PKFC24C中文资料

PKFC3.3C*

thru

PKFC36C*

P ACKAGED FLIP CHIP ARRA Y

Only One Name Means ProT

ek’Tion?

APPLICA TIONS ? Cellular Phones

? MCM Boards

? Wireless Communication Circuits ? IR LEDs

? SMART & PCMCIA Cards

IEC COMP A TIBILITY (EN61000-4)? 61000-4-2 (ESD): Air - 15kV , Contact - 8kV ? 61000-4-4 (EFT): 40A - 5/50ns FEA TURES

? CHIP SCALE PACKAGE 0.050” (1.270mm) x 0.030” (0.762mm)? ESD Protection > 25 kilovolts

? Available in Multiple Voltage Types Ranging From 3.3V to 36V ? 250 Watts Peak Pulse Power per Line (tp = 8/20μs)? Bidirectional Configuration & Monolithic Structure ? Protects 1 Line

? RoHS Compliant in Lead-Free Versions

MECHANICAL CHARACTERISTICS ? Encapsulated 0502 Chip

? Weight 0.73 milligrams (Approximate)

? Available in Tin-Lead or Lead-Free Pure-Tin Plating(Annealed)? Solder Reflow T emperature:

Tin-Lead - Sn/Pb, 85/15: 240-245°C Pure-Tin - Sn, 100: 260-270°C

? Flammability Rating UL 94V-0

? 8mm Plastic & Paper Tape and Reel Per EIA Standard 481? Device Marking On Reel

05180

PIN CONFIGURA

TION

DEVICE CHARACTERISTICS

MAXIMUM RATINGS @ 25°C Unless Otherwise Specified

Operating T emperature SYMBOL VALUE -55°C to 150°C

°C

°C -55°C to 150°C UNITS T J T STG

PARAMETER

Storage T emperature

Peak Pulse Power (t p = 8/20μs) - See Figure 1P PP 250Watts 0 5 10 15 20 25 30

t - Time - μs

20406080100120I P P - P e a k P u l s e C u r r e n t - % o f I

P P

FIGURE 2

0.01 1 10 100 1,000 10,000

t d - Pulse Duration - μs

10

100

1,000

10,000

P P P - P e a

k P u l s e C u r r e n t - W a t t s

FIGURE 1

PEAK PULSE POWER VS PULSE TIME

ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified

PART NUMBER (See Note 1)

MINIMUM BREAKDOWN VOLTAGE

@ 1mA V (BR)VOLTS MAXIMUM CLAMPING VOLTAGE (See Fig. 2)@ I P = 1A

V C VOLTS MAXIMUM CLAMPING VOLTAGE (See Fig. 2)

@8/20μs V C @ I PP TYPICAL CAPACITANCE

@0V , 1 MHz

C pF

PKFC3.3C PKFC05C PKFC08C PKFC12C PKFC15C PKFC24C PKFC36C

3.35.08.012.015.02

4.036.0

4.06.08.513.316.726.740.0

7.09.813.419.024.043.064.0

12.5V @ 20A 14.7V @ 17A 19.2V @ 13A 29.7V @ 9.0A 35.7V @ 7.0A 55.0V @ 5.0A 84.0V @ 3.0A

1501007550403025

MAXIMUM LEAKAGE CURRENT (See Note 2)

@V WM

I D μA 75*10**10***1111

RATED ST AND-OFF VOLTAGE

V WM VOLTS

Note 1: All devices are bidirectional. Electrical characteristics apply in both directions.

Note 2: *T ypical leakage current < 5μA @ 2.8V. **Typical leakage current <500nA @ 3.3V . ***Typical leakage current <200nA @ 5V.

GRAPHS

T L - Lead Temperature - °C

20

406080100% O f R a t e d P o w e r

FIGURE 3

ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape)

FIGURE 4

OVERSHOOT & CLAMPING VOLTAGE FOR PKFC05C

5 V o l t s p e r D i v i s i o n

-5

5

15

25

35

0 5 10 15 20

V C - C l a m p i n g V o l t a g e - V o l t s

481214FIGURE 5

TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR PKFC05C

1062I PP - Peak Pulse Current - Amps

APPLICA TION INFORMA

TION

T T e m p e r a t u r e - °C

T 0.275mm Round

Non-Solder Mask Defined Pads 0.325mm Round 0.150mm

0.330mm Round No Clean

OSP(Entek Cu Plus 106A)±50μm ±20μm

60 Seconds 270°C

Pad Size on PCB

Pad Shape Pad Definition

Solder Mask Opening Solder Stencil Thickness

Solder Stencil Aperture Opening (laser cut, 5% tapered walls)Solder Paste Type Pad Protective Finish

Tolerance - Edge To Corner Ball Solder Ball Side Coplanarity

Maximum Dwell Time Above Liquidous (183°C)Soldering Maximum Temperature

PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER

VALUE

REQUIREMENTS

Temperature:

T P for Lead-Free (SnAgCu): 260-265°C T P for Tin-Lead: 240-245°C

Preheat time and temperature depends on solder paste and flux activation temperature, component size, weight, surface area &plating.

RECOMMENDED NON-SOLDER MASK

DEFINED PAD ILLUSTRATION

Solder Mask Opening

0.325mm DIA.

Solder Stencil Opening

0.330mm DIA.

P ACKAGE OUTLINE & DIMENSIONS

COPYRIGHT ? ProTek Devices 2005

SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC).

DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer’s and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products.ProTek Devices

2929 South Fair Lane, T empe, AZ 85282 Tel: 602-431-8101 Fax: 602-431-2288

E-Mail: sales@https://www.wendangku.net/doc/b99613072.html,

Web Site: https://www.wendangku.net/doc/b99613072.html,