-18.6550.11795.071-55.6500.00210.720-9.2470.3457.160 20-3.0440.704-9.051-9.4500.337-14.777-50.6040.003-48.544-6.2650.486-113.148 21-2.8670.719-108.593-5.9910.502-145.395-48.0680.004-132.798-11.8110.257132.293 22-3.4220.674162.205-4.0280.62982.328-48.2910.004150.079-13.9660.200-67.065 23-4.6950.58263.767-3.3790.678-39.850-47.0330.00477.624-10.8580.287-171.437 24-4.6680.584-51.945-2.0610.789-163.461-49.1190.004-14.763-13.8560.203116.377 25-3.6280.659-154.450-0.8310.90969.328-54.4250.002-91.783-26.3660.04837.539 26-3.9510.635115.995 1.569 1.198-59.027-63.0980.001-133.605-20.5100.094-161.333 27-6.2460.487 5.230 5.448 1.872160.771-54.4250.002-121.717-14.9330.179150.560 28-4.8780.570-139.2628.677 2.7160.554-52.9560.002154.890-13.5800.20994.577 29-2.7040.732123.4388.718 2.728-161.843-51.5350.003104.130-19.1600.110112.029 30-2.2610.77155.2317.537 2.38145.858-44.8830.00633.927-10.1340.32460.389 31-2.4380.755-17.264 4.931 1.764-99.661-40.6770.009-92.384-16.8120.144-33.753 32-4.6790.584-129.407 2.021 1.262124.211-45.3520.005171.824-12.9580.22593.604 33-3.9350.63687.568-2.1730.779-7.487-47.6390.00482.835-7.8550.40528.172 34-2.6250.739-0.364-3.9500.635-121.959-54.4250.00229.124-6.9790.448-23.046 35-2.7810.726-54.324-5.1130.55574.844-51.2130.00324.686-7.9250.402-70.880 36-1.9330.800-110.128-14.6470.185-47.149-50.3140.003-44.356-12.0310.250-120.006 37-2.3890.760-179.000-20.1140.099-142.199-47.4320.004-103.624-24.9670.056-83.063 38-3.6010.66176.661-23.7280.065119.631-45.5140.005170.138-11.5110.266-78.816 39-3.1470.696-52.739-29.7760.03219.317-48.9950.004109.913-8.3940.380-129.674 40-2.5350.747-142.354-37.1090.014-63.508-48.6360.00459.709-8.7930.363175.556 Note:

Data obtained off of a connectorized module

Figure 8. Evaluation / Test Board (Available to qualified customer requests)

Figure 9. Simplified Doubler-Amplifier Schematic

Biasing and Operation

The AMMP-6130 frequency doubler has been designed with a fully integrated self bias network; thus, requiring only a single 4.5v bias input with a typical current draw of 200mA.

The one-stage frequency doubler relies on the non-linear behavior of the FET to produce the doubled signal at the output. A high-pass filter at the input shorts any reflected 2nd harmonic signal to ground.The input also consists of matching components tuned to 15G Hz. An additional LC-filter is included at the input for stability. The doubler is operated at pinch-off to create a half-wave conduction angle ideal for generation of the 2nd harmonic. The AMMP-6130 is

also designed for stability over temperature.

DIMENSIONS ARE IN INCHES [MILIMETERS]ALL GROUNDS MUST BE SOLDERED TO PCB RF Material is Rogers RO4350, 0.010" thick

Figure 10. PCB Land Pattern and Stencil Layouts

Recommended SMT Attachment for 5x5 Package

Seconds

T e m p (C )

The AMMP Packaged Devices are compatible with high volume surface mount PCB assembly processes.The PCB material and mounting pattern, as defined in the data sheet, optimizes RF performance and is strongly recommended. An electronic drawing of the land pattern is available upon request from Avago Sales & Application Engineering.

Manual Assembly

?Follow ESD precautions while handling packages.?Handling should be along the edges with tweezers.?Recommended attachment is conductive solder paste. Please see recommended solder reflow profile. Neither Conductive epoxy or hand soldering is recommended.

?Apply solder paste using a stencil printer or dot placement. The volume of solder paste will be dependent on PCB and component layout and should be controlled to ensure consistent mechanical and electrical performance.

?Follow solder paste and vendor’s recommendations when developing a solder reflow profile. A standard profile will have a steady ramp up from room temperature to the pre-heat temp. to avoid damage due to thermal shock.

?Packages have been qualified to withstand a peak temperature of 260°C for 20 seconds. Verify that the profile will not expose device beyond these limits.

A properly designed solder screen or stencil is required to ensure optimum amount of solder paste is deposited onto the PC

B pads. The recommended stencil layout is shown in Figure 8. The stencil has a solder paste deposition opening approximately 70% to 90% of the PCB pad. Reducing stencil opening can potentially generate more voids underneath. On the other hand,stencil openings larger than 100% will lead to excessive solder paste smear or bridging across the I/O pads.Considering the fact that solder paste thickness will directly affect the quality of the solder joint, a good choice is to use a laser cut stencil composed of 0.127mm (5 mils) thick stainless steel which is capable of producing the required fine stencil outline.The most commonly used solder reflow method is accomplished in a belt furnace using convection heat transfer. The suggested reflow profile for automated reflow processes is shown in Figure 9. This profile is designed to ensure reliable finished joints. However,the profile indicated in Figure 1 will vary among different solder pastes from different manufacturers and is shown here for reference only.

Figure 11. Suggested Lead-Free Reflow Profile for SnAgCu Solder Paste

Package, Tape & Reel, and Ordering Information

Carrier Tape and Pocket Dimensions

Back View

Dimensional Tolerances: 0.002" [0.05mm]

Note: No RF performance degradation is seen due to ESD upto 250 V HBM and 80 V MM. The DC characteristics in general show increased leakage at lower ESD discharge voltages. The user is reminded that this device is ESD sensitive and needs to be handled with all necessary ESD protocols.

Part Number Devices Per Container Container AMMP-6130-BLKG 10Antistatic bag AMMP-6130-TR1G 1007" Reel AMMP-6130-TR2G

500

7" Reel

AMMP-6130 Part Number Ordering Information

For product information and a complete list of distributors, please go to our web site:https://www.wendangku.net/doc/9b14108394.html, Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright ? 2006 Avago Technologies Pte. All rights reserved.

AV01-0287EN - August 2, 2006