G950T45U中文资料

Features

Output current in excess of 1A Output voltage accuracy +3%/-1% Quiescent current, typically 600μA Internal short circuit current limit Internal over temperature protection

Applications

PC motherboard ADSL/Cable Modem Set-Top-Box LAN switch/Hub Router

General Description

The G950 positive 2.5V voltage regulator features the ability to source 1A of output current. The typical quiescent current is 0.6mA.

Familiar regulator features such as over tempera-ture and over current protection circuits are pro-vided to prevent it from being damaged by ab-normal operating conditions.

Ordering Information

PIN OPTION

ORDER NUMBER

PACKAGE TYPE

1 2 3

G950T45U TO 252 V IN GND V OUT G950T55U TO 263 V IN GND V OUT G950T63U SOT 223 GND V OUT V IN G950T64U SOT 223 GND V IN V OUT G950T65U SOT 223 V IN GND V OUT G950T66U SOT 223 V IN V OUT GND

* For other package types and pin options, please contact us at sales @https://www.wendangku.net/doc/bf9482655.html,

Order Number Identification

Type

Pin Option Type

Part Number

PACKAGE TYPE

PIN OPTION

PACKING

T3 : TO 220 1 2 3

U & D : Tape & Reel Direction

T4 : TO 252 1 : V OUT

GND

V IN T : Tube T5 : TO 263 2 : V OUT

V IN GND T6 : SOT 223 3 : GND V OUT V IN

4 : GND V IN

V OUT 5 : V IN GND

V OUT

6 : V IN

V OUT GND

Typical Application Package Type [Note 4] : Type of C OUT

V OUT 13

TO 220

2123

SOT 223

TO252、263

Input Voltage……………………………………..…..…7V Power Dissipation Internally Limited …. (Note 2) Maximum Junction Temperature…..…………… …..150°C Storage Temperature Range….…..-65°C ≤ T J ≤+150°C Lead Temperature, Time for Wave Soldering

TO 220 Package………………………………260°C, 10s TO 252, TO 263, SOT 223 Package…….…...260°C, 4s Continuous Power Dissipation (T A = + 25°C)

SOT 223(1)……………………….….……….………..0.8W TO 252(1)………..……………….……….….………..1.0W TO 263(1)………..……………….……….….………..1.6W

Note (1): See Recommended Minimum Footprint.

Input Voltage…………………………………….3.3V~6V Temperature Range……………………0°C ≤ T J ≤125°C

Electrical Characteristics

V IN =5V, I O = 1A, C IN = 1μF, C OUT =10 μF, All specifications apply for T A = T J = 25°C. [Note 3]

PARAMETER CONDITIONS MIN TYP MAX UNITS

V IN = 5V, 10mA < I O < 1A

Output Voltage

V IN = 3.3V, 10mA < I O < 500mA

2.475 2.50 2.575 V Line Regulation

3.3V < V IN < 6V, I O = 10mA

3 30 mV

V IN = 5V, 10mA < I O < 1A

35 50 mV Load Regulation V IN = 3.3V, 10mA < I O <

500mA 25 mV Output Impedance 200mA DC and 100mA AC, fo = 120Hz 80 m ?

Quiescent Current V IN =

5V 0.6 mA Ripple Rejection f i = 120Hz,V ripple =2V P-P , Io = 100mA

46 dB I O = 1A

1.15 V I O = 500mA

420 mV Dropout Voltage I O = 100mA

200 mV Short Circuit Current 1.6 A Over Temperature 150 °C

Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating

Conditions are conditions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications and test conditions see the Electrical Characteristics.

Note 2: The maximum power dissipation is a function of the maximum junction temperature, T Jmax ; total thermal re-sistance, θJA , and ambient temperature T A . The maximum allowable power dissipation at any ambient tem-perature is T jmax -T A / θJA . If this dissipation is exceeded, the die temperature will rise above 150°C and IC

will go into thermal shutdown. For the G950 in SOT 223 package, θJA is 156°C/W; in TO 263 package, θJA is 75°C/W, and in the TO 252 package, θJA is 125°C/W (See recommend minimum footprint). The safe operation in SOT 223,TO 252 & TO 263 package, it can see “Typical Performance Characteristics” (Safe Operating Area).

Note3: Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible. Note4: The type of output capacitor should be tantalum or aluminum.

