HMPS-A92

? Maximum Temperatures

Storage Temperature............................................................................................ -55 ~ +150 °C Junction Temperature.................................................................................... +150 °C Maximum ? Maximum Power Dissipation

Total Power Dissipation (Ta=25°C)................................................................................ 625 mW ? Maximum Voltages and Currents (Ta=25°C)

VCBO Collector to Base Voltage...................................................................................... -300 V VCEO Collector to Emitter Voltage................................................................................... -300 V VEBO Emitter to Base Voltage............................................................................................. -5 V IC Collector Current ...................................................................................................... -500 mA Characteristics (Ta=25°C)

Symbol Min.Typ.Max.Unit Test Conditions

BVCBO-300--V IC=-100uA, IE=0

BVCEO-300--V IC=-1mA, IB=0

BVEBO-5--V IE=-10uA, IC=0

ICBO---100nA VCB=-200V, IE=0

IEBO---100nA VEB=-3V, IC=0

*VCE(sat)---350mV IC=-20mA, IB=-2mA

*VBE(sat)---900mV IC=-20mA, IB=-2mA

*hFE125--IC=-1mA, VCE=-10V

*hFE240--IC=-10mA, VCE=-10V

*hFE340--IC=-30mA, VCE=-10V

*hFE4-100-IC=-80mA, VCE=-10V

fT50--MHz IC=-10mA, VCE=-20V, f=100MHz

Cob--6pF VCB=-20V, f=1MHz, IE=0

*Pulse Test: Pulse Width ≤380us, Duty Cycle≤2% Classification Of hFE2 & V CE(sat)

Rank hFE1hFE2hFE3hFE4VCE(sat)

NS>60>80>80>80<200mV

N>25>40>40-<350mV

Page No. : 2/4 Characteristics Curve

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TO-92 Dimension

*: Typical

Inches Millimeters Inches Millimeters DIM Min.Max.Min.Max.DIM Min.Max.Min.Max.A 0.17040.1902 4.33 4.83G

0.01420.02200.360.56B 0.17040.1902 4.33 4.83H -*0.1000-*2.54

C 0.5000-12.70-I -*0.0500-*1.27

D 0.01420.02200.360.56α1-*5°

-*5°

E -*0.0500

-*1.27

α2-*2°

-*2°

F

0.13230.1480 3.36 3.76

α3

-*2°-*2

°

Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.

2.Controlling dimension: millimeters.

3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.

Material:

? Lead: 42 Alloy; solder plating

? Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0

Important Notice:

? All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.? HSMC reserves the right to make changes to its products without notice.

? HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

? HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.

Head Office And Factory:

? Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454

? Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931