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用于铜铝焊接的锡锌焊料研究

用于铜铝焊接的锡锌焊料研究

倪广春;张浩;韩敏

【期刊名称】《电子工艺技术》

【年(卷),期】2013(000)005

【摘要】Lead-free electronic products led the development of lead-free solder technology. Taking cost factors into account, some copper material has been replaced by aluminum material. When ordinary Sn-Cu and Sn-Ag-Cu solder are used in soldering of Cu-Al, there is the electrochemical corrosion problems. So Sn-Zn solder is used for Cu-Al soldering. However, the joints of Sn-Zn solder are brittle and easy to crack. Focus on problems in Cu-Al soldering joint of electrical and electronic devices, put forward Sn-Zn-X alloy soldering materials, did a large number of experiments, and achieved good results.%电子产品无铅化的推广带动了无铅焊料技术的发展,考虑到成本因素,部分铜材已被铝材取代。普通的锡铜系和锡银铜系焊料在铜铝焊接时,存在电化学腐蚀问题,因此多用锡锌焊料进行焊接。但锡锌焊料的焊点脆,存在易开裂的问题。针对电工电子器件铜铝焊接点存在的问题,提出了Sn一Zn一X多元合金焊接材料,并做了大量实验,取得很好的效果。

【总页数】3页(297-298,302)

【关键词】电子器件;铜铝焊接;锡锌多元合金;焊料

【作者】倪广春;张浩;韩敏

【作者单位】金封焊宝有限责任公司,山东枣庄,277800;金封焊宝有限责任公司,

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