Definitions

Dropout Voltage

The input/output Voltage differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 100mV below its nominal value. Dropout voltage is affected by junction temperature, load cur-rent and minimum input supply requirements.

Line Regulation

The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that average chip temperature is not significantly af-fected.

Load Regulation

The change in output voltage for a change in load current at constant chip temperature. The measure-ment is made under conditions of low dissipation or by using pulse techniques such that average chip tem-perature is not significantly affected.

Maximum Power Dissipation

The maximum total device dissipation for which the regulator will operate within specifications.

Quiescent Bias Current

Current which is used to operate the regulator chip and is not delivered to the load.

(V IN = +5V, C IN =1μF, C OUT =10μF, T A =25°C, unless otherwise noted.)

Line Transient

Load Transient

Ch1: Vin (offset=5.0V)Ch2: Vout (offset=2.50V)CIN = 1uF Iout=100mA

Ch1: Iout (1A/div)

Ch2: Vout (offset=2.50V)

(V IN = +3.3V, C IN =1μF, C OUT =10μF, T A =25°C, unless otherwise noted.)

Output Voltage vs. Load Current

2.5152.5202.5252.5302.5352.5402.545

2.550

Line Transient

Load Transient

Ch1: Vin (offset=3.3V)Ch2: Vout (offset=2.50V)CIN = 1uF Iout=100mA

Ch1: Iout (400mA/div)Ch2: Vout is AC coupled

Note: V IN (max) <= 6.5V

Safe Operating Area of SOT-223

Safe Operating Area of TO-252

Power Dissipation of SOT-223

Recommend Minimum Footprint

TO-220 (T3) Package

MILLIMETERS INCHES SYMBOLS

MIN MAX MIN MAX

A 4.318 4.826 0.170 0.190 A1 2.46 2.72 0.097 0.107 b 0.69 0.94 0.027 0.037 b1 1.143 1.397 0.045 0.055 C 0.304 0.460 0.012 0.018 D 3.429 3.683 0.135 0.145 D1 8.53 9.04 0.336

0.356 d 2.62 2.87 0.103 0.113 E 9.906 10.40 0.390 0.410 E1 2.84 5.13 0.112 0.202 e 2.29 2.79 0.090 0.110 e1 4.83 5.33 0.190 0.210 F 1.143 1.397 0.045 0.055 I 3.454 3.962 0.136 0.156 L 13.589 14.351 0.535 0.565

TO-252 (T4) Package

Notes:

1. Dimensioning and tolerancing per ansi y14.5m, 198

2. 2. Controlling dimension : inch

INCHES MILLIMETERS

DIM

MIN MAX MIN MAX

A 0.235 0.250 5.97 6.35

B 0.250 0.265 6.35 6.73

C 0.086 0.094 2.19 2.38

D 0.027 0.035 0.69 0.88

E 0.033 0.040 0.84 1.01

F 0.037 0.047 0.94 1.19

G 0.180BSC

4.58BSC H 0.034 0.040 0.87 1.01 J 0.018 0.023 0.46 0.58

K 0.102 0.114 2.60 2.89 L 0.090BSC 2.29BSC R 0.175 0.215 4.45 6.46 S 0.020 0.050 0.51 1.27 U 0.020 --- 0.51 --- V 0.030 0.050 0.77 1.27 Z 0.138 --- 3.51 ---

SEATING PLANE

TO-263 (T5) Package

MILLIMETERS INCHES SYMBOLS

MIN MAX MIN MAX

0.185

A 4.30 4.70 0.169

A1 1.22 1.32 0.048 0.055 A2 2.45 2.69 0.104 0.106

b 0.69 0.94 0.027

0.037

b1 1.22 1.40 0.048 0.055

C 0.36 0.56 0.014

0.022

0.380

0.340

D 8.64 9.652

0.415

0.382

E 9.70 10.54

e 2.29 2.79 0.090

0.110

e1 4.83 5.33 0.190 0.210

H 14.60 15.78 0.575 0.625

L 4.70 5.84 0.185

0.230

L1 1.20 1.778 0.047 0.070 L2 2.24 2.84 0.088 0.111 L3 1.40MAX 0.055MAX

GMT Inc. does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications.

S O T 223 P a c k a g e O rie n ta tio n

T O 252、263 P a c k a g e O rie n ta tio n